SG11201501005YA - Vibrating device and manufacturing method therefor - Google Patents

Vibrating device and manufacturing method therefor

Info

Publication number
SG11201501005YA
SG11201501005YA SG11201501005YA SG11201501005YA SG11201501005YA SG 11201501005Y A SG11201501005Y A SG 11201501005YA SG 11201501005Y A SG11201501005Y A SG 11201501005YA SG 11201501005Y A SG11201501005Y A SG 11201501005YA SG 11201501005Y A SG11201501005Y A SG 11201501005YA
Authority
SG
Singapore
Prior art keywords
manufacturing
method therefor
vibrating device
vibrating
therefor
Prior art date
Application number
SG11201501005YA
Other languages
English (en)
Inventor
Keiichi Umeda
Takehiko Kishi
Toshio Nishimura
Takashi Hase
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of SG11201501005YA publication Critical patent/SG11201501005YA/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02433—Means for compensation or elimination of undesired effects
    • H03H9/02448—Means for compensation or elimination of undesired effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2478—Single-Ended Tuning Fork resonators
    • H03H9/2489—Single-Ended Tuning Fork resonators with more than two fork tines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
SG11201501005YA 2012-09-13 2013-08-30 Vibrating device and manufacturing method therefor SG11201501005YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012201878 2012-09-13
PCT/JP2013/073323 WO2014042020A2 (fr) 2012-09-13 2013-08-30 Dispositif oscillant et procédé de fabrication correspondant

Publications (1)

Publication Number Publication Date
SG11201501005YA true SG11201501005YA (en) 2015-05-28

Family

ID=50278804

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201501005YA SG11201501005YA (en) 2012-09-13 2013-08-30 Vibrating device and manufacturing method therefor

Country Status (4)

Country Link
US (1) US9553561B2 (fr)
JP (1) JP6003994B2 (fr)
SG (1) SG11201501005YA (fr)
WO (1) WO2014042020A2 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6245265B2 (ja) * 2013-09-20 2017-12-13 株式会社村田製作所 振動装置及びその製造方法
US9705470B1 (en) * 2014-02-09 2017-07-11 Sitime Corporation Temperature-engineered MEMS resonator
JP6331702B2 (ja) * 2014-05-29 2018-05-30 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
WO2016051025A1 (fr) * 2014-10-03 2016-04-07 Teknologian Tutkimuskeskus Vtt Oy Résonateur à plaque de compensation thermique
CN107005223B (zh) * 2014-10-03 2021-06-04 芬兰国家技术研究中心股份公司 温度补偿梁谐振器
WO2016098868A1 (fr) * 2014-12-17 2016-06-23 株式会社村田製作所 Vibreur piézoélectrique et dispositif piézoélectrique vibrant
CN108093679B (zh) * 2015-06-19 2022-03-04 芯时光公司 微机电谐振器
JP6628212B2 (ja) * 2015-11-24 2020-01-08 株式会社村田製作所 共振装置及びその製造方法
CN109075766B (zh) * 2016-05-25 2022-04-19 株式会社村田制作所 谐振器和谐振装置
US10676349B1 (en) 2016-08-12 2020-06-09 Sitime Corporation MEMS resonator
CN110663176A (zh) * 2017-05-25 2020-01-07 株式会社村田制作所 谐振器以及谐振装置
KR102452948B1 (ko) * 2017-07-18 2022-10-11 삼성전자주식회사 미소 기계식 공진기 및 이를 포함하는 공진기 시스템
JP6528878B2 (ja) * 2018-03-22 2019-06-12 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
JP2021005783A (ja) * 2019-06-26 2021-01-14 セイコーエプソン株式会社 振動片、電子機器、および移動体
FI129591B (en) * 2020-11-06 2022-05-13 Kyocera Tikitin Oy MEMS RESONATOR WITH HIGH QUALITY AND ITS USE
JP2022086056A (ja) * 2020-11-30 2022-06-09 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動片、圧電振動子、発振器、および圧電振動片の製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4358745A (en) 1981-03-16 1982-11-09 International Business Machines Corporation Semiconductor surface acoustic wave device
US4459394A (en) 1981-12-30 1984-07-10 The Standard Oil Company Preparation of nylon polyamide with cobalt salt
JP3512968B2 (ja) * 1996-04-11 2004-03-31 株式会社日本自動車部品総合研究所 半導体装置の製造方法
JP4404218B2 (ja) 2006-03-29 2010-01-27 セイコーエプソン株式会社 音叉振動子およびその製造方法
CH700716B1 (fr) * 2006-10-09 2010-10-15 Suisse Electronique Microtech Résonateur en silicium de type diapason.
US7673512B2 (en) * 2006-10-30 2010-03-09 Sony Corporation Angular velocity sensor and electronic device
JP2009264886A (ja) * 2008-04-24 2009-11-12 Alps Electric Co Ltd ジャイロセンサ素子及びその製造方法
EP2347506B1 (fr) 2008-10-14 2013-01-09 Nxp B.V. Résonateur piézorésistif mems en forme de cadre
US8354332B2 (en) 2008-11-26 2013-01-15 Georgia Tech Research Corporation Methods of forming micro-electromichanical resonators having boron-doped resonator bodies containing eutectic alloys
US8061013B2 (en) 2008-11-26 2011-11-22 Georgia Tech Research Corporation Micro-electromechanical resonators having electrically-trimmed resonator bodies therein and methods of fabricating same using joule heating
JP2012105044A (ja) * 2010-11-10 2012-05-31 Seiko Epson Corp 振動デバイスおよび電子機器
FI126586B (fi) * 2011-02-17 2017-02-28 Teknologian Tutkimuskeskus Vtt Oy Uudet mikromekaaniset laitteet
JP5974629B2 (ja) * 2012-05-23 2016-08-23 セイコーエプソン株式会社 振動片、振動片の製造方法、角速度センサー、電子機器、移動体
JP6292229B2 (ja) * 2013-05-13 2018-03-14 株式会社村田製作所 振動装置
JP6094671B2 (ja) * 2013-05-13 2017-03-15 株式会社村田製作所 振動装置
SG11201508861WA (en) * 2013-05-13 2015-11-27 Murata Manufacturing Co Vibrating device
JP6482169B2 (ja) * 2013-07-19 2019-03-13 セイコーエプソン株式会社 振動片、振動子、発振器、電子機器及び移動体
JP6132022B2 (ja) * 2013-08-21 2017-05-24 株式会社村田製作所 圧電共振子及びその製造方法
JP6245265B2 (ja) * 2013-09-20 2017-12-13 株式会社村田製作所 振動装置及びその製造方法
CN105874710B (zh) * 2014-01-24 2018-09-18 株式会社村田制作所 压电振子以及压电振动装置

