SG10201913440TA - Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device - Google Patents
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceInfo
- Publication number
- SG10201913440TA SG10201913440TA SG10201913440TA SG10201913440TA SG10201913440TA SG 10201913440T A SG10201913440T A SG 10201913440TA SG 10201913440T A SG10201913440T A SG 10201913440TA SG 10201913440T A SG10201913440T A SG 10201913440TA SG 10201913440T A SG10201913440T A SG 10201913440TA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- joining
- semiconductor device
- joined body
- copper paste
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73221—Strap and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nanotechnology (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Powder Metallurgy (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
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SG11201801844XA SG11201801844XA (en) | 2015-09-07 | 2016-09-07 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device |
SG10201913440TA SG10201913440TA (en) | 2015-09-07 | 2016-09-07 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device |
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SG11201801844XA SG11201801844XA (en) | 2015-09-07 | 2016-09-07 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device |
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EP (2) | EP3348337B1 (zh) |
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KR (1) | KR102509767B1 (zh) |
CN (2) | CN107921540B (zh) |
MY (1) | MY189237A (zh) |
SG (2) | SG11201801844XA (zh) |
TW (1) | TWI745302B (zh) |
WO (1) | WO2017043541A1 (zh) |
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JP6381738B1 (ja) * | 2017-05-31 | 2018-08-29 | ニホンハンダ株式会社 | ペースト状金属粒子組成物、接合方法および電子装置の製造方法 |
JP6677231B2 (ja) | 2017-09-22 | 2020-04-08 | 日亜化学工業株式会社 | 電子部品の接合方法および接合体の製造方法 |
US11575076B2 (en) * | 2017-10-24 | 2023-02-07 | Showa Denko Materials Co., Ltd. | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module |
CN111868900A (zh) * | 2018-03-23 | 2020-10-30 | 三菱综合材料株式会社 | 电子组件安装模块的制造方法 |
CN112673715A (zh) * | 2018-09-14 | 2021-04-16 | 昭和电工材料株式会社 | 电子零件及电子零件的制造方法 |
KR102523866B1 (ko) | 2019-03-29 | 2023-04-21 | 미쓰이금속광업주식회사 | 가압 접합용 조성물, 그리고 도전체의 접합 구조 및 그 제조 방법 |
WO2020208739A1 (ja) * | 2019-04-10 | 2020-10-15 | 新電元工業株式会社 | 半導体装置 |
CN110060973B (zh) * | 2019-04-24 | 2021-07-30 | 深圳第三代半导体研究院 | 一种纳米金属膜模块制备方法及其基板制备方法 |
TW202115744A (zh) * | 2019-09-30 | 2021-04-16 | 日商日立化成股份有限公司 | 接合用的銅糊劑、接合體的製造方法和接合體 |
KR20220073763A (ko) * | 2019-09-30 | 2022-06-03 | 쇼와덴코머티리얼즈가부시끼가이샤 | 접합용 구리 페이스트, 접합체의 제조 방법 및 접합체 |
TW202140691A (zh) * | 2020-04-07 | 2021-11-01 | 日商昭和電工材料股份有限公司 | 銅糊、毛細結構的形成方法及熱管 |
CN114334221B (zh) * | 2022-01-10 | 2024-02-09 | 珠海方正科技多层电路板有限公司 | 一种塞孔铜浆及其制备方法、印刷线路板 |
CN116153860B (zh) * | 2023-04-10 | 2023-07-18 | 之江实验室 | 晶圆级铜铜凸点互连结构及其键合方法 |
CN116189960B (zh) * | 2023-04-19 | 2024-02-27 | 佛山科学技术学院 | 一种可低温烧结银铜复合导电浆料及其制备方法和应用 |
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JPS4928639B1 (zh) | 1969-06-17 | 1974-07-27 | ||
