SG11201405075SA - Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof - Google Patents

Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof

Info

Publication number
SG11201405075SA
SG11201405075SA SG11201405075SA SG11201405075SA SG11201405075SA SG 11201405075S A SG11201405075S A SG 11201405075SA SG 11201405075S A SG11201405075S A SG 11201405075SA SG 11201405075S A SG11201405075S A SG 11201405075SA SG 11201405075S A SG11201405075S A SG 11201405075SA
Authority
SG
Singapore
Prior art keywords
epoxy resin
cured product
producing same
polyvalent hydroxy
resin composition
Prior art date
Application number
SG11201405075SA
Inventor
Hisashi Yamada
Eijiro Aoyagi
Keisuke Watanabe
Yutaka Okazaki
Hideyasu Asakage
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of SG11201405075SA publication Critical patent/SG11201405075SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
SG11201405075SA 2012-02-23 2013-02-21 Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof SG11201405075SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012037210 2012-02-23
PCT/JP2013/054278 WO2013125620A1 (en) 2012-02-23 2013-02-21 Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof

Publications (1)

Publication Number Publication Date
SG11201405075SA true SG11201405075SA (en) 2014-10-30

Family

ID=49005798

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201405075SA SG11201405075SA (en) 2012-02-23 2013-02-21 Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof

Country Status (7)

Country Link
JP (1) JP6124865B2 (en)
KR (1) KR101987946B1 (en)
CN (1) CN104334597B (en)
MY (1) MY169844A (en)
SG (1) SG11201405075SA (en)
TW (1) TWI548681B (en)
WO (1) WO2013125620A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595019B (en) * 2012-11-12 2017-08-11 Ｄｉｃ股份有限公司 Phenolic hydroxyl group-containing resin, epoxy resin, curable resin composition,cured product thereof and semiconductor encapsulating material
JP6406847B2 (en) * 2014-03-26 2018-10-17 新日鉄住金化学株式会社 Modified polyvalent hydroxy resin, epoxy resin, epoxy resin composition and cured product thereof
WO2017188455A1 (en) * 2016-04-28 2017-11-02 日立化成株式会社 Epoxy resin composition and electronic component device
JP7142233B2 (en) * 2017-12-14 2022-09-27 パナソニックＩｐマネジメント株式会社 EPOXY RESIN COMPOSITION FOR ENCAPSULATION, CURED PRODUCT AND SEMICONDUCTOR DEVICE
TWI751064B (en) * 2021-03-29 2021-12-21 長春人造樹脂廠股份有限公司 Polyhydric phenol resin, glycidyl ether of polyhydric phenol resin, and uses thereof

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4852895A (en) * 1971-11-05 1973-07-25
JPS62119220A (en) * 1985-11-18 1987-05-30 Arakawa Chem Ind Co Ltd Production of polyhydroxyl compound
JPH0356526A (en) * 1989-07-25 1991-03-12 Denki Kagaku Kogyo Kk Epoxy resin composition for sealing semiconductor
JP3196141B2 (en) * 1991-11-14 2001-08-06 東都化成株式会社 Epoxy resin composition
JP3146320B2 (en) 1991-11-18 2001-03-12 東都化成株式会社 Epoxy resin composition
EP0549968A1 (en) * 1991-12-20 1993-07-07 Hoechst Aktiengesellschaft Surface-active compounds based on modified oxalkylated novolaks, their preparation and their application
JPH06128183A (en) * 1992-02-27 1994-05-10 Mitsui Toatsu Chem Inc Method for simultaneous production of bisphenol f and novolak type phenolic resin
JP3587570B2 (en) * 1994-10-20 2004-11-10 三井化学株式会社 Benzylated polyphenols, their epoxy resins, their production methods and uses
JP3579800B2 (en) * 1994-12-14 2004-10-20 東都化成株式会社 Low dielectric epoxy resin composition
JPH10158352A (en) * 1996-11-28 1998-06-16 Dainippon Ink & Chem Inc Production of phenol resin
JPH11140166A (en) 1997-11-11 1999-05-25 Shin Etsu Chem Co Ltd Epoxy resin composition for semiconductor sealing and semiconductor device
JP3349963B2 (en) 1998-10-21 2002-11-25 日本電気株式会社 Flame-retardant epoxy resin composition and semiconductor device using the same
JP2000273280A (en) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP4188022B2 (en) 2002-07-30 2008-11-26 新日鐵化学株式会社 Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product using them
JP2004067968A (en) * 2002-08-09 2004-03-04 Sumitomo Bakelite Co Ltd Resin composition, prepreg, and laminated plate
JP2004323630A (en) * 2003-04-23 2004-11-18 Lignyte Co Ltd Preparation method for phenol resin
JP2005344081A (en) 2004-06-07 2005-12-15 Nippon Steel Chem Co Ltd Epoxy resin composition and cured product thereof
JP2008106219A (en) * 2006-03-29 2008-05-08 Sumitomo Bakelite Co Ltd Method for producing phenol resin
JP5228328B2 (en) * 2007-02-01 2013-07-03 宇部興産株式会社 Low melt viscosity phenol novolac resin, process for producing the same, and cured epoxy resin using the same
JP5320130B2 (en) 2009-03-31 2013-10-23 新日鉄住金化学株式会社 Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product thereof
JP5462559B2 (en) * 2009-09-08 2014-04-02 新日鉄住金化学株式会社 Polyvalent hydroxy compounds, production method thereof, epoxy resin composition and cured product thereof
JP5209660B2 (en) * 2010-03-29 2013-06-12 新日鉄住金化学株式会社 Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product using them

Also Published As

Publication number Publication date
JPWO2013125620A1 (en) 2015-07-30
CN104334597A (en) 2015-02-04
TW201345958A (en) 2013-11-16
TWI548681B (en) 2016-09-11
KR101987946B1 (en) 2019-06-11
JP6124865B2 (en) 2017-05-10
KR20140129227A (en) 2014-11-06
MY169844A (en) 2019-05-17
WO2013125620A1 (en) 2013-08-29
CN104334597B (en) 2016-06-22

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