TWI448704B - Test device, test method and device interface - Google Patents

Test device, test method and device interface Download PDF

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TWI448704B
TWI448704B TW100137006A TW100137006A TWI448704B TW I448704 B TWI448704 B TW I448704B TW 100137006 A TW100137006 A TW 100137006A TW 100137006 A TW100137006 A TW 100137006A TW I448704 B TWI448704 B TW I448704B
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test
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TW201316010A (en
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Shin Masuda
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Advantest Corp
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測試裝置、測試方法以及裝置介面Test device, test method and device interface

本發明是有關於一種測試裝置、測試方法以及裝置介面。The invention relates to a test device, a test method and a device interface.

先前,測試裝置對中央處理單元(Central Processing Unit,CPU)、記憶體等的被測試裝置進行測試。而且,提出有在被測試裝置中包括光學介面(例如參照專利文獻1、非專利文獻1及2)。Previously, the test apparatus tested the device under test such as a central processing unit (CPU), a memory, and the like. Further, it has been proposed to include an optical interface in the device under test (for example, refer to Patent Document 1, Non-Patent Documents 1 and 2).

專利文獻1:國際公開第2007-013128號Patent Document 1: International Publication No. 2007-013128

非專利文獻1:Ian A. Young,et al.,“Optical I/O Technology for Tera-Scale Computing”,IEEE Journal of Solid-State Circuits,January 2010,Vol. 45,No. 1,pp.235-248Non-Patent Document 1: Ian A. Young, et al., "Optical I/O Technology for Tera-Scale Computing", IEEE Journal of Solid-State Circuits, January 2010, Vol. 45, No. 1, pp. 235- 248

非專利文獻2:Hiren D. Thacker,James D. Meindl,“Prospects for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects”,IEEE International Test Conference,2006,25-1Non-Patent Document 2: Hiren D. Thacker, James D. Meindl, "Prospects for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects", IEEE International Test Conference, 2006, 25-1

非專利文獻3:Shin Masuda,et al.,“Liquid-crystal microlens with a beam-steering function”,APPLIED OPTICS,July 1997,Vol. 36,No. 20,pp.4772-4778Non-Patent Document 3: Shin Masuda, et al., "Liquid-crystal microlens with a beam-steering function", APPLIED OPTICS, July 1997, Vol. 36, No. 20, pp. 4772-4778

為了對包括光學介面的被測試裝置進行測試,而將光信號作為測試信號使用且輸入至被測試裝置的光輸入部,並且必需對自被測試裝置的光輸出部輸出的光響應信號進行檢測。對於測試裝置而言,要求此種光輸入輸出的精密的光軸調整,測試的處理量(throughput)降低而導致測試成本上升。進而,作為包括光學介面的被測試裝置的測試法,雖然能夠以安裝有光纖的封裝體的形態進行測試,但於性能小於規格值時必需廢棄每個封裝體,從而存在製造成本增加的問題。In order to test the device under test including the optical interface, the optical signal is used as a test signal and input to the light input portion of the device under test, and it is necessary to detect the optical response signal output from the light output portion of the device under test. For the test device, precise optical axis adjustment of such light input and output is required, and the throughput of the test is lowered to cause an increase in test cost. Further, as a test method of the device to be tested including the optical interface, the test can be performed in the form of a package in which an optical fiber is mounted. However, when the performance is less than the specification value, it is necessary to discard each package, and there is a problem that the manufacturing cost increases.

為解決上述課題,於本發明的第1態樣中,提供一種測試裝置及測試方法,該測試裝置用於對包括光耦合器的被測試裝置進行測試,上述光耦合器在與裝置面垂直的方向上傳輸光信號,上述測試裝置包括:基板,搭載著被測試裝置;光傳輸路徑,傳輸光信號;以及透鏡部,於基板上與光耦合器相對向而設置,且使來自光耦合器與光傳輸路徑的的端部的一方的光信號向另一方聚光。In order to solve the above problems, in a first aspect of the present invention, a test apparatus and a test method for testing a device under test including an optical coupler that is perpendicular to a device surface are provided. Transmitting an optical signal in a direction, the test device includes: a substrate on which the device under test is mounted; an optical transmission path for transmitting the optical signal; and a lens portion disposed on the substrate opposite to the optical coupler, and the optical coupler is provided One of the optical signals at the end of the optical transmission path is concentrated to the other.

此外,上述發明的概要並未列舉本發明的所有必要特徵。而且,該些特徵群的次組合(sub combination)亦可成為發明。Further, the summary of the above invention does not recite all of the essential features of the invention. Moreover, the sub combination of these feature groups can also be an invention.

以下,透過發明的實施形態來說明本發明,但以下的實施形態並不限定申請專利範圍所述的發明。而且,實施形態中所說明之特徵的所有組合不限於發明的解決手段所必需者。Hereinafter, the present invention will be described by way of embodiments of the invention, but the following embodiments do not limit the invention described in the claims. Furthermore, all combinations of the features described in the embodiments are not necessarily limited to the means for solving the invention.

圖1表示本實施形態的測試裝置100與被測試裝置10的介面的構成例。測試裝置100與類比電路、數位電路、記憶體及系統級晶片(System on Chip,SOC)等的具有光學介面的被測試裝置10收發光信號及電信號而進行測試。此處,被測試裝置10包括光耦合器12。而且,被測試裝置10亦可包括端子16。Fig. 1 shows an example of the configuration of an interface between the test apparatus 100 and the device under test 10 of the present embodiment. The test device 100 and the analog device, such as an analog circuit, a digital circuit, a memory, and a system-on-chip (SOC), which are optical interfaces, receive the illuminating signal and the electrical signal for testing. Here, the device under test 10 includes an optical coupler 12. Moreover, the device under test 10 can also include a terminal 16.

光耦合器12於與裝置面垂直的方向上傳輸光信號。光耦合器12例如與形成於被測試裝置10內部的光傳輸路徑或光學電路光學耦合而配置,並且與被測試裝置10的外部的光傳輸路徑或光學電路收發光信號。作為一例,光耦合器12輸入以預先規定的聚光位置及開口角的條件而可聚光的光束,並且輸出預先規定的開口角及聚光位置的光束。亦可取而代之,光耦合器12輸入以預先規定的聚光位置及光束直徑的條件而入射的平行光,並且輸出預先規定的光束直徑的平行光。The optical coupler 12 transmits optical signals in a direction perpendicular to the plane of the device. The optical coupler 12 is configured, for example, optically coupled to an optical transmission path or an optical circuit formed inside the device under test 10, and receives a light-emitting signal from an optical transmission path or an optical circuit outside the device under test 10. As an example, the optical coupler 12 receives a light beam that can be collected by a predetermined condensing position and an opening angle, and outputs a light beam having a predetermined opening angle and a condensing position. Alternatively, the photocoupler 12 may input parallel light incident under conditions of a predetermined condensing position and beam diameter, and output parallel light of a predetermined beam diameter.

