SG10202010109VA - Chuck table for cutting apparatus - Google Patents

Chuck table for cutting apparatus

Info

Publication number
SG10202010109VA
SG10202010109VA SG10202010109VA SG10202010109VA SG10202010109VA SG 10202010109V A SG10202010109V A SG 10202010109VA SG 10202010109V A SG10202010109V A SG 10202010109VA SG 10202010109V A SG10202010109V A SG 10202010109VA SG 10202010109V A SG10202010109V A SG 10202010109VA
Authority
SG
Singapore
Prior art keywords
cutting apparatus
chuck table
chuck
cutting
Prior art date
Application number
SG10202010109VA
Other languages
English (en)
Inventor
Kaneko Tomohiro
Arifuku Norihisa
Saito Hiroshi
FUSHIDA Masayasu
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202010109VA publication Critical patent/SG10202010109VA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10202010109VA 2019-10-24 2020-10-12 Chuck table for cutting apparatus SG10202010109VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019193653A JP7390855B2 (ja) 2019-10-24 2019-10-24 切削装置のチャックテーブル

Publications (1)

Publication Number Publication Date
SG10202010109VA true SG10202010109VA (en) 2021-05-28

Family

ID=75637566

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202010109VA SG10202010109VA (en) 2019-10-24 2020-10-12 Chuck table for cutting apparatus

Country Status (5)

Country Link
JP (1) JP7390855B2 (ko)
KR (1) KR20210048983A (ko)
PH (1) PH12020050367A1 (ko)
SG (1) SG10202010109VA (ko)
TW (1) TW202116482A (ko)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6004725B2 (ja) 2012-04-24 2016-10-12 株式会社ディスコ 加工装置のチャックテーブル機構
JP6173173B2 (ja) 2013-11-11 2017-08-02 株式会社ディスコ 切削装置
JP6301147B2 (ja) 2014-02-13 2018-03-28 株式会社ディスコ 保持治具
JP6382039B2 (ja) 2014-09-04 2018-08-29 Towa株式会社 切断装置並びに吸着機構及びこれを用いる装置

Also Published As

Publication number Publication date
TW202116482A (zh) 2021-05-01
PH12020050367A1 (en) 2021-05-10
JP2021068824A (ja) 2021-04-30
JP7390855B2 (ja) 2023-12-04
KR20210048983A (ko) 2021-05-04

Similar Documents

Publication Publication Date Title
EP3990221C0 (en) ADVANCED SUPPORT DEVICE
SG10202003857QA (en) Cutting apparatus
SG10201906208VA (en) Cutting apparatus
EP3659732A4 (en) CUTTING TOOL HOLDER
SG10202000762WA (en) Chuck table and inspection apparatus
SG10202000252QA (en) Workpiece cutting method
SG10201906214SA (en) Porous chuck table
SG10201911503TA (en) Cutting apparatus
PL3517262T3 (pl) Urządzenie do zaciskania obrabianego przedmiotu
PL3623085T3 (pl) Uchwyt zaciskowy
EP3924595C0 (en) PIPE CUTTING DEVICE
PT3756801T (pt) Suporte de fixação
EP3858676A4 (en) ENVIRONMENTAL MONITORING DEVICE FOR A WORKING MACHINE
EP3524376C0 (de) Schneidvorrichtung zur spanabhebenden bearbeitung von werkstücken
GB201905322D0 (en) Precision machining apparatus
EP3679782A4 (en) WORK TOOL SUPPORT BELT
GB201819807D0 (en) Apparatus for boring
SG10202010109VA (en) Chuck table for cutting apparatus
KR102204933B9 (ko) 고소 작업대 승강장치
PL3643436T3 (pl) Uchwyt zaciskowy do obrabiarek
PL3735331T3 (pl) Urządzenie do cięcia blachy
GB2574030B (en) Apparatus for supporting a workpiece
KR102280296B9 (ko) 내시경 유도를 통한 흉관 삽관술 장치
KR102151231B9 (ko) 비닐피복기용 커팅장치
GB201814727D0 (en) Cutting apparatus