HK1206682A1 - Laser processing machine - Google Patents

Laser processing machine

Info

Publication number
HK1206682A1
HK1206682A1 HK15107414.6A HK15107414A HK1206682A1 HK 1206682 A1 HK1206682 A1 HK 1206682A1 HK 15107414 A HK15107414 A HK 15107414A HK 1206682 A1 HK1206682 A1 HK 1206682A1
Authority
HK
Hong Kong
Prior art keywords
laser processing
processing machine
laser
machine
processing
Prior art date
Application number
HK15107414.6A
Other languages
Chinese (zh)
Inventor
Junichi Matsumoto
Original Assignee
Kataoka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kataoka Corp filed Critical Kataoka Corp
Publication of HK1206682A1 publication Critical patent/HK1206682A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
HK15107414.6A 2013-11-12 2015-08-03 Laser processing machine HK1206682A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013234379A JP5728065B2 (en) 2013-11-12 2013-11-12 Laser processing machine

Publications (1)

Publication Number Publication Date
HK1206682A1 true HK1206682A1 (en) 2016-01-15

Family

ID=53196075

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107414.6A HK1206682A1 (en) 2013-11-12 2015-08-03 Laser processing machine

Country Status (5)

Country Link
JP (1) JP5728065B2 (en)
KR (1) KR101622473B1 (en)
CN (1) CN104625396B (en)
HK (1) HK1206682A1 (en)
TW (1) TWI556895B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113788A (en) * 2015-12-24 2017-06-29 株式会社リコー Optical processing device
JP2018013342A (en) * 2016-07-19 2018-01-25 株式会社ディスコ Inspection method
KR20180031964A (en) * 2016-09-21 2018-03-29 레이저발 차이나 코., 엘티디 Apparatus for laser machining and method for laser machining using same
KR102330173B1 (en) 2019-03-29 2021-11-26 엘케이제작소 주식회사 Alignment regulators for CNC laser cutting machine
CN110406268B (en) * 2019-07-15 2021-04-02 中国船舶重工集团公司第七一六研究所 Full-automatic flange marking machine based on visual identification

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005081392A (en) * 2003-09-09 2005-03-31 Fuji Electric Holdings Co Ltd Laser beam machining method and device
JP4755839B2 (en) * 2005-03-23 2011-08-24 株式会社ディスコ Laser processing equipment
JP2008229716A (en) * 2007-03-23 2008-10-02 Toray Eng Co Ltd Method and device for laser scribing, and cleaved substrate cleaved using the same method or the same device
JP2009099939A (en) * 2007-09-25 2009-05-07 Dainippon Screen Mfg Co Ltd Alignment mark forming device
JP2009241095A (en) * 2008-03-31 2009-10-22 Laser Solutions Co Ltd Energy beam machining apparatus and manufacturing method of article machined by energy beam
JP4958020B2 (en) * 2009-03-31 2012-06-20 大日本印刷株式会社 Touch panel sensor, laminate for manufacturing touch panel sensor, and method for manufacturing touch panel sensor
JP5377086B2 (en) * 2009-06-04 2013-12-25 株式会社日立ハイテクノロジーズ Laser processing method, laser processing apparatus, and solar panel manufacturing method
KR101261266B1 (en) * 2010-11-03 2013-05-09 유병소 Laser processing device and laser processing method using the same

Also Published As

Publication number Publication date
TWI556895B (en) 2016-11-11
KR101622473B1 (en) 2016-05-18
CN104625396B (en) 2016-09-21
JP5728065B2 (en) 2015-06-03
JP2015093300A (en) 2015-05-18
KR20150054642A (en) 2015-05-20
CN104625396A (en) 2015-05-20
TW201519982A (en) 2015-06-01

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