端子16傳輸電信號。端子16可為焊接凸塊、焊點或連接器等。端子16可為收發電信號的1個以上的輸入端子及1個以上的輸出端子。Terminal 16 transmits an electrical signal. Terminals 16 can be solder bumps, solder joints or connectors, and the like. The terminal 16 can be one or more input terminals that transmit and receive electrical signals, and one or more output terminals.

測試裝置100為了與如上所述的被測試裝置10收發光信號及電信號而搭載被測試裝置10。測試裝置100包括基板110、光傳輸路徑120、透鏡部130、透鏡控制部140、光通信部150、電性通信部160、移動部170及移動控制部180。The test apparatus 100 mounts the device under test 10 in order to receive an illumination signal and an electric signal with the device under test 10 as described above. The test apparatus 100 includes a substrate 110, an optical transmission path 120, a lens unit 130, a lens control unit 140, an optical communication unit 150, an electrical communication unit 160, a moving unit 170, and a movement control unit 180.

基板110搭載著被測試裝置10。基板110包括吸附部112及抽吸部113。此處,基板110於與被測試裝置10收發電信號時可包含電極119。The device under test 10 is mounted on the substrate 110. The substrate 110 includes an adsorption portion 112 and a suction portion 113. Here, the substrate 110 may include an electrode 119 when transmitting and receiving an electrical signal to the device under test 10 .

吸附部112抽吸並吸附被測試裝置10。吸附部112形成於基板110的表面上且與被測試裝置10物理接觸而可抽吸並吸附被測試裝置10。而且,吸附部112於被測試裝置10與基板110之間密閉的情況下,亦可藉由抽吸密閉空間而吸附被測試裝置10。抽吸部113與泵等連接而自吸附部112抽吸空氣或基板110上的環境氣體等。The adsorption portion 112 suctions and adsorbs the device under test 10. The adsorption portion 112 is formed on the surface of the substrate 110 and is in physical contact with the device under test 10 to suction and adsorb the device under test 10. Further, when the adsorption unit 112 is sealed between the device under test 10 and the substrate 110, the device under test 10 can be adsorbed by suctioning the sealed space. The suction unit 113 is connected to a pump or the like to suck air or ambient gas or the like on the substrate 110 from the adsorption unit 112.

電極119與電性通信部160連接且與被測試裝置10的端子16接觸。電極119可為與端子16值接接觸的端子、探針、懸臂或膜片凸塊等。而且,電極119於端子16為連接器的情況下,可為與端子16嵌入的連接器。基板110例如具有被測試裝置10所包含的端子16的數目以上的電極119。The electrode 119 is connected to the electrical communication portion 160 and is in contact with the terminal 16 of the device under test 10. The electrode 119 can be a terminal, a probe, a cantilever or a diaphragm bump or the like that is in contact with the terminal 16 value. Further, in the case where the terminal 16 is a connector, the electrode 119 may be a connector embedded in the terminal 16. The substrate 110 has, for example, an electrode 119 of the number of terminals 16 included in the device under test 10 .

光傳輸路徑120傳輸光信號。光傳輸路徑120可為光纖,亦可取而代之而為光學波導管。光傳輸路徑120傳輸來自與一端連接的光通信部150的光信號,並且自另一端向透鏡部130輸出。光傳輸路徑120例如以預先規定的開口角輸出光信號。而且,光傳輸路徑120將自透鏡部130輸入至一端的光信號傳輸至與另一端連接的光通信部150。The optical transmission path 120 transmits an optical signal. The optical transmission path 120 can be an optical fiber or can be an optical waveguide instead. The optical transmission path 120 transmits an optical signal from the optical communication portion 150 connected to one end, and is outputted from the other end to the lens portion 130. The optical transmission path 120 outputs an optical signal, for example, at a predetermined opening angle. Moreover, the optical transmission path 120 transmits the optical signal input from the lens portion 130 to one end to the optical communication portion 150 connected to the other end.

透鏡部130於基板上與光耦合器12相對向而設置,且使來自光耦合器12與光傳輸路徑120的的端部的一方向的光信號向另一方向聚光。透鏡部130可為1個以上的光學透鏡。而且,透鏡部130包含焦距及焦點位置的至少一個為可變的變焦透鏡。而且,透鏡部130亦可包含焦距及焦點位置為固定的光學透鏡及變焦透鏡。此處,透鏡部130所包含的變焦透鏡可為根據電信號來對液晶的配向方向進行控制從而變更焦距及焦點位置的液晶透鏡。The lens portion 130 is provided on the substrate so as to face the photocoupler 12, and condenses light signals from one direction of the end portions of the optical coupler 12 and the optical transmission path 120 in the other direction. The lens portion 130 may be one or more optical lenses. Further, the lens portion 130 includes a zoom lens in which at least one of a focal length and a focus position is variable. Further, the lens portion 130 may include an optical lens and a zoom lens in which the focal length and the focal position are fixed. Here, the zoom lens included in the lens unit 130 may be a liquid crystal lens that controls the alignment direction of the liquid crystal according to an electric signal to change the focal length and the focus position.

亦可取而代之,變焦透鏡為使用了折射率根據電信號而變化的鉭鈮酸鉀(potassium tantalate niobate,KTN)、鋯鈦酸鉛(lead zirconate titanate,PZT)等的電性光學結晶的變焦透鏡。亦可取而代之,變焦透鏡為使用相互不會混合的液體彼此的界面作為光的折射面,且由液體的壓力來控制折射面形狀的變形透鏡(dynamorph lens)。亦可取而代之,變焦透鏡為藉由高分子致動器將聚矽氧凝膠向開口部擠壓,凝膠表面彎曲而成為透鏡的變焦透鏡。變焦透鏡可藉由透鏡控制部140來控制焦點。Alternatively, the zoom lens may be a zoom lens using an electrical optical crystal such as potassium tantalate niobate (KTN) or lead zirconate titanate (PZT) whose refractive index changes depending on an electric signal. Alternatively, the zoom lens may be a dynamorph lens that uses an interface between liquids that do not mix with each other as a refractive surface of light, and controls the shape of the refractive surface by the pressure of the liquid. Alternatively, the zoom lens may be a zoom lens in which a polyelectrolytic gel is pressed toward an opening by a polymer actuator, and the surface of the gel is bent to become a lens. The zoom lens can control the focus by the lens control unit 140.

