SG10202100104WA - Rotor disk, double-sided processing machine and method for processing at least one workpiece in a double-sided processing machine - Google Patents

Rotor disk, double-sided processing machine and method for processing at least one workpiece in a double-sided processing machine

Info

Publication number
SG10202100104WA
SG10202100104WA SG10202100104WA SG10202100104WA SG10202100104WA SG 10202100104W A SG10202100104W A SG 10202100104WA SG 10202100104W A SG10202100104W A SG 10202100104WA SG 10202100104W A SG10202100104W A SG 10202100104WA SG 10202100104W A SG10202100104W A SG 10202100104WA
Authority
SG
Singapore
Prior art keywords
double
processing machine
sided
sided processing
workpiece
Prior art date
Application number
SG10202100104WA
Other languages
English (en)
Inventor
Helge Möller
Jörn Kanzow
Original Assignee
Lapmaster Wolters Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lapmaster Wolters Gmbh filed Critical Lapmaster Wolters Gmbh
Publication of SG10202100104WA publication Critical patent/SG10202100104WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG10202100104WA 2020-01-21 2021-01-06 Rotor disk, double-sided processing machine and method for processing at least one workpiece in a double-sided processing machine SG10202100104WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102020101313.2A DE102020101313B3 (de) 2020-01-21 2020-01-21 Läuferscheibe, Doppelseitenbearbeitungsmaschine und Verfahren zum Bearbeiten mindestens eines Werkstücks in einer Doppelseitenbearbeitungsmaschine

Publications (1)

Publication Number Publication Date
SG10202100104WA true SG10202100104WA (en) 2021-08-30

Family

ID=74130127

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202100104WA SG10202100104WA (en) 2020-01-21 2021-01-06 Rotor disk, double-sided processing machine and method for processing at least one workpiece in a double-sided processing machine

Country Status (8)

Country Link
US (1) US20210220963A1 (de)
EP (1) EP3854525A1 (de)
JP (2) JP2021115694A (de)
KR (1) KR20210095052A (de)
CN (1) CN113211304A (de)
DE (1) DE102020101313B3 (de)
SG (1) SG10202100104WA (de)
TW (1) TW202134001A (de)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080166952A1 (en) * 2005-02-25 2008-07-10 Shin-Etsu Handotai Co., Ltd Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same
JP5082113B2 (ja) 2008-07-31 2012-11-28 トーカロ株式会社 被研磨物保持用キャリアおよびその製造方法
DE102009038942B4 (de) * 2008-10-22 2022-06-23 Peter Wolters Gmbh Vorrichtung zur beidseitigen Bearbeitung von flachen Werkstücken sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung mehrerer Halbleiterscheiben
DE102011003008B4 (de) * 2011-01-21 2018-07-12 Siltronic Ag Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
JP5861451B2 (ja) 2011-12-27 2016-02-16 旭硝子株式会社 磁気記録媒体用ガラス基板の研磨方法、および、磁気記録媒体用ガラス基板の製造方法
JP6083889B2 (ja) * 2012-10-10 2017-02-22 トーカロ株式会社 アモルファスカーボン膜被覆部材
JP2015069671A (ja) 2013-09-30 2015-04-13 Hoya株式会社 磁気ディスク用ガラス基板の製造方法
JP6330628B2 (ja) 2013-11-11 2018-05-30 旭硝子株式会社 ガラス基板の製造方法
US11453098B2 (en) * 2016-12-09 2022-09-27 Shin-Etsu Handotai Co., Ltd. Carrier for double-side polishing apparatus, double-side polishing apparatus, and double-side polishing method
DE102017221931A1 (de) * 2017-12-05 2019-06-06 Siltronic Ag Läuferscheibe zum Führen von Halbleiterscheiben und Verfahren zur beidseitigen Politur von Halbleiterscheiben

Also Published As

Publication number Publication date
DE102020101313B3 (de) 2021-07-01
CN113211304A (zh) 2021-08-06
JP2023115061A (ja) 2023-08-18
KR20210095052A (ko) 2021-07-30
US20210220963A1 (en) 2021-07-22
JP2021115694A (ja) 2021-08-10
EP3854525A1 (de) 2021-07-28
TW202134001A (zh) 2021-09-16

Similar Documents

Publication Publication Date Title
EP3763885A4 (de) Arbeitsmaschine, informationsverarbeitungsvorrichtung, informationsverarbeitungsverfahren und programm
EP3859464A4 (de) Werkzeugmaschine, bearbeitungsprogrammeditierverfahren für werkzeugmaschine und programm für bearbeitungsprogrammeditierung für werkzeugmaschine
PL3525967T3 (pl) Sposób obróbki przedmiotów obrabianych w obrabiarce oraz obrabiarka do tego sposobu
PL1818136T3 (pl) Obrabiarka i sposób wiórowej obróbki przedmiotów obrabianych, zwłaszcza metalowych przedmiotów obrabianych
WO2013034620A3 (de) Werkzeugmaschine und verfahren zum austausch von werkzeugen an einer werkzeugmaschine
EP3943239C0 (de) Werkzeugmaschine und verfahren zum betreiben der werkzeugmaschine
PL3493946T3 (pl) System z obrabiarką i urządzeniem wychwytującym, urządzenie wychwytujące oraz sposób wychwytywania dla przedmiotów obrobionych w obrabiarce
EP4129565A4 (de) Werkzeugmaschine und informationsverarbeitungsvorrichtung
EP4116504A4 (de) Arbeitsmaschine und verfahren zur steuerung der arbeitsmaschine
EP3951105A4 (de) Informationsverarbeitungsvorrichtung, informationsverarbeitungsverfahren, programm und arbeitsmaschine
PL2198991T3 (pl) Zespół do załadunku i rozładunku blach z uchwytem narzędziowym dla maszyn do obróbki blach
SG10202100104WA (en) Rotor disk, double-sided processing machine and method for processing at least one workpiece in a double-sided processing machine
PL3310524T3 (pl) Sposób – równoległego względem czasu głównego – zdejmowania wyciętej części przedmiotu obrabianego, odpowiednia maszyna do cięcia laserowego i program komputerowy
EP4130396A4 (de) Informationsverarbeitungsvorrichtung für arbeitsmaschine, informationsverwaltungssystem und informationsverarbeitungsprogramm für eine arbeitsmaschine
EP3939744A4 (de) Chipverarbeitungseinrichtung für werkzeugmaschine und chipverarbeitungsverfahren
EP3954481A4 (de) Werkzeugmaschine und detektionsverfahren
EP3995239A4 (de) Maschinenwerkzeug und maschinelles bearbeitungsverfahren
EP4183522A4 (de) Arbeitsmaschine und perforationsverfahren
EP3933899A4 (de) Verfahren und system zur verarbeitung von maschinendaten
PL3909710T3 (pl) Głowica frezarska, maszyna do obróbki i sposób eksploatacji maszyny do obróbki
PL3744663T3 (pl) Urządzenie doprowadzające i odprowadzające, jednostka odprowadzająca oraz sposób doprowadzania do obrabiarki przedmiotów do obróbki i odprowadzania poddanych obróbce na obrabiarce przedmiotów z obrabiarki
EP3907038A4 (de) Werkzeugmaschine und verfahren zu deren betrieb
EP4350463A4 (de) Informationsverarbeitungssystem, arbeitsmaschine und programm
EP4163048A4 (de) Werkstückbearbeitungsverfahren und bearbeitungsmaschine
EP4129568A4 (de) Informationsverarbeitungsvorrichtung, werkzeugmaschine und programm