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JP4145127B2 (ja) | 2002-11-22 | 2008-09-03 | 三井金属鉱業株式会社 | フレーク銅粉及びそのフレーク銅粉の製造方法並びにそのフレーク銅粉を用いた導電性ペースト |
JP4296347B2 (ja) * | 2004-01-19 | 2009-07-15 | Dowaエレクトロニクス株式会社 | フレーク状銅粉およびその製造法 |
JP4247801B2 (ja) | 2006-11-24 | 2009-04-02 | ニホンハンダ株式会社 | ペースト状金属粒子組成物および接合方法 |
JP5006081B2 (ja) | 2007-03-28 | 2012-08-22 | 株式会社日立製作所 | 半導体装置、その製造方法、複合金属体及びその製造方法 |
JP4928639B2 (ja) | 2010-03-15 | 2012-05-09 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
US10046418B2 (en) | 2010-03-18 | 2018-08-14 | Furukawa Electric Co., Ltd. | Electrically conductive paste, and electrically conducive connection member produced using the paste |
JP4795483B1 (ja) | 2010-04-12 | 2011-10-19 | ニホンハンダ株式会社 | 金属製部材接合体の製造方法および金属製部材接合体 |
JP5962673B2 (ja) * | 2012-01-31 | 2016-08-03 | 株式会社村田製作所 | 金属端子接合用導電ペースト、金属端子付き電子部品およびその製造方法 |
JP5598739B2 (ja) * | 2012-05-18 | 2014-10-01 | 株式会社マテリアル・コンセプト | 導電性ペースト |
JP5980574B2 (ja) * | 2012-05-29 | 2016-08-31 | ハリマ化成株式会社 | 導電性金属厚膜形成用材料および導電性金属厚膜の形成方法 |
JP6199048B2 (ja) * | 2013-02-28 | 2017-09-20 | 国立大学法人大阪大学 | 接合材 |
JP6032110B2 (ja) | 2013-04-17 | 2016-11-24 | 株式会社豊田中央研究所 | 金属ナノ粒子材料、それを含有する接合材料、およびそれを用いた半導体装置 |
JP6130209B2 (ja) * | 2013-05-14 | 2017-05-17 | Dowaエレクトロニクス株式会社 | 導電膜 |
US9799421B2 (en) * | 2013-06-07 | 2017-10-24 | Heraeus Precious Metals North America Conshohocken Llc | Thick print copper pastes for aluminum nitride substrates |
JP6303392B2 (ja) | 2013-10-22 | 2018-04-04 | 日立化成株式会社 | 銀ペースト及びそれを用いた半導体装置、並びに銀ペーストの製造方法 |
WO2015098658A1 (ja) * | 2013-12-24 | 2015-07-02 | Dic株式会社 | 金属ナノ粒子を含有する接合用材料 |
JP2015142059A (ja) * | 2014-01-30 | 2015-08-03 | 株式会社日立製作所 | パワー半導体モジュール |
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2016
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- 2016-09-07 US US15/757,896 patent/US11040416B2/en active Active
- 2016-09-07 CN CN201680051483.5A patent/CN107921540B/zh active Active
- 2016-09-07 SG SG11201801844XA patent/SG11201801844XA/en unknown
- 2016-09-07 CN CN202010103624.1A patent/CN111230125A/zh active Pending
- 2016-09-07 SG SG10201913440TA patent/SG10201913440TA/en unknown
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CN111230125A (zh) | 2020-06-05 |
EP3348337B1 (en) | 2020-06-10 |
JP6819598B2 (ja) | 2021-01-27 |
WO2017043541A1 (ja) | 2017-03-16 |
KR20180050714A (ko) | 2018-05-15 |
CN107921540A (zh) | 2018-04-17 |
JP2021064612A (ja) | 2021-04-22 |
CN107921540B (zh) | 2020-03-03 |
TW201718442A (zh) | 2017-06-01 |
MY189237A (en) | 2022-01-31 |
EP3348337A4 (en) | 2019-05-15 |
JP7232236B2 (ja) | 2023-03-02 |
EP3348337A1 (en) | 2018-07-18 |
EP3702072A1 (en) | 2020-09-02 |
JP7396398B2 (ja) | 2023-12-12 |
US11040416B2 (en) | 2021-06-22 |
US20200108471A1 (en) | 2020-04-09 |
TWI745302B (zh) | 2021-11-11 |
SG11201801844XA (en) | 2018-04-27 |
KR102509767B1 (ko) | 2023-03-14 |
JPWO2017043541A1 (ja) | 2018-07-05 |
JP2022130365A (ja) | 2022-09-06 |
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