透鏡控制部140對透鏡部130所包含的變焦透鏡的焦點進行控制。例如,透鏡控制部140更包括對準透鏡部130的焦距而確立光耦合的焦距控制部142,將透鏡部130的焦點位置對準光耦合器12的表面上。而且,透鏡控制部140更包括變更透鏡部130的焦點位置而確立光耦合的焦點位置控制部144,從而將透鏡部130的焦點位置對準位於光耦合器12的表面上的預先規定的聚光位置。而且,透鏡控制部140於透鏡部130包含焦點位置固定的透鏡及移動透鏡位置的移動平台的情況下,亦可將控制信號發送至移動平台而將固定透鏡的焦點位置對準光耦合器12的表面上及/或位於光耦合器12的表面上的預先規定的聚光位置。The lens control unit 140 controls the focus of the zoom lens included in the lens unit 130. For example, the lens control unit 140 further includes a focal length control unit 142 that aligns the focal length of the lens unit 130 to establish optical coupling, and aligns the focus position of the lens unit 130 with the surface of the optical coupler 12. Further, the lens control unit 140 further includes a focus position control unit 144 that changes the focus position of the lens unit 130 to establish optical coupling, and aligns the focus position of the lens unit 130 with a predetermined condensing light on the surface of the photocoupler 12. position. Further, when the lens unit 130 includes a lens having a fixed focal position and a moving platform for moving the lens position, the lens control unit 140 may transmit a control signal to the moving platform to align the focus position of the fixed lens with the optical coupler 12 . A predetermined concentrating position on the surface and/or on the surface of the optical coupler 12.

光通信部150經由光傳輸路徑120及透鏡部130而與被測試裝置10的光耦合器12連接,且與被測試裝置10之間傳輸光信號。光通信部150可搭載於基板110上,亦可取而代之而搭載於其他基板上。光通信部150例如將供給至被測試裝置10的電信號的測試信號轉換為光信號,並且將自被測試裝置10接收的光響應信號轉換為電信號的響應信號。The optical communication unit 150 is connected to the optical coupler 12 of the device under test 10 via the optical transmission path 120 and the lens unit 130, and transmits an optical signal to and from the device under test 10. The optical communication unit 150 may be mounted on the substrate 110 or may be mounted on another substrate instead. The optical communication unit 150 converts, for example, a test signal of an electrical signal supplied to the device under test 10 into an optical signal, and converts the optical response signal received from the device under test 10 into a response signal of the electrical signal.

電性通信部160經由電極119而與被測試裝置10之間傳輸電信號。電性通信部160可搭載於基板110上,亦可取而代之而搭載於作為其他基板的測試裝置100上。電性通信部160例如對被測試裝置10供給電源。而且,電性通信部160可對被測試裝置10供給頻率比光測試信號低的時脈信號及/或測試信號。The electrical communication unit 160 transmits an electrical signal to and between the devices under test via the electrode 119. The electrical communication unit 160 may be mounted on the substrate 110 or may be mounted on the test device 100 as another substrate. The electrical communication unit 160 supplies power to the device under test 10, for example. Moreover, the electrical communication unit 160 can supply the device under test 10 with a clock signal and/or a test signal having a lower frequency than the optical test signal.

移動部170吸附被測試裝置10並使其移動且搭載於基板110上。移動部170包含吸附部172及抽吸部174。吸附部172形成於移動部170的表面上且與被測試裝置10物理接觸而可抽吸並吸附被測試裝置10。抽吸部174與泵等連接而自吸附部172抽吸空氣或環境氣體等。移動部170包含XYZθ平台等,並且可藉由移動控制部180的控制信號來移動。The moving unit 170 adsorbs and moves the device under test 10 and mounts it on the substrate 110. The moving unit 170 includes an adsorption unit 172 and a suction unit 174. The adsorption portion 172 is formed on the surface of the moving portion 170 and is in physical contact with the device under test 10 to suck and adsorb the device under test 10. The suction unit 174 is connected to a pump or the like to suck air, ambient gas, or the like from the adsorption unit 172. The moving unit 170 includes an XYZθ stage or the like, and is movable by a control signal of the movement control unit 180.

移動控制部180對移動部170發送控制信號而使移動部170移動,並且對被測試裝置10與基板110的相對位置進行控制。移動控制部180可藉由感測器等來對移動部170的移動量進行檢測而獲取被測試裝置10與基板110的相對位置。例如,測試裝置100中,將基板110或移動部170的材質設為穿透紅外線的玻璃或矽,並且自移動部170的上方或基板110下方而向被測試裝置10照射紅外線。移動控制部180可藉由對穿透基板110或移動部170而照射被測試裝置10的紅外線的穿透光或反射光進行檢測,從而獲取被測試裝置10與基板110的相對位置。The movement control unit 180 transmits a control signal to the moving unit 170 to move the moving unit 170, and controls the relative position of the device under test 10 and the substrate 110. The movement control unit 180 can detect the relative movement position of the device under test 110 and the substrate 110 by detecting the amount of movement of the moving portion 170 by a sensor or the like. For example, in the test apparatus 100, the material of the substrate 110 or the moving portion 170 is made of glass or enamel that penetrates infrared rays, and infrared rays are irradiated to the device under test 10 from above the moving portion 170 or below the substrate 110. The movement control unit 180 can detect the transmitted light or the reflected light of the infrared ray of the device under test by the substrate 110 or the moving portion 170, thereby acquiring the relative position of the device under test 10 and the substrate 110.

此處,基板110及/或移動部170可具有應照射紅外光的對準標記。移動控制部180可藉由對紅外光照射對準標記的基板110及/或移動部170的位置進行檢測,而獲得基板110及/或移動部170的位置對準。Here, the substrate 110 and/or the moving portion 170 may have alignment marks to be irradiated with infrared light. The movement control unit 180 can detect the position of the substrate 110 and/or the moving portion 170 by detecting the position of the substrate 110 and/or the moving portion 170 that illuminate the alignment mark with infrared light.

圖2表示本實施形態的測試裝置100的動作流程。測試裝置100將被測試裝置10吸附於移動部170(S200)。此處,測試裝置100可將移動部170及基板110的相對位置對準。Fig. 2 shows an operational flow of the test apparatus 100 of the present embodiment. The test apparatus 100 adsorbs the device under test 10 to the moving unit 170 (S200). Here, the test apparatus 100 can align the relative positions of the moving portion 170 and the substrate 110.

移動控制部180對移動部170發送控制信號而使被測試裝置10移動至搭載於基板110的位置(S210)。測試裝置100可對透鏡部130的焦點位置進行調整,因此作為一例,於使被測試裝置10的端子16與基板110的電極119電性連接後來對透鏡部130的焦點位置進行調整。因此,測試裝置100使被測試裝置10移動至使被測試裝置10的端子16與基板110的電極119物理接觸的位置。The movement control unit 180 transmits a control signal to the moving unit 170 to move the device under test 10 to a position mounted on the substrate 110 (S210). Since the test apparatus 100 can adjust the focus position of the lens unit 130, the focus position of the lens unit 130 is adjusted after the terminal 16 of the device under test 10 is electrically connected to the electrode 119 of the substrate 110 as an example. Therefore, the test apparatus 100 moves the device under test 10 to a position where the terminal 16 of the device under test 10 is in physical contact with the electrode 119 of the substrate 110.

