SG108940A1 - Method and apparatus for cooling a reticle during lithographic exposure - Google Patents
Method and apparatus for cooling a reticle during lithographic exposureInfo
- Publication number
- SG108940A1 SG108940A1 SG200306240A SG200306240A SG108940A1 SG 108940 A1 SG108940 A1 SG 108940A1 SG 200306240 A SG200306240 A SG 200306240A SG 200306240 A SG200306240 A SG 200306240A SG 108940 A1 SG108940 A1 SG 108940A1
- Authority
- SG
- Singapore
- Prior art keywords
- cooling
- lithographic exposure
- during lithographic
- reticle during
- reticle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Public Health (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/273,405 US7105836B2 (en) | 2002-10-18 | 2002-10-18 | Method and apparatus for cooling a reticle during lithographic exposure |
Publications (1)
Publication Number | Publication Date |
---|---|
SG108940A1 true SG108940A1 (en) | 2005-02-28 |
Family
ID=32042954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200306240A SG108940A1 (en) | 2002-10-18 | 2003-10-17 | Method and apparatus for cooling a reticle during lithographic exposure |
Country Status (6)
Country | Link |
---|---|
US (1) | US7105836B2 (ja) |
EP (1) | EP1411391A3 (ja) |
JP (1) | JP2004282011A (ja) |
KR (1) | KR100828671B1 (ja) |
SG (1) | SG108940A1 (ja) |
TW (1) | TW200502674A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014083965A1 (ja) * | 2012-11-27 | 2014-06-05 | 株式会社クリエイティブ テクノロジー | 静電チャック,ガラス基板処理方法及びそのガラス基板 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4335084B2 (ja) * | 2003-07-02 | 2009-09-30 | エーエスエムエル ネザーランズ ビー.ブイ. | 測定装置を有するリトグラフ投影装置 |
US6897945B1 (en) * | 2003-12-15 | 2005-05-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7489388B2 (en) * | 2003-12-22 | 2009-02-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20070017660A1 (en) * | 2005-07-12 | 2007-01-25 | Stefan Kienitz | Heatsink with adapted backplate |
US7440076B2 (en) * | 2005-09-29 | 2008-10-21 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
DE102005062081A1 (de) * | 2005-12-22 | 2007-07-05 | Carl Zeiss Smt Ag | Projektionsobjektiv mit dezentraler Steuerung |
US8325321B2 (en) * | 2006-07-28 | 2012-12-04 | Mapper Lithography Ip B.V. | Lithography system, method of heat dissipation and frame |
US20080121821A1 (en) * | 2006-11-27 | 2008-05-29 | Varian Semiconductor Equipment Associates Inc. | Techniques for low-temperature ion implantation |
US8760621B2 (en) * | 2007-03-12 | 2014-06-24 | Asml Netherlands B.V. | Lithographic apparatus and method |
US20090194263A1 (en) * | 2008-02-05 | 2009-08-06 | Bernardes Marco Aurelio Dos Santos | Methods and mechanisms for thermal semi conduction |
WO2010020337A1 (en) * | 2008-08-21 | 2010-02-25 | Asml Holding Nv | Euv reticle substrates with high thermal conductivity |
NL2003528A (en) * | 2008-10-23 | 2010-04-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
US20100186942A1 (en) * | 2009-01-23 | 2010-07-29 | Phillips Alton H | Reticle error reduction by cooling |
NL2005463A (en) * | 2009-12-16 | 2011-06-20 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
NL2006809A (en) * | 2010-06-23 | 2011-12-27 | Asml Netherlands Bv | Lithographic apparatus and lithographic apparatus cooling method. |
US8794011B2 (en) | 2010-10-15 | 2014-08-05 | Nikon Corporation | Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (TECs) |
EP2686736B1 (en) | 2011-03-17 | 2014-12-17 | ASML Netherlands BV | Electrostatic clamp, lithographic apparatus, and device manufacturing method |
WO2013050243A1 (en) * | 2011-10-06 | 2013-04-11 | Asml Netherlands B.V. | Chuck, lithography apparatus and method of using a chuck |
US9164388B2 (en) * | 2012-04-10 | 2015-10-20 | Kla-Tencor Corporation | Temperature control in EUV reticle inspection tool |
JP5795454B2 (ja) * | 2012-05-09 | 2015-10-14 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置 |
US9454090B2 (en) | 2012-08-28 | 2016-09-27 | Micron Technology, Inc. | Methods and apparatuses for template cooling |
DE102013201805A1 (de) * | 2013-02-05 | 2013-11-28 | Carl Zeiss Smt Gmbh | Lithographieanlage mit kühlvorrichtung |
DE102013201803A1 (de) * | 2013-02-05 | 2014-02-27 | Carl Zeiss Smt Gmbh | Strahlungskühler und verfahren zur steuerung und regelung hierfür |
