SG10202101442QA - Slurry composition for chemical mechanical polishing - Google Patents

Slurry composition for chemical mechanical polishing

Info

Publication number
SG10202101442QA
SG10202101442QA SG10202101442QA SG10202101442QA SG10202101442QA SG 10202101442Q A SG10202101442Q A SG 10202101442QA SG 10202101442Q A SG10202101442Q A SG 10202101442QA SG 10202101442Q A SG10202101442Q A SG 10202101442QA SG 10202101442Q A SG10202101442Q A SG 10202101442QA
Authority
SG
Singapore
Prior art keywords
mechanical polishing
chemical mechanical
slurry composition
slurry
composition
Prior art date
Application number
SG10202101442QA
Other languages
English (en)
Inventor
Jin Sook Hwang
Hyun Goo Kong
In Seol Hwang
Original Assignee
Kctech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kctech Co Ltd filed Critical Kctech Co Ltd
Publication of SG10202101442QA publication Critical patent/SG10202101442QA/en

Links

SG10202101442QA 2020-02-27 2021-02-11 Slurry composition for chemical mechanical polishing SG10202101442QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200024087A KR102367056B1 (ko) 2020-02-27 2020-02-27 화학적 기계적 연마용 슬러리 조성물

Publications (1)

Publication Number Publication Date
SG10202101442QA true SG10202101442QA (en) 2021-09-29

Family

ID=77370822

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202101442QA SG10202101442QA (en) 2020-02-27 2021-02-11 Slurry composition for chemical mechanical polishing

Country Status (4)

Country Link
US (1) US20210269675A1 (ko)
KR (1) KR102367056B1 (ko)
CN (1) CN113308197A (ko)
SG (1) SG10202101442QA (ko)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046110A (en) 1995-06-08 2000-04-04 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing a semiconductor device
US6126853A (en) * 1996-12-09 2000-10-03 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
US6063306A (en) * 1998-06-26 2000-05-16 Cabot Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrate
US6293848B1 (en) * 1999-11-15 2001-09-25 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US6866793B2 (en) * 2002-09-26 2005-03-15 University Of Florida Research Foundation, Inc. High selectivity and high planarity dielectric polishing
JP2007012638A (ja) * 2003-10-01 2007-01-18 Asahi Kasei Chemicals Corp 金属用研磨組成物
JP2005244123A (ja) * 2004-02-27 2005-09-08 Fujimi Inc 研磨用組成物
US7988878B2 (en) * 2004-09-29 2011-08-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Selective barrier slurry for chemical mechanical polishing
US20080148649A1 (en) * 2006-12-21 2008-06-26 Zhendong Liu Ruthenium-barrier polishing slurry
KR100949250B1 (ko) * 2007-10-10 2010-03-25 제일모직주식회사 금속 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법
CN101665665A (zh) * 2009-09-27 2010-03-10 大连三达奥克化学股份有限公司 降低铜化学机械抛光粗糙度的抛光液
CN102559058B (zh) * 2010-12-21 2015-05-27 安集微电子（上海）有限公司 一种化学机械抛光液
CN103160207A (zh) * 2011-12-16 2013-06-19 安集微电子（上海）有限公司 一种金属化学机械抛光浆料及其应用
KR101388103B1 (ko) * 2012-07-23 2014-04-23 주식회사 케이씨텍 연마용 슬러리 조성물 및 그 제조 방법
US8961807B2 (en) * 2013-03-15 2015-02-24 Cabot Microelectronics Corporation CMP compositions with low solids content and methods related thereto
KR101483448B1 (ko) * 2013-10-10 2015-01-19 주식회사 케이씨텍 구리막 및 산화막의 연마용 슬러리 조성물 및 이를 이용한 연마 방법
WO2015200684A1 (en) * 2014-06-25 2015-12-30 Cabot Microelectronics Corporation Copper barrier chemical-mechanical polishing composition
US10570313B2 (en) * 2015-02-12 2020-02-25 Versum Materials Us, Llc Dishing reducing in tungsten chemical mechanical polishing
WO2016170942A1 (ja) * 2015-04-22 2016-10-27 Jsr株式会社 化学機械研磨用処理組成物、化学機械研磨方法および洗浄方法
US10745589B2 (en) * 2016-06-16 2020-08-18 Versum Materials Us, Llc Chemical mechanical polishing (CMP) of cobalt-containing substrate
US20190085205A1 (en) * 2017-09-15 2019-03-21 Cabot Microelectronics Corporation NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS
KR102210251B1 (ko) * 2017-11-10 2021-02-01 삼성에스디아이 주식회사 유기막 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법

Also Published As

Publication number Publication date
CN113308197A (zh) 2021-08-27
KR20210109171A (ko) 2021-09-06
US20210269675A1 (en) 2021-09-02
KR102367056B1 (ko) 2022-02-25

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