SG108956A1 - Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same - Google Patents

Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same

Info

Publication number
SG108956A1
SG108956A1 SG200404279A SG200404279A SG108956A1 SG 108956 A1 SG108956 A1 SG 108956A1 SG 200404279 A SG200404279 A SG 200404279A SG 200404279 A SG200404279 A SG 200404279A SG 108956 A1 SG108956 A1 SG 108956A1
Authority
SG
Singapore
Prior art keywords
semiconductor
molding tablet
producing
same
molding
Prior art date
Application number
SG200404279A
Other languages
English (en)
Inventor
Oono Hirofumi
Yamane Minoru
Ina Yasunobu
Umeno Shouichi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG108956A1 publication Critical patent/SG108956A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/02—Making granules by dividing preformed material
    • B29B9/04—Making granules by dividing preformed material in the form of plates or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/08—Making granules by agglomerating smaller particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/10—Making granules by moulding the material, i.e. treating it in the molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/12—Making granules characterised by structure or composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
SG200404279A 2003-07-17 2004-07-16 Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same SG108956A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003198550 2003-07-17

Publications (1)

Publication Number Publication Date
SG108956A1 true SG108956A1 (en) 2005-02-28

Family

ID=33475515

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200404279A SG108956A1 (en) 2003-07-17 2004-07-16 Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same

Country Status (8)

Country Link
US (1) US20050023715A1 (de)
EP (1) EP1498244B1 (de)
KR (1) KR100691063B1 (de)
CN (1) CN100339457C (de)
DE (1) DE602004002623T2 (de)
MY (1) MY140808A (de)
SG (1) SG108956A1 (de)
TW (1) TWI293314B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6216180B2 (ja) * 2013-08-01 2017-10-18 日東電工株式会社 封止用シート、及び、当該封止用シートを用いた半導体装置の製造方法
KR102097800B1 (ko) * 2017-06-21 2020-04-06 삼성에스디아이 주식회사 정제 상의 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1454889A1 (de) * 1963-06-12 1969-04-10 Weyerhaeuser Co Verfahren und Vorrichtung zum Verdichten pulverfoermiger Substanzen
JPS597009A (ja) * 1982-07-03 1984-01-14 Toshiba Corp 高密度タブレツトおよびそれを使用した半導体樹脂封止方法
JPS60257548A (ja) * 1984-06-04 1985-12-19 Hitachi Chem Co Ltd 封止用成形材料の製造法
MY109641A (en) * 1991-03-20 1997-03-31 Nitto Denko Corp Resin tablet for semiconductor sealing,process for producing the same, and process for producing semiconductor devices using the same
DE4414939A1 (de) * 1993-04-30 1994-11-03 Shell Int Research Verfahren zum Verdichten einer geschmolzenen Mischung einer Epoxyharz-Pulverzusammensetzung
JPH0839549A (ja) * 1994-07-29 1996-02-13 Sumitomo Bakelite Co Ltd 半導体封止用タブレット
JP3611066B2 (ja) * 1996-08-29 2005-01-19 株式会社ルネサステクノロジ 無機質充填剤及びエポキシ樹脂組成物の製造方法
US6054222A (en) * 1997-02-20 2000-04-25 Kabushiki Kaisha Toshiba Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet

Also Published As

Publication number Publication date
DE602004002623D1 (de) 2006-11-16
KR100691063B1 (ko) 2007-03-09
CN100339457C (zh) 2007-09-26
DE602004002623T2 (de) 2007-01-18
TWI293314B (en) 2008-02-11
MY140808A (en) 2010-01-15
EP1498244B1 (de) 2006-10-04
TW200508272A (en) 2005-03-01
CN1576344A (zh) 2005-02-09
KR20050009234A (ko) 2005-01-24
EP1498244A1 (de) 2005-01-19
US20050023715A1 (en) 2005-02-03

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