繼而,測試裝置100使被測試裝置10吸附於基板110上(S220)。藉此,測試裝置100於確保電性連接的狀態下將被測試裝置10搭載於基板110上。Then, the test apparatus 100 causes the device under test 10 to be adsorbed on the substrate 110 (S220). Thereby, the test apparatus 100 mounts the device under test 10 on the substrate 110 while ensuring electrical connection.

測試裝置100對被測試裝置10的電性連接進行測試(S230)。測試裝置100自電性通信部160將預先規定的電信號即例如預先規定的Hi/Lo等邏輯值或圖案的電信號經由電極119而供給至端子16。繼而,測試裝置100經由電極119而由電性通信部160接收自端子16輸出的響應信號,並對電信號的連接狀態進行測試。The test apparatus 100 tests the electrical connection of the device under test 10 (S230). The test apparatus 100 is supplied from the electrical communication unit 160 to an electrical signal having a predetermined electrical signal, that is, a predetermined logical value or pattern such as Hi/Lo, to the terminal 16 via the electrode 119. Then, the test apparatus 100 receives the response signal output from the terminal 16 via the electrode 119 via the electrode 119, and tests the connection state of the electrical signal.

測試裝置100例如自電性通信部160供給固定電壓作為預先規定的電信號,並且由電性通信部160接收預先規定的範圍的電壓值,藉此判斷連接狀態為良好。於測試裝置100無法檢測到良好的連接狀態的情況下,改變被測試裝置10的位置。即,測試裝置100解除藉由基板110的吸附部112對被測試裝置10的吸附(S240),並返回至步驟S210而再度執行藉由移動部170進行的被測試裝置10對基板110上的搭載。測試裝置100可重複進行步驟S210至步驟S230的過程直至電性連接的測試結果變為良好為止。The test apparatus 100 supplies a fixed voltage as a predetermined electric signal from the electrical communication unit 160, for example, and the electrical communication unit 160 receives a voltage value of a predetermined range, thereby determining that the connection state is good. In the case where the test apparatus 100 cannot detect a good connection state, the position of the device under test 10 is changed. In other words, the test apparatus 100 releases the adsorption of the device under test 10 by the adsorption unit 112 of the substrate 110 (S240), and returns to step S210 to re-execute the mounting of the device under test 10 on the substrate 110 by the moving unit 170. . The test apparatus 100 may repeat the process of step S210 to step S230 until the test result of the electrical connection becomes good.

此處,於測試裝置100即便重複進行被測試裝置10的搭載而電性連接測試結果亦未變為良好的情況下,可判斷被測試裝置10為不良。例如,於測試裝置100即便以預先規定的次數重複進行被測試裝置10的搭載而電性連接測試亦為不良的情況下,判斷被測試裝置10的電性介面為不良並結束該被測試裝置10的測試。Here, when the test apparatus 100 repeatedly performs the mounting of the device under test 10 and the electrical connection test result does not become good, it can be determined that the device under test 10 is defective. For example, when the test apparatus 100 repeatedly performs the mounting of the device under test 10 and the electrical connection test is defective, the electrical interface of the device under test 10 is determined to be defective, and the device under test 10 is terminated. Test.

測試裝置100於被測試裝置10的電性連接測試為良好的情況下,對透鏡部130的焦點進行調整(S250)。例如,測試裝置100自透鏡控制部140的焦距控制部142發送控制信號,並將透鏡部130的焦距對準光耦合器12的表面上。此處,焦距控制部142可使透鏡部130的焦距符合預先規定的距離。測試裝置100可預先對透鏡部130與光耦合器12的距離進行測定並加以記錄,讀出所記錄的距離且使其與透鏡部130的焦距相符。When the electrical connection test of the device under test 10 is good, the test apparatus 100 adjusts the focus of the lens unit 130 (S250). For example, the test apparatus 100 transmits a control signal from the focal length control section 142 of the lens control section 140, and aligns the focal length of the lens section 130 with the surface of the optical coupler 12. Here, the focal length control unit 142 can make the focal length of the lens unit 130 conform to a predetermined distance. The test apparatus 100 can measure and record the distance between the lens unit 130 and the photocoupler 12 in advance, and read the recorded distance to match the focal length of the lens unit 130.

亦可取而代之,透鏡部130包含光檢測部,該光檢測部對自光傳輸路徑120輸出的光信號於光耦合器12的表面上的反射光或散射光的成分進行檢測,焦距控制部142可根據光檢測部所觀察的反射光或散射光的強度來對準焦距。例如,透鏡部130於將焦距對準光耦合器12的表面上的情況下,自光傳輸路徑120輸出的光信號聚光於光耦合器12的表面上的1點,因此反射光及散射光強度變為最強。因此,測試裝置100可使固定強度的光輸出自光通信部150輸出並經由光傳輸路徑120而向光耦合器12的表面照射,且改變透鏡部130的焦距,從而符合光耦合器12的表面上所產生的反射光或散射光為最強的焦距並加以固定。Alternatively, the lens unit 130 may include a light detecting unit that detects a component of the reflected light or the scattered light on the surface of the optical coupler 12 from the optical signal output from the optical transmission path 120, and the focal length control unit 142 may The focal length is aligned in accordance with the intensity of the reflected light or the scattered light observed by the light detecting portion. For example, in the case where the lens portion 130 is aligned on the surface of the photocoupler 12, the optical signal output from the optical transmission path 120 is condensed at one point on the surface of the optical coupler 12, thus reflecting light and scattered light. The intensity becomes the strongest. Therefore, the test apparatus 100 can output a fixed-intensity light output from the optical communication portion 150 and irradiate the surface of the optical coupler 12 via the optical transmission path 120, and change the focal length of the lens portion 130 so as to conform to the surface of the optical coupler 12. The reflected or scattered light generated on the surface is the strongest focal length and fixed.

亦可取而代之,透鏡部130為了對與光耦合器12的距離進行測定而包含距離計,該距離計藉由對光耦合器12照射雷射光等並接收由光耦合器12的表面所反射的反射光來觀察與光耦合器12的距離,焦距控制部142可根據距離計所觀察的透鏡部130與光耦合器12的距離來對準焦距。Alternatively, the lens unit 130 may include a distance meter for measuring the distance from the photocoupler 12, and the distance meter receives the reflection reflected by the surface of the optical coupler 12 by irradiating the optical coupler 12 with laser light or the like. The distance from the optical coupler 12 is observed by light, and the focal length control unit 142 can align the focal length according to the distance between the lens portion 130 and the optical coupler 12 observed by the distance meter.

