SG10201910447XA - Electrical connecting apparatus - Google Patents

Electrical connecting apparatus

Info

Publication number
SG10201910447XA
SG10201910447XA SG10201910447XA SG10201910447XA SG10201910447XA SG 10201910447X A SG10201910447X A SG 10201910447XA SG 10201910447X A SG10201910447X A SG 10201910447XA SG 10201910447X A SG10201910447X A SG 10201910447XA SG 10201910447X A SG10201910447X A SG 10201910447XA
Authority
SG
Singapore
Prior art keywords
electrical connecting
connecting apparatus
electrical
Prior art date
Application number
SG10201910447XA
Other languages
English (en)
Inventor
Kudo Toshiyuki
Narumi Takayuki
Kikuchi Yoshinori
Yasuta Takao
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of SG10201910447XA publication Critical patent/SG10201910447XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
SG10201910447XA 2018-12-13 2019-11-08 Electrical connecting apparatus SG10201910447XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018233811A JP7262990B2 (ja) 2018-12-13 2018-12-13 電気的接続装置

Publications (1)

Publication Number Publication Date
SG10201910447XA true SG10201910447XA (en) 2020-07-29

Family

ID=71073588

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201910447XA SG10201910447XA (en) 2018-12-13 2019-11-08 Electrical connecting apparatus

Country Status (4)

Country Link
US (1) US11067602B2 (enrdf_load_stackoverflow)
JP (1) JP7262990B2 (enrdf_load_stackoverflow)
SG (1) SG10201910447XA (enrdf_load_stackoverflow)
TW (1) TWI742465B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11022628B2 (en) * 2019-09-13 2021-06-01 Reid-Ashman Manufacturing, Inc. Probe card support apparatus for automatic test equipment
TWI858524B (zh) * 2023-01-19 2024-10-11 旺矽科技股份有限公司 電路板檢測設備

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
KR100707044B1 (ko) 1999-05-27 2007-04-13 나노넥서스, 인코포레이티드 집적회로 웨이퍼 프로브카드 조립체의 구조물 및 그 제조방법
US7884627B2 (en) * 2006-12-29 2011-02-08 Formfactor, Inc. Stiffener assembly for use with testing devices
US8901950B2 (en) * 2009-02-19 2014-12-02 Advantest America, Inc Probe head for a microelectronic contactor assembly, and methods of making same
JP5499303B2 (ja) 2011-02-04 2014-05-21 株式会社日本マイクロニクス プローブカードの配線基板調整治具及び配線基板修正方法並びに配線基板調整治具を用いて調整されたプローブカードを用いた検査方法及び検査システム
JP6076695B2 (ja) * 2012-10-30 2017-02-08 株式会社日本マイクロニクス 検査ユニット、プローブカード、検査装置及び検査装置の制御システム
JP6374642B2 (ja) 2012-11-28 2018-08-15 株式会社日本マイクロニクス プローブカード及び検査装置
JP6110117B2 (ja) 2012-11-29 2017-04-05 株式会社日本マイクロニクス プローブ組立体及びプローブ基板
JP6084882B2 (ja) 2013-04-04 2017-02-22 株式会社日本マイクロニクス プローブ組立体及びプローブ基板
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置

Also Published As

Publication number Publication date
JP7262990B2 (ja) 2023-04-24
US20200191829A1 (en) 2020-06-18
JP2020094941A (ja) 2020-06-18
TWI742465B (zh) 2021-10-11
US11067602B2 (en) 2021-07-20
TW202032134A (zh) 2020-09-01

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