SG10202002447WA - Compact opto-electric probe - Google Patents

Compact opto-electric probe

Info

Publication number
SG10202002447WA
SG10202002447WA SG10202002447WA SG10202002447WA SG10202002447WA SG 10202002447W A SG10202002447W A SG 10202002447WA SG 10202002447W A SG10202002447W A SG 10202002447WA SG 10202002447W A SG10202002447W A SG 10202002447WA SG 10202002447W A SG10202002447W A SG 10202002447WA
Authority
SG
Singapore
Prior art keywords
electric probe
compact opto
opto
compact
probe
Prior art date
Application number
SG10202002447WA
Inventor
Molly Piels
Anand Ramaswamy
Brandon Gomez
Original Assignee
Juniper Networks Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juniper Networks Inc filed Critical Juniper Networks Inc
Publication of SG10202002447WA publication Critical patent/SG10202002447WA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G01R1/071—Non contact-making probes containing electro-optic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318511—Wafer Test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG10202002447WA 2019-12-30 2020-03-17 Compact opto-electric probe SG10202002447WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16/730,338 US11243230B2 (en) 2019-12-30 2019-12-30 Compact opto-electric probe

Publications (1)

Publication Number Publication Date
SG10202002447WA true SG10202002447WA (en) 2021-07-29

Family

ID=69960438

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202002447WA SG10202002447WA (en) 2019-12-30 2020-03-17 Compact opto-electric probe

Country Status (6)

Country Link
US (2) US11243230B2 (en)
EP (1) EP3845913A1 (en)
KR (3) KR102295384B1 (en)
CN (1) CN113125935A (en)
SG (1) SG10202002447WA (en)
TW (1) TWI821533B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11243230B2 (en) 2019-12-30 2022-02-08 Juniper Networks, Inc. Compact opto-electric probe
US11885830B2 (en) * 2021-01-15 2024-01-30 Lumentum Operations Llc Probe tip assembly for testing optical components
WO2023235586A1 (en) * 2022-06-02 2023-12-07 Si-Ware Systems Opto-electrical probe card platform for wafer-level testing of optical mems structures
US20240159622A1 (en) * 2022-11-11 2024-05-16 Te Connectivity Solutions Gmbh Test probe for expanded beam connector

Family Cites Families (25)

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US4912399A (en) * 1987-06-09 1990-03-27 Tektronix, Inc. Multiple lead probe for integrated circuits in wafer form
JP3011504B2 (en) 1991-10-25 2000-02-21 株式会社東芝 Evaluation device for semiconductor light emitting device
US5583445A (en) * 1994-02-04 1996-12-10 Hughes Aircraft Company Opto-electronic membrane probe
US5631571A (en) * 1996-04-03 1997-05-20 The United States Of America As Represented By The Secretary Of The Air Force Infrared receiver wafer level probe testing
US6859031B2 (en) * 2002-02-01 2005-02-22 Credence Systems Corporation Apparatus and method for dynamic diagnostic testing of integrated circuits
CN100570386C (en) * 2004-03-08 2009-12-16 斯欧普迪克尔股份有限公司 Wafer-level opto-electronic testing apparatus and method
US7109739B2 (en) * 2004-03-08 2006-09-19 Sioptical, Inc. Wafer-level opto-electronic testing apparatus and method
US7459795B2 (en) 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
US7348786B2 (en) * 2004-08-31 2008-03-25 Georgia Tech Research Corporation Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication
FR2894339A1 (en) * 2005-12-05 2007-06-08 St Microelectronics Sa PROBE CARD FOR PHOTOSENSITIVE CHIP TESTS AND CORRESPONDING ILLUMINATION DEVICE.
JP5314634B2 (en) * 2010-05-17 2013-10-16 株式会社アドバンテスト Test apparatus, test method, and device interface
US9244099B2 (en) * 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
US9040896B2 (en) * 2011-07-01 2015-05-26 James Albert Walker Optoelectronic-device wafer probe and method therefor
TWI448704B (en) * 2011-10-12 2014-08-11 Advantest Corp Test device, test method and device interface
TWM444519U (en) * 2012-08-08 2013-01-01 Shining Technologies Co Ltd Multipoint tester for LED
CN104362108B (en) * 2014-09-23 2017-05-24 华进半导体封装先导技术研发中心有限公司 Photoelectric testing device
KR20160084014A (en) 2015-01-04 2016-07-13 김일 Contact Device for Test
US9612401B2 (en) * 2015-02-18 2017-04-04 Ciena Corporation Method and system for providing optical connections
KR101859386B1 (en) 2016-10-04 2018-05-18 피엠피(주) Optical Measurable Vertical Probe Card
EP3665491A1 (en) * 2017-08-07 2020-06-17 JENOPTIK Optical Systems GmbH Position-tolerance-insensitive contacting module for contacting optoelectronic chips
JP6781120B2 (en) 2017-08-18 2020-11-04 株式会社日本マイクロニクス Inspection equipment
DE102018108283A1 (en) * 2018-04-09 2019-10-10 Carl Zeiss Smt Gmbh Electro-optical circuit board for contacting photonic integrated circuits
US11002763B2 (en) * 2018-08-10 2021-05-11 Globalfoundries U.S. Inc. Probe for pic die with related test assembly and method
US20210055340A1 (en) * 2019-08-20 2021-02-25 Hermes Testing Solutions Inc. Probe card
US11243230B2 (en) 2019-12-30 2022-02-08 Juniper Networks, Inc. Compact opto-electric probe

Also Published As

Publication number Publication date
KR20210110264A (en) 2021-09-07
EP3845913A1 (en) 2021-07-07
KR20220111224A (en) 2022-08-09
CN113125935A (en) 2021-07-16
KR20210086393A (en) 2021-07-08
US20210199691A1 (en) 2021-07-01
TWI821533B (en) 2023-11-11
US20220107341A1 (en) 2022-04-07
KR102426696B1 (en) 2022-07-29
US11243230B2 (en) 2022-02-08
KR102295384B1 (en) 2021-08-31
TW202125661A (en) 2021-07-01
US11747363B2 (en) 2023-09-05
KR102517249B1 (en) 2023-03-31

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