測試裝置100可於將透鏡部130的焦距對準光耦合器12的表面上後,於光耦合器12的表面上變更透鏡部130的焦點位置,從而對準位於光耦合器12的表面上的預先規定的聚光位置。例如,測試裝置100自透鏡控制部140的焦點位置控制部144發送控制信號,並且將透鏡部130的焦點位置對準光耦合器12的表面上。The test apparatus 100 can change the focus position of the lens portion 130 on the surface of the optical coupler 12 after aligning the focal length of the lens portion 130 on the surface of the optical coupler 12 so as to be aligned on the surface of the optical coupler 12. Pre-defined concentrating position. For example, the test apparatus 100 transmits a control signal from the focus position control section 144 of the lens control section 140, and aligns the focus position of the lens section 130 with the surface of the photocoupler 12.

此處,焦點位置控制部144例如一面使透鏡部130的焦點位置於與透鏡平行的面內呈螺旋狀移動一面對光耦合的狀態進行檢測,並對光耦合所確立的焦點位置進行檢測。亦可取而代之,焦點位置控制部144一面使透鏡部130的焦點位置於與透鏡平行的面內在多條直線上移動一面掃描光耦合的狀態而進行檢測,從而對光耦合所確立的焦點位置進行檢測。藉此,焦點位置控制部144連續地掃描透鏡部130的焦點位置且對準位於光耦合器12的表面上的預先規定的聚光位置,因此可高速地對準焦點位置。Here, the focus position control unit 144 detects the focus position of the lens unit 130 in a state in which the focus position of the lens unit 130 is spirally moved in a plane parallel to the lens, and detects the focus position established by the optical coupling. Alternatively, the focus position control unit 144 detects the focus position of the optical coupling by detecting the state in which the focal position of the lens unit 130 is moved in a plurality of straight lines in a plane parallel to the lens while scanning light is coupled. . Thereby, the focus position control section 144 continuously scans the focus position of the lens section 130 and aligns with a predetermined condensing position on the surface of the photocoupler 12, so that the focus position can be aligned at high speed.

而且,焦點位置控制部144亦可擴大透鏡部130的焦點直徑且變更焦點而粗調整至可確立光耦合的焦點位置附近為止,其後縮小焦點直徑且對焦點位置進行微調整。藉此,焦點位置控制部144與擴大透鏡部130的焦點直徑之前相比,可縮短於光耦合器12的表面上進行掃描的距離,並且可更高速地對準焦點位置。Further, the focus position control unit 144 can enlarge the focus diameter of the lens unit 130, change the focus, and coarsely adjust to the vicinity of the focus position at which optical coupling can be established, and then reduce the focus diameter and finely adjust the focus position. Thereby, the focus position control unit 144 can shorten the distance for scanning on the surface of the photocoupler 12 and can align the focus position at a higher speed than before the focus diameter of the lens unit 130 is enlarged.

此處,被測試裝置10接收入射至光耦合器12的光信號,並且可由電信號或光信號而將所接收到的光信號強度是否為預先規定的光強度範圍內通知到測試裝置100中。亦可取而代之,被測試裝置10對自光耦合器12接收的光信號強度進行檢測,並且由電信號或光信號而通知到測試裝置100中。亦可取而代之,被測試裝置10將自光耦合器12接收的光信號的一部分由光信號而發送至測試裝置100。於此情況下,被測試裝置10可藉由光分支耦合器等將自光耦合器12接收的光信號分支,使其中一個入射至內部的光學電路且將另一個發送至測試裝置100。亦可取而代之,於被測試裝置10對透鏡部130的焦點進行調整的情況下,可藉由光開關等來進行切換而將自光耦合器12接收的光信號發送至測試裝置100。Here, the device under test 10 receives the optical signal incident on the optical coupler 12, and can notify the test device 100 whether the received optical signal strength is within a predetermined light intensity range by an electrical signal or an optical signal. Alternatively, the device under test 10 may detect the intensity of the optical signal received from the optical coupler 12 and notify the test device 100 of the electrical or optical signal. Alternatively, the device under test 10 transmits a portion of the optical signal received from the optical coupler 12 to the test device 100 from the optical signal. In this case, the device under test 10 may branch the optical signal received from the optical coupler 12 by a light branching coupler or the like, causing one of them to be incident to the internal optical circuit and the other to the test device 100. Alternatively, when the device under test 10 adjusts the focus of the lens unit 130, the optical signal received from the photocoupler 12 can be transmitted to the test apparatus 100 by switching with an optical switch or the like.

測試裝置100可根據經由透鏡部130照射至光耦合器12的光信號且根據自被測試裝置10發送的電信號或光信號,而將透鏡部130的焦點位置對準光耦合器12的表面上,從而對光連接進行測試(S260)。例如,於自被測試裝置10發送的信號為電信號的情況下,使用至步驟S230為止所確立的電性連接來收發電信號,並判別是否可準確調整透鏡部130的焦點位置。亦可取而代之,於自被測試裝置10發送的信號為光信號的情況下,基板110更包括對該光信號進行檢測的光檢測部,並且可根據所檢測的光信號來判別是否可準確調整透鏡部130的焦點位置。The test apparatus 100 can align the focus position of the lens portion 130 on the surface of the photocoupler 12 according to the optical signal irradiated to the optical coupler 12 via the lens portion 130 and according to an electric signal or an optical signal transmitted from the device under test 10. , thereby testing the optical connection (S260). For example, when the signal transmitted from the device under test 10 is an electrical signal, the electrical signal is transmitted and received using the electrical connection established up to step S230, and it is determined whether or not the focus position of the lens unit 130 can be accurately adjusted. Alternatively, in the case where the signal transmitted from the device under test 10 is an optical signal, the substrate 110 further includes a light detecting portion that detects the optical signal, and can determine whether the lens can be accurately adjusted according to the detected optical signal. The focus position of the portion 130.

測試裝置100於光連接為不良的情況下,改變透鏡部130的焦點位置。即,測試裝置100可重複進行步驟S250至步驟S260的過程直至光連接的測試結果變為良好為止。The test apparatus 100 changes the focus position of the lens unit 130 in the case where the optical connection is defective. That is, the test apparatus 100 can repeat the process of step S250 to step S260 until the test result of the optical connection becomes good.

此處,於測試裝置100即便重複進行透鏡部130的焦點位置的變更而光連接測試結果亦未變為良好的情況下,可判斷被測試裝置10為不良。例如,於測試裝置100即便以預先規定的時間或次數重複進行透鏡部130的焦點位置的變更而光連接測試亦為不良的情況下,判斷被測試裝置10的光學介面及/或光學介面與電性介面的相對位置等為不良,並結束該被測試裝置10的測試。Here, when the test apparatus 100 repeatedly changes the focus position of the lens unit 130 and the optical connection test result does not become good, it can be determined that the device under test 10 is defective. For example, when the test apparatus 100 repeats the change of the focus position of the lens unit 130 for a predetermined time or number of times and the optical connection test is defective, the optical interface and/or the optical interface of the device under test 10 are determined. The relative position of the interface is bad, and the test of the device under test 10 is ended.

