SG11201503149UA - Pressure-less ozonated di -water (di03) recirculation reclaim system and method - Google Patents

Pressure-less ozonated di -water (di03) recirculation reclaim system and method

Info

Publication number
SG11201503149UA
SG11201503149UA SG11201503149UA SG11201503149UA SG11201503149UA SG 11201503149U A SG11201503149U A SG 11201503149UA SG 11201503149U A SG11201503149U A SG 11201503149UA SG 11201503149U A SG11201503149U A SG 11201503149UA SG 11201503149U A SG11201503149U A SG 11201503149UA
Authority
SG
Singapore
Prior art keywords
ozonated
recirculation
pressure
water
less
Prior art date
Application number
SG11201503149UA
Other languages
English (en)
Inventor
Johannes Heinrich Seiwert
Ulrich Alfred Brammer
Martin Blacha
Gerhard Joachim Schnaiter
Original Assignee
Mks Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mks Instr Inc filed Critical Mks Instr Inc
Publication of SG11201503149UA publication Critical patent/SG11201503149UA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/20Treatment of water, waste water, or sewage by degassing, i.e. liberation of dissolved gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D19/00Degasification of liquids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D19/00Degasification of liquids
    • B01D19/0063Regulation, control including valves and floats
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D19/00Degasification of liquids
    • B01D19/0068General arrangements, e.g. flowsheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D19/00Degasification of liquids
    • B01D19/0073Degasification of liquids by a method not covered by groups B01D19/0005 - B01D19/0042
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/72Treatment of water, waste water, or sewage by oxidation
    • C02F1/78Treatment of water, waste water, or sewage by oxidation with ozone
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/423Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/02Temperature
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/23O3
    • C02F2209/235O3 in the gas phase
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/38Gas flow rate
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2301/00General aspects of water treatment
    • C02F2301/04Flow arrangements
    • C02F2301/046Recirculation with an external loop
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/0318Processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/85978With pump
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/87249Multiple inlet with multiple outlet

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Organic Chemistry (AREA)
  • Water Supply & Treatment (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Water Treatments (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)
  • Treating Waste Gases (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
SG11201503149UA 2012-11-08 2013-11-04 Pressure-less ozonated di -water (di03) recirculation reclaim system and method SG11201503149UA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261724006P 2012-11-08 2012-11-08
US13/836,842 US9056262B2 (en) 2012-11-08 2013-03-15 Pressure-less ozonated Di-water (DIO3) recirculation reclaim system
PCT/US2013/068304 WO2014074455A1 (en) 2012-11-08 2013-11-04 Pressure-less ozonated d i -water (di03) recirculation reclaim system and method

Publications (1)

Publication Number Publication Date
SG11201503149UA true SG11201503149UA (en) 2015-06-29

Family

ID=50621237

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201703768VA SG10201703768VA (en) 2012-11-08 2013-11-04 Pressure-less ozonated di -water (dio3) recirculation reclaim system and method
SG11201503149UA SG11201503149UA (en) 2012-11-08 2013-11-04 Pressure-less ozonated di -water (di03) recirculation reclaim system and method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201703768VA SG10201703768VA (en) 2012-11-08 2013-11-04 Pressure-less ozonated di -water (dio3) recirculation reclaim system and method

Country Status (9)

