SG11201406561XA - Test probe assembly and related methods - Google Patents

Test probe assembly and related methods

Info

Publication number
SG11201406561XA
SG11201406561XA SG11201406561XA SG11201406561XA SG11201406561XA SG 11201406561X A SG11201406561X A SG 11201406561XA SG 11201406561X A SG11201406561X A SG 11201406561XA SG 11201406561X A SG11201406561X A SG 11201406561XA SG 11201406561X A SG11201406561X A SG 11201406561XA
Authority
SG
Singapore
Prior art keywords
probe assembly
related methods
test probe
test
methods
Prior art date
Application number
SG11201406561XA
Other languages
English (en)
Inventor
Valts Treibergs
Aaron Magnuson
Sergey Yakushev
Scott Hanson
Original Assignee
Capital Formation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capital Formation Inc filed Critical Capital Formation Inc
Publication of SG11201406561XA publication Critical patent/SG11201406561XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49119—Brush

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201406561XA 2012-04-13 2013-03-14 Test probe assembly and related methods SG11201406561XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261624083P 2012-04-13 2012-04-13
PCT/US2013/031240 WO2013154738A1 (en) 2012-04-13 2013-03-14 Test probe assembly and related methods

Publications (1)

Publication Number Publication Date
SG11201406561XA true SG11201406561XA (en) 2014-11-27

Family

ID=48045061

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201406561XA SG11201406561XA (en) 2012-04-13 2013-03-14 Test probe assembly and related methods

Country Status (7)

Country Link
US (1) US9829506B2 (https=)
EP (1) EP2836847B1 (https=)
JP (1) JP6230595B2 (https=)
MY (1) MY176424A (https=)
PT (1) PT2836847T (https=)
SG (1) SG11201406561XA (https=)
WO (1) WO2013154738A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573332B (zh) * 2014-07-23 2017-03-01 鴻騰精密科技股份有限公司 電連接器及其端子
US20180095110A1 (en) * 2016-09-30 2018-04-05 Xcerra Corporation Compact testing system
JP6432017B2 (ja) * 2016-11-30 2018-12-05 日本電産リード株式会社 接触端子、検査治具、及び検査装置
USD869305S1 (en) * 2017-02-10 2019-12-10 Kabushiki Kaisha Nihon Micronics Probe pin
JP1592871S (https=) * 2017-02-10 2017-12-11
JP1623279S (https=) * 2018-02-02 2019-01-28
JP1623280S (https=) * 2018-02-02 2019-01-28
JP1622969S (https=) * 2018-02-02 2019-01-28
JP1622970S (https=) * 2018-02-02 2019-01-28
JP1622968S (https=) * 2018-02-02 2019-01-28
JP1626667S (https=) * 2018-02-02 2019-03-18
USD873161S1 (en) * 2018-02-02 2020-01-21 Kabushiki Kaisha Nihon Micronics Electric contact
JP1626668S (https=) * 2018-02-02 2019-03-18
CN113728238A (zh) * 2019-04-23 2021-11-30 株式会社友华 接触探针
CN113009196B (zh) * 2021-03-02 2022-03-18 上海捷策创电子科技有限公司 一种芯片测试用探针和芯片测试装置
US11387587B1 (en) * 2021-03-13 2022-07-12 Plastronics Socket Partners, Ltd. Self-retained slider contact pin
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly
USD1015282S1 (en) * 2022-02-01 2024-02-20 Johnstech International Corporation Spring pin tip
WO2023150615A2 (en) 2022-02-07 2023-08-10 Johnstech International Corporation Spring probe assembly for a kelvin testing system
TWI840266B (zh) * 2022-07-01 2024-04-21 南韓商二成電子有限公司 接觸針及包含該接觸針的測試用插座
CN115184652B (zh) * 2022-07-06 2024-07-09 渭南木王智能科技股份有限公司 一种细长稳流测试探针
CN118091212A (zh) * 2022-11-28 2024-05-28 恩普乐斯股份有限公司 接触探针
USD1090440S1 (en) * 2023-01-12 2025-08-26 Johnstech International Corporation Spring probe contact assembly

Family Cites Families (17)

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US5936421A (en) * 1994-10-11 1999-08-10 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
JP4060919B2 (ja) * 1997-11-28 2008-03-12 富士通株式会社 電気的接続装置、接触子製造方法、及び半導体試験方法
KR20010033843A (ko) * 1998-01-05 2001-04-25 리카 일렉트로닉스 인터내셔널, 인크. 동축 전기 접점 조립체
US6506082B1 (en) * 2001-12-21 2003-01-14 Interconnect Devices, Inc. Electrical contact interface
US6746252B1 (en) * 2002-08-01 2004-06-08 Plastronics Socket Partners, L.P. High frequency compression mount receptacle with lineal contact members
US6967492B2 (en) * 2003-11-26 2005-11-22 Asm Assembly Automation Ltd. Spring contact probe device for electrical testing
WO2006135680A2 (en) * 2005-06-10 2006-12-21 Delaware Capital Formation Inc. Electrical contact probe with compliant internal interconnect
JP4999079B2 (ja) * 2007-04-10 2012-08-15 サンユー工業株式会社 プローブ
US7862391B2 (en) * 2007-09-18 2011-01-04 Delaware Capital Formation, Inc. Spring contact assembly
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
US8105119B2 (en) * 2009-01-30 2012-01-31 Delaware Capital Formation, Inc. Flat plunger round barrel test probe
WO2011036800A1 (ja) * 2009-09-28 2011-03-31 株式会社日本マイクロニクス 接触子及び電気的接続装置
US8710856B2 (en) * 2010-01-15 2014-04-29 LTX Credence Corporation Terminal for flat test probe
US8721372B2 (en) * 2010-02-05 2014-05-13 Kabushiki Kaisha Nihon Micronics Contact and electrical connecting apparatus
JP5352525B2 (ja) * 2010-04-28 2013-11-27 日本航空電子工業株式会社 プローブピン用コンタクト、プローブピンおよび電子デバイス用接続治具
TWM393066U (en) * 2010-05-06 2010-11-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP5618729B2 (ja) 2010-09-24 2014-11-05 シチズンセイミツ株式会社 コンタクトプローブ及びこれを用いた電子回路試験装置

Also Published As

Publication number Publication date
US9829506B2 (en) 2017-11-28
US20150070040A1 (en) 2015-03-12
PT2836847T (pt) 2016-08-23
JP6230595B2 (ja) 2017-11-15
EP2836847A1 (en) 2015-02-18
WO2013154738A1 (en) 2013-10-17
MY176424A (en) 2020-08-07
JP2015516571A (ja) 2015-06-11
EP2836847B1 (en) 2016-05-18

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