測試裝置100於獲得良好的光連接的情況下,使被測試裝置10與基板110的連接測試結束,並解除移動部170的吸附(S270)。藉由以上本實例,測試裝置100獲得被測試裝置10與基板110的良好的光連接及電性連接,並且不進行光輸入輸出的精密的光軸調整便可將被測試裝置10搭載於基板110上。繼而,測試裝置100可開始被測試裝置10的動作測試。When the test apparatus 100 obtains a good optical connection, the connection test of the device under test 10 and the substrate 110 is completed, and the adsorption of the moving portion 170 is released (S270). According to the above example, the test apparatus 100 obtains a good optical connection and electrical connection between the device under test 10 and the substrate 110, and can mount the device under test 10 on the substrate 110 without performing precise optical axis adjustment of optical input and output. on. In turn, the test device 100 can begin the action test of the device under test 10.

於以上實例中,對測試裝置100調整透鏡部130的焦距及焦點位置而確立光耦合的示例進行了說明。亦可取而代之,測試裝置100預先記憶所確立的焦距及焦點位置的至少一個的透鏡部130的控制資訊,讀出所記憶的控制資訊且再現所確立的焦距及焦點位置的至少一個。藉此,測試裝置100可縮短確立光耦合的時間。而且,測試裝置100藉由將基於所記憶的控制資訊的相同焦距及焦點位置用於光耦合中,從而可觀察被測試裝置10所包括的光耦合器12的聚光位置的精度及/或偏差。In the above example, an example in which the test apparatus 100 adjusts the focal length and the focus position of the lens portion 130 to establish optical coupling has been described. Alternatively, the test apparatus 100 may previously store control information of the lens unit 130 of at least one of the established focal length and focus position, read out the stored control information, and reproduce at least one of the established focal length and focus position. Thereby, the test apparatus 100 can shorten the time for establishing optical coupling. Moreover, the test apparatus 100 can observe the accuracy and/or deviation of the condensing position of the optical coupler 12 included in the device under test 10 by using the same focal length and focus position based on the stored control information for optical coupling. .

圖3一併表示本實施形態的測試裝置100的構成例與被測試裝置10。本實例的測試裝置100中,對與圖1所示的本實施形態的測試裝置100的動作大致相同的部分附加相同的符號並省略說明。測試裝置100與類比電路、數位電路、類比/數位混載電路、記憶體及系統級晶片(SOC)等的包括用以於與裝置面垂直的方向上傳輸光信號的光耦合器的被測試裝置10收發光信號及電信號而進行測試。FIG. 3 also shows a configuration example of the test apparatus 100 of the present embodiment and the device under test 10. In the test apparatus 100 of the present embodiment, the same portions as those of the test apparatus 100 of the present embodiment shown in FIG. 1 are denoted by the same reference numerals, and their description is omitted. Test device 100 and analog device, digital circuit, analog/digital hybrid circuit, memory and system level chip (SOC), etc., including device under test 10 for transmitting optical signals in a direction perpendicular to the device surface The illuminating signal and the electrical signal are received for testing.

測試裝置100將基於用於對被測試裝置10進行測試的測試圖案的測試信號供給至被測試裝置10,並基於被測試裝置10根據測試信號而輸出的輸出信號來判定被測試裝置10是否優良。此處,測試裝置100供給至被測試裝置10的測試信號可為電信號及/或光信號,而且,被測試裝置10所輸出的輸出信號亦可為電信號及/或光信號。測試裝置100更包括信號產生部410、信號接收部420及比較部430。The test apparatus 100 supplies a test signal based on a test pattern for testing the device under test 10 to the device under test 10, and determines whether the device under test 10 is excellent based on an output signal output by the device under test 10 according to the test signal. Here, the test signal supplied from the test device 100 to the device under test 10 may be an electrical signal and/or an optical signal, and the output signal output by the device under test 10 may also be an electrical signal and/or an optical signal. The test apparatus 100 further includes a signal generating unit 410, a signal receiving unit 420, and a comparing unit 430.

信號產生部410根據測試程式而產生向被測試裝置10供給的多個測試信號。信號產生部410於將光測試信號供給至被測試裝置10時將測試信號發送至光通信部150。光通信部150將對接收到的測試信號進行電光轉換後的光測試信號供給至被測試裝置10中。而且,信號產生部410於將電信號的測試信號供給至被測試裝置10時將測試信號發送至光通信部150。光通信部150將接收到的測試信號供給至被測試裝置10中。信號產生部410可生成被測試裝置10根據測試信號而輸出的響應信號的期望值並發送至比較部430。The signal generation unit 410 generates a plurality of test signals supplied to the device under test 10 in accordance with the test program. The signal generating unit 410 transmits a test signal to the optical communication unit 150 when the optical test signal is supplied to the device under test 10 . The optical communication unit 150 supplies the optical test signal subjected to the electro-optical conversion of the received test signal to the device under test 10. Further, the signal generation unit 410 transmits a test signal to the optical communication unit 150 when the test signal of the electrical signal is supplied to the device under test 10. The optical communication unit 150 supplies the received test signal to the device under test 10. The signal generating section 410 can generate an expected value of the response signal output by the device under test 10 according to the test signal and transmit it to the comparing section 430.

於光通信部150接收到被測試裝置10根據電信號或光信號的測試信號而輸出的光響應信號的情況下,將對光響應信號進行光電轉換後的響應信號發送至信號接收部420。而且,於光通信部150接收到被測試裝置10根據電信號或光信號的測試信號而輸出的電信號的響應信號的情況下,將接收到的響應信號發送至信號接收部420。信號接收部420可將接收到的響應信號發送至比較部430。而且,信號接收部420亦可將接收到的響應信號記錄於記錄裝置中。When the optical communication unit 150 receives the optical response signal output by the device under test 10 based on the test signal of the electrical signal or the optical signal, the response signal obtained by photoelectrically converting the optical response signal is transmitted to the signal receiving unit 420. Further, when the optical communication unit 150 receives the response signal of the electrical signal output by the device under test 10 based on the electrical signal or the test signal of the optical signal, the received response signal is transmitted to the signal receiving unit 420. The signal receiving unit 420 can transmit the received response signal to the comparing unit 430. Further, the signal receiving unit 420 can also record the received response signal in the recording device.

比較部430將自信號產生部410接收的期望值與自比較部430接收的響應信號進行比較。測試裝置100可根據比較部430的比較結果來判定被測試裝置10是否優良。藉此,測試裝置100可與包括光耦合器的被測試裝置10收發光信號及電信號而進行測試。The comparison unit 430 compares the expected value received from the signal generation unit 410 with the response signal received from the comparison unit 430. The test apparatus 100 can determine whether the device under test 10 is excellent based on the comparison result of the comparison unit 430. Thereby, the test apparatus 100 can perform the test by receiving the illuminating signal and the electric signal with the device under test 10 including the optical coupler.