Also Published As

Publication number Publication date
US9553561B2 (en) 2017-01-24
WO2014042020A2 (fr) 2014-03-20
US20150180449A1 (en) 2015-06-25
WO2014042020A3 (fr) 2014-05-08
JPWO2014042020A1 (ja) 2016-08-18
JP6003994B2 (ja) 2016-10-05

Similar Documents

Publication Publication Date Title
HK1205921A1 (en) Excreta-handling device and method therefor
SG11201501005YA (en) Vibrating device and manufacturing method therefor
PL2696754T3 (pl) Urządzenie i sposób pomiaru stresu
EP2615533A4 (fr) Procédé et dispositif d'interaction
HK1201695A1 (en) Noodle-steaming method and noodle-steaming device
GB201906245D0 (en) A method and device
EP2672606A4 (fr) Dispositif de commande de charge et procédé de commande de charge
EP2700357A4 (fr) Dispositif et procédé de mesure de concentration
PL2885200T3 (pl) Urządzenie oraz sposób mechanicznego pozycjonowania
EP2899766A4 (fr) Dispositif piézoélectrique et procédé d'utilisation de celui-ci
EP2879164A4 (fr) Dispositif et procédé de découpage en dés
EP2908116A4 (fr) Dispositif de sélection et méthode de sélection
EP2806084A4 (fr) Dispositif de formage et procédé de construction utilisant le dispositif de formage
EP2755363A4 (fr) Procédé et dispositif de distribution rapide de données
HK1207461A1 (en) Graph-drawing device and graph-drawing method
IL230667A0 (en) Lithography device and device manufacturing method
GB201101862D0 (en) Method and device
EP2837436A4 (fr) Dispositif et procédé de production de composant presentant une structure a section transversale fermee
EP2902104A4 (fr) Dispositif fonctionnel et procédé de fabrication de dispositif fonctionnel
EP2804539A4 (fr) Dispositif et procédé d'acquisition de tissu
PT2872443T (pt) Dispositivo e método para produzir fosgénio
GB201222362D0 (en) Device and method
SG2012075792A (en) An improved device and method
PL2691230T3 (pl) Urządzenie bigujące i odpowiadający sposób
EP2894848A4 (fr) Procédé et dispositif pour l'obtention de paramètres de configuration