NL2012204A (en) * | 2013-02-07 | 2014-12-18 | Asml Holding Nv | Lithographic apparatus and method. |
TWI656596B (zh) * | 2014-08-26 | 2019-04-11 | 荷蘭商Asml控股公司 | 靜電夾具及其製造方法 |
WO2018213825A1 (en) | 2017-05-19 | 2018-11-22 | Massachusetts Institute Of Technology | Transport system having a magnetically levitated transportation stage |
US11175103B2 (en) * | 2019-09-13 | 2021-11-16 | Toshiba Memory Corporation | Heat sink with dashed crosshatched fin pattern |
KR102202163B1 (ko) * | 2020-06-16 | 2021-01-12 | (주)볼타오토메이션 | 자기부상식 반송장치 |
CN112987508B (zh) * | 2021-03-04 | 2022-09-30 | 长鑫存储技术有限公司 | 振动衰减结构及曝光装置 |
TW202300471A (zh) | 2021-03-16 | 2023-01-01 | 德商首德公司 | 具有特定熱膨脹特性的euvl精密組件 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0484179A2 (en) * | 1990-11-01 | 1992-05-06 | Canon Kabushiki Kaisha | Wafer holding device in an exposure apparatus |
EP1120690A2 (en) * | 1999-12-27 | 2001-08-01 | Svg Lithography Systems, Inc. | EUV reticle thermal management |
JP2003068626A (ja) * | 2001-08-29 | 2003-03-07 | Canon Inc | 露光装置内ユニットの輻射冷却方法及び輻射冷却装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3171956A (en) * | 1962-03-30 | 1965-03-02 | Rca Corp | Variant temperature environment for specimen stage of scientific instrument |
US4226281A (en) * | 1979-06-11 | 1980-10-07 | International Business Machines Corporation | Thermal conduction module |
US5289337A (en) * | 1992-02-21 | 1994-02-22 | Intel Corporation | Heatspreader for cavity down multi-chip module with flip chip |
US5325180A (en) * | 1992-12-31 | 1994-06-28 | International Business Machines Corporation | Apparatus for identifying and distinguishing temperature and system induced measuring errors |
KR0179938B1 (ko) * | 1996-12-31 | 1999-04-01 | 문정환 | 반도체 웨이퍼 노광장치 |
US5801891A (en) * | 1997-04-14 | 1998-09-01 | Eastman Kodak Company | Flat mirror mounting flexure |
US5944097A (en) * | 1997-05-06 | 1999-08-31 | Northrop Grumman Corporation | Composite substrate carrier for high power electronic devices |
US6705388B1 (en) * | 1997-11-10 | 2004-03-16 | Parker-Hannifin Corporation | Non-electrically conductive thermal dissipator for electronic components |
US6215642B1 (en) * | 1999-03-11 | 2001-04-10 | Nikon Corporation Of Japan | Vacuum compatible, deformable electrostatic chuck with high thermal conductivity |
US6809802B1 (en) * | 1999-08-19 | 2004-10-26 | Canon Kabushiki Kaisha | Substrate attracting and holding system for use in exposure apparatus |
US6496528B2 (en) * | 1999-09-03 | 2002-12-17 | Cymer, Inc. | Line narrowing unit with flexural grating mount |
EP1124161A3 (en) | 2000-02-10 | 2004-01-07 | ASML Netherlands B.V. | Lithographic projection apparatus having a temperature controlled heat shield |
JP3870002B2 (ja) * | 2000-04-07 | 2007-01-17 | キヤノン株式会社 | 露光装置 |
US6630984B2 (en) * | 2000-08-03 | 2003-10-07 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
JP4745556B2 (ja) | 2001-08-20 | 2011-08-10 | キヤノン株式会社 | 位置決め装置、露光装置、及びデバイス製造方法 |
-
2002
- 2002-10-18 US US10/273,405 patent/US7105836B2/en not_active Expired - Fee Related
-
2003
- 2003-10-16 TW TW092128737A patent/TW200502674A/zh unknown
- 2003-10-16 JP JP2003356373A patent/JP2004282011A/ja active Pending
- 2003-10-17 EP EP03023662A patent/EP1411391A3/en not_active Withdrawn
- 2003-10-17 SG SG200306240A patent/SG108940A1/en unknown
- 2003-10-18 KR KR1020030072763A patent/KR100828671B1/ko not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0484179A2 (en) * | 1990-11-01 | 1992-05-06 | Canon Kabushiki Kaisha | Wafer holding device in an exposure apparatus |
EP1120690A2 (en) * | 1999-12-27 | 2001-08-01 | Svg Lithography Systems, Inc. | EUV reticle thermal management |
JP2003068626A (ja) * | 2001-08-29 | 2003-03-07 | Canon Inc | 露光装置内ユニットの輻射冷却方法及び輻射冷却装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014083965A1 (ja) * | 2012-11-27 | 2014-06-05 | 株式会社クリエイティブ テクノロジー | 静電チャック,ガラス基板処理方法及びそのガラス基板 |
Also Published As
Publication number | Publication date |
---|---|
EP1411391A2 (en) | 2004-04-21 |
TW200502674A (en) | 2005-01-16 |
US20040079518A1 (en) | 2004-04-29 |
EP1411391A3 (en) | 2005-10-12 |
JP2004282011A (ja) | 2004-10-07 |
KR100828671B1 (ko) | 2008-05-09 |
US7105836B2 (en) | 2006-09-12 |
KR20040034530A (ko) | 2004-04-28 |
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