而且,測試裝置100藉由使電信號中難以傳輸的例如數百MHz以上的高頻信號作為光信號來傳輸,從而而可與被測試裝置10之間高速地收發測試信號及響應信號。藉此,測試裝置100例如亦能夠以實際的動作速度使被測試裝置10動作而實施測試。Further, the test apparatus 100 transmits a high-frequency signal of, for example, several hundred MHz or more which is difficult to transmit in an electric signal as an optical signal, so that the test signal and the response signal can be transmitted and received at high speed with the device under test 10. Thereby, the test apparatus 100 can also perform the test by operating the to-be-tested apparatus 10 at the actual operation speed, for example.

以上,使用實施形態來說明瞭本發明,但是本發明的技術性範圍並不限定於上述實施形態中所揭示的範圍。熟悉此技藝者當瞭解可於上述實施形態中附加多種變更或改良。根據申請專利範圍的揭示當瞭解,附加此種變更或改良的形態亦可包含於本發明的技術範圍內。The present invention has been described above using the embodiments, but the technical scope of the present invention is not limited to the scope disclosed in the above embodiments. Those skilled in the art will recognize that various modifications or improvements can be added to the above-described embodiments. It is to be understood from the disclosure of the scope of the invention that such modifications or improvements may be included in the technical scope of the present invention.

應注意到如下情況:申請專利範圍、說明書以及圖式中所示的裝置、系統、程式以及方法中的動作、順序、步驟、以及階段等的各處理的執行順序,只要未特別明示為「比…更前」、「在…之前」等,而且,只要不是將前一個處理的輸出用於後一個處理,則可以任意的順序而實現。關於申請專利範圍、說明書、以及圖式中的動作流程,即使方便起見而使用「首先,」、「其次,」等進行了說明,但並不意味著必需以此順序來實施。It should be noted that the order of execution of the processes, the procedures, the steps, the stages, and the like in the devices, systems, programs, and methods shown in the claims, the description, and the drawings is not specifically stated as "Before", "Before", etc., and can be implemented in any order as long as the output of the previous process is not used for the latter process. The operation flow in the patent application scope, the specification, and the drawings has been described using "first," "second," and the like for convenience, but it does not mean that it must be implemented in this order.

10...被測試裝置10. . . Tested device

12...光耦合器12. . . Optocoupler

16...端子16. . . Terminal

100...測試裝置100. . . Test device

110...基板110. . . Substrate

112...吸附部112. . . Adsorption section

113...抽吸部113. . . Pumping section

119...電極119. . . electrode

120...光傳輸路徑120. . . Optical transmission path

130...透鏡部130. . . Lens unit

140‧‧‧透鏡控制部140‧‧‧Lens Control Department

142‧‧‧焦距控制部142‧‧‧Focus Control Department

144‧‧‧焦點位置控制部144‧‧‧Focus position control

150‧‧‧光通信部150‧‧‧Light Communication Department

160‧‧‧電性通信部160‧‧‧Electric Communication Department

170‧‧‧移動部170‧‧‧moving department

172‧‧‧吸附部172‧‧‧Adsorption Department

174‧‧‧抽吸部174‧‧‧Sucking Department

180‧‧‧移動控制部180‧‧‧Mobile Control Department

410‧‧‧信號產生部410‧‧‧Signal Generation Department

420‧‧‧信號接收部420‧‧‧Signal Reception Department

430‧‧‧比較部430‧‧‧Comparative Department

圖1表示本實施形態的測試裝置100與被測試裝置10的介面的構成例。Fig. 1 shows an example of the configuration of an interface between the test apparatus 100 and the device under test 10 of the present embodiment.

圖2表示本實施形態的測試裝置100的動作流程。Fig. 2 shows an operational flow of the test apparatus 100 of the present embodiment.

圖3一併表示本實施形態的測試裝置100的構成例與被測試裝置10。FIG. 3 also shows a configuration example of the test apparatus 100 of the present embodiment and the device under test 10.

10...被測試裝置10. . . Tested device

12...光耦合器12. . . Optocoupler

16...端子16. . . Terminal

100...測試裝置100. . . Test device

110...基板110. . . Substrate

112...吸附部112. . . Adsorption section

113...抽吸部113. . . Pumping section

119...電極119. . . electrode

120...光傳輸路徑120. . . Optical transmission path

130...透鏡部130. . . Lens unit

140...透鏡控制部140. . . Lens control unit

142...焦距控制部142. . . Focal length control unit

144...焦點位置控制部144. . . Focus position control

150...光通信部150. . . Optical communication department

160...電性通信部160. . . Electrical communication department

170...移動部170. . . Mobile department

172...吸附部172. . . Adsorption section

174...抽吸部174. . . Pumping section

180...移動控制部180. . . Mobile control department

Claims (18)

