SG11201403754WA - Device for the laser processing of a workpiece, using two laser beams - Google Patents
Device for the laser processing of a workpiece, using two laser beamsInfo
- Publication number
- SG11201403754WA SG11201403754WA SG11201403754WA SG11201403754WA SG11201403754WA SG 11201403754W A SG11201403754W A SG 11201403754WA SG 11201403754W A SG11201403754W A SG 11201403754WA SG 11201403754W A SG11201403754W A SG 11201403754WA SG 11201403754W A SG11201403754W A SG 11201403754WA
- Authority
- SG
- Singapore
- Prior art keywords
- laser
- workpiece
- laser processing
- laser beams
- beams
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- High Energy & Nuclear Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012200857 | 2012-01-20 | ||
DE201210201194 DE102012201194A1 (de) | 2012-01-20 | 2012-01-27 | Vorrichtung zum Laserbearbeiten eines Werkstückes |
PCT/EP2012/076556 WO2013107597A1 (de) | 2012-01-20 | 2012-12-21 | Vorrichtung zum laserbearbeiten eines werkstückes unter verwendung zweier laserstrahlen |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201403754WA true SG11201403754WA (en) | 2014-10-30 |
Family
ID=48742437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201403754WA SG11201403754WA (en) | 2012-01-20 | 2012-12-21 | Device for the laser processing of a workpiece, using two laser beams |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2804715B1 (ja) |
JP (1) | JP5947402B2 (ja) |
KR (1) | KR20140147810A (ja) |
DE (1) | DE102012201194A1 (ja) |
SG (1) | SG11201403754WA (ja) |
TW (1) | TWI510318B (ja) |
WO (1) | WO2013107597A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6218770B2 (ja) * | 2014-06-23 | 2017-10-25 | 三菱電機株式会社 | レーザ加工装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3333386A1 (de) * | 1983-09-15 | 1985-04-11 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und einrichtung zum beschriften von teilen, insbesondere von elektronischen bauelementen |
JPH02299791A (ja) * | 1989-05-15 | 1990-12-12 | Nippon Steel Corp | 加工物へのレーザ照射法 |
JP3259014B2 (ja) * | 1996-07-24 | 2002-02-18 | ミヤチテクノス株式会社 | スキャニング式レーザマーキング方法及び装置 |
JP4251742B2 (ja) * | 2000-01-14 | 2009-04-08 | 日立ビアメカニクス株式会社 | レーザ加工装置 |
US6313433B1 (en) * | 2000-04-03 | 2001-11-06 | Universal Laser Systems, Inc | Laser material processing system with multiple laser sources apparatus and method |
JP3522654B2 (ja) * | 2000-06-09 | 2004-04-26 | 住友重機械工業株式会社 | レーザ加工装置及び加工方法 |
JP2004055771A (ja) * | 2002-07-18 | 2004-02-19 | Nec Lcd Technologies Ltd | 半導体薄膜の製造方法及びレーザ照射装置 |
JP2005007476A (ja) * | 2003-05-26 | 2005-01-13 | Mitsubishi Electric Corp | レーザ加工方法およびレーザ加工装置 |
JP2005150609A (ja) * | 2003-11-19 | 2005-06-09 | Sharp Corp | 太陽電池の製造方法 |
JP4947933B2 (ja) * | 2005-07-26 | 2012-06-06 | オリンパス株式会社 | レーザリペア装置 |
JP5025158B2 (ja) * | 2006-04-27 | 2012-09-12 | 日立造船株式会社 | レーザ加工方法及び装置 |
JP5103054B2 (ja) * | 2007-04-27 | 2012-12-19 | サイバーレーザー株式会社 | レーザによる加工方法およびレーザ加工装置 |
JP5010978B2 (ja) * | 2007-05-22 | 2012-08-29 | 株式会社ディスコ | レーザー加工装置 |
DE102008032751B3 (de) * | 2008-07-11 | 2009-12-10 | Innolas Systems Gmbh | Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren mit Doppel- oder Mehrfachspot mittels eines Galvanoscanners |
WO2010067042A1 (en) * | 2008-12-13 | 2010-06-17 | M-Solv Limited | Method and apparatus for laser machining relatively narrow and relatively wide structures |
-
2012
- 2012-01-27 DE DE201210201194 patent/DE102012201194A1/de not_active Withdrawn
- 2012-12-21 SG SG11201403754WA patent/SG11201403754WA/en unknown
- 2012-12-21 EP EP12816664.2A patent/EP2804715B1/de active Active
- 2012-12-21 WO PCT/EP2012/076556 patent/WO2013107597A1/de active Application Filing
- 2012-12-21 JP JP2014552556A patent/JP5947402B2/ja active Active
- 2012-12-21 KR KR1020147023260A patent/KR20140147810A/ko active IP Right Grant
-
2013
- 2013-01-18 TW TW102101884A patent/TWI510318B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201341096A (zh) | 2013-10-16 |
JP5947402B2 (ja) | 2016-07-06 |
WO2013107597A1 (de) | 2013-07-25 |
EP2804715B1 (de) | 2016-03-09 |
DE102012201194A1 (de) | 2013-07-25 |
KR20140147810A (ko) | 2014-12-30 |
TWI510318B (zh) | 2015-12-01 |
EP2804715A1 (de) | 2014-11-26 |
JP2015509848A (ja) | 2015-04-02 |
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