Country Link
US (3) US9056262B2 (ja)
EP (2) EP2917152B1 (ja)
JP (2) JP6092413B2 (ja)
KR (2) KR101821314B1 (ja)
CN (1) CN106395954B (ja)
IL (3) IL238427A (ja)
SG (2) SG10201703768VA (ja)
TW (2) TWI587902B (ja)
WO (1) WO2014074455A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2014233069A1 (en) * 2013-03-15 2015-09-24 Nantbioscience, Inc. Substituted indol-5-ol derivatives and their therapeutic applications
US20180235110A1 (en) * 2017-02-16 2018-08-16 Lam Research Corporation Cooling system for rf power electronics
GB2564662B (en) * 2017-07-18 2022-01-12 Olof Sonander Sven Vacuum and Degassing System
CN112601720A (zh) * 2018-08-29 2021-04-02 Mks仪器公司 臭氧水输送系统及其使用方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0564706A (ja) * 1991-09-06 1993-03-19 Ngk Insulators Ltd 脱酸素水の製造装置
JP4347426B2 (ja) 1996-09-26 2009-10-21 芝浦メカトロニクス株式会社 洗浄処理装置
US7163588B2 (en) 1997-05-09 2007-01-16 Semitool, Inc. Processing a workpiece using water, a base, and ozone
DE19825063A1 (de) 1998-06-04 1999-12-09 Astex Sorbios Gmbh Verfahren zur Unterdrückung der Zerfallsgeschwindigkeit von Ozon in ultrareinem Wasser
US6805791B2 (en) 2000-09-01 2004-10-19 Applied Science And Technology, Inc. Ozonated water flow and concentration control apparatus
JP2003142445A (ja) * 2001-11-08 2003-05-16 Mitsubishi Electric Corp 洗浄装置及び洗浄方法
US6649018B2 (en) 2002-01-17 2003-11-18 Akrion, Llc System for removal of photoresist using sparger
US20030139057A1 (en) * 2002-01-18 2003-07-24 Richard Novak Process and apparatus for removal of photoresist from semiconductor wafers
US20040154641A1 (en) 2002-05-17 2004-08-12 P.C.T. Systems, Inc. Substrate processing apparatus and method
WO2006010109A2 (en) * 2004-07-08 2006-01-26 Akrion Technologies, Inc. Method and apparatus for creating ozonated process solutions having high ozone concentration
KR101255873B1 (ko) * 2005-07-07 2013-04-17 엠케이에스 인스트루먼츠, 인코포레이티드 멀티 챔버 툴을 위한 오존 시스템
KR100626869B1 (ko) * 2005-09-07 2006-09-20 주식회사 실트론 반도체 웨이퍼 세정 시스템
JP2007098244A (ja) * 2005-10-03 2007-04-19 Nippon Rensui Co Ltd オゾン含有排水の再利用方法
JP2007111618A (ja) * 2005-10-19 2007-05-10 Pre-Tech Co Ltd オゾン水分解装置
CN1820824A (zh) * 2006-01-20 2006-08-23 徐名勇 一种臭氧尾气处理装置
JP2007326101A (ja) 2006-03-20 2007-12-20 Eiji Matsumura オゾン水処理方法
JP2008006332A (ja) * 2006-06-27 2008-01-17 Kurita Water Ind Ltd 特定ガス溶解水の製造方法、製造装置及び特定ガス溶解水の循環方法
JP4920751B2 (ja) * 2006-10-17 2012-04-18 エム ケー エス インストルメンツ インコーポレーテッド 脱イオン水を炭酸化する装置、システム及び方法
JP2008311591A (ja) * 2007-06-18 2008-12-25 Sharp Corp 基板処理装置および基板処理方法
JP2007275893A (ja) 2007-06-20 2007-10-25 Eiji Matsumura 気体混合液生成方法及び気体混合液
JP2009297588A (ja) * 2008-06-10 2009-12-24 Nomura Micro Sci Co Ltd 加熱オゾン水の製造方法
JP5779321B2 (ja) * 2010-06-18 2015-09-16 シャープ株式会社 高濃度オゾン水の製造方法及び高濃度オゾン水の製造装置
JP2012119491A (ja) * 2010-11-30 2012-06-21 Sharp Corp フォトレジストの除去方法
JP6251040B2 (ja) * 2011-03-15 2017-12-27 エムケイエス インストゥルメンツ, インコーポレイテッド 液体から溶解ガスを選択的に除去するためのシステムおよび方法

Also Published As

Publication number Publication date
US9796603B2 (en) 2017-10-24
EP2917152A1 (en) 2015-09-16
JP6348619B2 (ja) 2018-06-27
US20140124036A1 (en) 2014-05-08
KR101821314B1 (ko) 2018-03-08
WO2014074455A1 (en) 2014-05-15
JP6092413B2 (ja) 2017-03-08
US9056262B2 (en) 2015-06-16
TW201438802A (zh) 2014-10-16
US9597613B2 (en) 2017-03-21
EP3348520A1 (en) 2018-07-18
KR101699480B1 (ko) 2017-01-24
US20170144894A1 (en) 2017-05-25
IL238427A0 (en) 2015-06-30
JP2017121628A (ja) 2017-07-13
TWI587902B (zh) 2017-06-21
IL253747A0 (en) 2017-09-28
IL261762A (en) 2018-10-31
EP2917152B1 (en) 2018-02-21
CN106395954B (zh) 2019-09-03
US20150315037A1 (en) 2015-11-05
KR20150081353A (ko) 2015-07-13
TWI587900B (zh) 2017-06-21
IL261762B (en) 2019-03-31
KR20170005902A (ko) 2017-01-16
CN104903245A (zh) 2015-09-09
IL238427A (en) 2017-08-31
JP2016503340A (ja) 2016-02-04
SG10201703768VA (en) 2017-06-29
CN106395954A (zh) 2017-02-15
TW201706029A (zh) 2017-02-16

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