一種測試裝置,用於對包括光耦合器的被測試裝置進行測試,上述光耦合器在與裝置面垂直的方向上傳輸光信號,上述測試裝置包括:基板,搭載上述被測試裝置;光傳輸路徑,傳輸上述光信號;透鏡部,於上述基板上與上述光耦合器相對向而設置,使來自上述光耦合器的光信號聚光;以及光通信部,該光通信部經由上述光傳輸路徑而與上述被測試裝置的上述光耦合器連接,並且傳輸基於上述被測試裝置的測試圖案的測試光信號到上述被測試裝置。 A testing device for testing a device under test including an optical coupler, wherein the optical coupler transmits an optical signal in a direction perpendicular to a device surface, the testing device comprising: a substrate carrying the device under test; and an optical transmission path Transmitting the optical signal; the lens portion is disposed on the substrate opposite to the optical coupler to condense an optical signal from the optical coupler; and the optical communication unit is configured to pass the optical transmission path Connected to the above-described optical coupler of the device under test described above, and transmits a test light signal based on the test pattern of the device under test to the device under test. 如申請專利範圍第1項所述之測試裝置,其中上述透鏡部包括焦距及焦點位置的至少一個為可變的變焦透鏡。 The test apparatus according to claim 1, wherein the lens portion includes a zoom lens in which at least one of a focal length and a focus position is variable. 如申請專利範圍第2項所述之測試裝置,其中上述變焦透鏡是藉由電信號來對液晶的配向方向進行控制,從而變更焦距及焦點位置的液晶透鏡。 The test apparatus according to claim 2, wherein the zoom lens is a liquid crystal lens that controls an alignment direction of the liquid crystal by an electric signal to change a focal length and a focus position. 如申請專利範圍第2項所述之測試裝置,更包括焦距控制部,該焦距控制部對準上述透鏡部的焦距而確立光耦合。 The test apparatus according to claim 2, further comprising a focal length control unit that establishes optical coupling by aligning a focal length of the lens portion. 如申請專利範圍第2項所述之測試裝置,其更包括焦點位置控制部,該焦點位置控制部變更上述透鏡部的焦點位置而確立光耦合。 The test apparatus according to claim 2, further comprising a focus position control unit that changes a focus position of the lens unit to establish optical coupling. 如申請專利範圍第5項所述之測試裝置,其中 上述焦點位置控制部一面使上述透鏡部的焦點位置於與透鏡平行的面內呈螺旋狀移動,一面對光耦合的狀態進行檢測,從而檢測光耦合所確立的焦點位置。 The test device of claim 5, wherein The focus position control unit detects the focus position of the lens unit in a spiral shape in a plane parallel to the lens, and detects a state in which the light is coupled. 如申請專利範圍第5項所述之測試裝置,其中上述焦點位置控制部擴大上述透鏡部的焦點直徑且變更焦點並粗調整至可確立光耦合的焦點位置附近為止,其後縮小焦點直徑且對焦點位置進行微調整。 The test apparatus according to claim 5, wherein the focus position control unit enlarges a focus diameter of the lens unit, changes a focus, and coarsely adjusts to a vicinity of a focus position at which optical coupling can be established, and thereafter reduces a focus diameter and The focus position is finely adjusted. 如申請專利範圍第5項所述之測試裝置,其中上述被測試裝置更包括用於傳輸電信號的端子,該測試裝置更包括與上述被測試裝置之間傳輸電信號的電性通信部,上述基板包括與上述電性通信部連接且與上述被測試裝置的端子接觸的電極,該測試裝置於使上述被測試裝置的端子與上述基板的電極電性連接後,對上述透鏡部的焦點位置進行調整。 The test device of claim 5, wherein the device under test further comprises a terminal for transmitting an electrical signal, the test device further comprising an electrical communication portion for transmitting an electrical signal to the device under test, The substrate includes an electrode connected to the electrical communication unit and in contact with a terminal of the device under test, and the test device electrically connects the terminal of the device under test to the electrode of the substrate, and then performs focus position on the lens portion Adjustment. 如申請專利範圍第2項所述之測試裝置,其中上述透鏡部包括焦距及焦點位置為固定的光學透鏡及變焦透鏡。 The test apparatus according to claim 2, wherein the lens portion includes an optical lens and a zoom lens whose focal length and focus position are fixed. 如申請專利範圍第1項所述之測試裝置,其中上述基板包括抽吸並吸附上述被測試裝置的吸附部。 The test apparatus of claim 1, wherein the substrate comprises an adsorption portion that sucks and adsorbs the device under test. 如申請專利範圍第1項至第10項中任一項所述之測試裝置,更包括移動部,該移動部以使上述被測試裝置搭載於上述基板上的方式來使上述被測試裝置移動。 The test apparatus according to any one of claims 1 to 10, further comprising a moving unit that moves the device under test such that the device under test is mounted on the substrate. 如申請專利範圍第1項所述之測試裝置,更包括比 較部,運作於比較上述光信號與一期望值信號。 For example, the test device described in claim 1 of the patent scope includes The comparison unit operates to compare the optical signal with an expected value signal. 如申請專利範圍第1項所述之測試裝置,更包括信號產生部,運作於根據一測試程式而產生上述測試光信號。 The test device of claim 1, further comprising a signal generating unit configured to generate the test light signal according to a test program. 如申請專利範圍第13項所述之測試裝置,其中上述信號產生部,產生一期望值並把該期望值傳送到一比較部。 The test apparatus according to claim 13, wherein the signal generating unit generates an expected value and transmits the expected value to a comparing unit. 一種測試方法,用於對包括光耦合器的被測試裝置進行測試,上述光耦合器在與裝置面垂直的方向上傳輸光信號,上述測試方法包括:基板搭載階段,將上述被測試裝置搭載於基板上;光傳輸階段,藉由光傳輸路徑傳輸上述光信號;聚光階段,將透鏡部於上述基板上與上述光耦合器相對向而設置,且由透鏡部使來自上述光耦合器與上述光傳輸路徑的端部的一方的光信號向另一方聚光;以及光通信階段,連接上述光傳輸路徑與上述被測試裝置的上述光耦合器,並且傳輸基於上述被測試裝置的測試圖案的測試光信號到上述被測試裝置。 A test method for testing a device under test including an optocoupler that transmits an optical signal in a direction perpendicular to a device surface, the test method comprising: a substrate mounting stage, mounting the device under test On the substrate; in the optical transmission phase, the optical signal is transmitted through the optical transmission path; in the concentrating phase, the lens portion is disposed on the substrate opposite to the optical coupler, and the optical coupling is used by the lens portion One optical signal of one end of the optical transmission path is condensed to the other; and an optical communication phase connecting the optical transmission path to the optical coupler of the device under test and transmitting a test pattern based on the device under test The light signal is sent to the device under test. 一種裝置介面,該裝置介面與包括光耦合器的裝置進行光信號的收發,上述光耦合器在與裝置面垂直的方向上傳輸光信號,上述裝置介面包括:基板,搭載著上述裝置;光傳輸路徑,傳輸上述光信號;以及透鏡部,於上述基板上與上述光耦合器相對向而設置,且使來自上述光耦合器光信號聚光, 上述透鏡部是焦距及焦點位置的至少一個為可變的變焦透鏡;以及光通信部,該光通信部經由上述光傳輸路徑而與上述裝置的上述光耦合器連接,並且傳輸基於上述裝置的測試圖案的測試光信號到上述裝置。 a device interface for transmitting and receiving optical signals to a device including an optical coupler, wherein the optical coupler transmits an optical signal in a direction perpendicular to a device surface, the device interface comprising: a substrate on which the device is mounted; and optical transmission a path for transmitting the optical signal; and a lens portion disposed on the substrate opposite to the optical coupler and concentrating the optical signal from the optical coupler, The lens unit is a zoom lens in which at least one of a focal length and a focus position is variable; and an optical communication unit that is connected to the optical coupler of the device via the optical transmission path and transmits a test based on the device The patterned test light signal is to the above device. 如申請專利範圍第16項所述之裝置介面,其中上述裝置介面對上述透鏡部的焦距及焦點位置的至少一個進行調整而確立光耦合。 The device interface of claim 16, wherein the device establishes optical coupling by adjusting at least one of a focal length and a focus position of the lens portion. 如申請專利範圍第16項或第17項所述之裝置介面,其中上述裝置介面預先記憶所確立的焦距及焦點位置的至少一個的上述透鏡部的控制資訊,讀出所記憶的控制資訊並且再現上述所確立的焦距及焦點位置的至少一個。The apparatus interface of claim 16 or 17, wherein the device interface pre-memorizes control information of the lens portion of at least one of the established focal length and focus position, reads the stored control information, and reproduces At least one of the focal length and the focus position established above.
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