SG10201910447XA - Electrical connecting apparatus - Google Patents
Electrical connecting apparatusInfo
- Publication number
- SG10201910447XA SG10201910447XA SG10201910447XA SG10201910447XA SG10201910447XA SG 10201910447X A SG10201910447X A SG 10201910447XA SG 10201910447X A SG10201910447X A SG 10201910447XA SG 10201910447X A SG10201910447X A SG 10201910447XA SG 10201910447X A SG10201910447X A SG 10201910447XA
- Authority
- SG
- Singapore
- Prior art keywords
- electrical connecting
- connecting apparatus
- electrical
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018233811A JP7262990B2 (en) | 2018-12-13 | 2018-12-13 | Electrical connection device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201910447XA true SG10201910447XA (en) | 2020-07-29 |
Family
ID=71073588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201910447XA SG10201910447XA (en) | 2018-12-13 | 2019-11-08 | Electrical connecting apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US11067602B2 (en) |
JP (1) | JP7262990B2 (en) |
SG (1) | SG10201910447XA (en) |
TW (1) | TWI742465B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11022628B2 (en) * | 2019-09-13 | 2021-06-01 | Reid-Ashman Manufacturing, Inc. | Probe card support apparatus for automatic test equipment |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7064566B2 (en) * | 1993-11-16 | 2006-06-20 | Formfactor, Inc. | Probe card assembly and kit |
WO2000074110A2 (en) | 1999-05-27 | 2000-12-07 | Nanonexus, Inc. | Integrated circuit wafer probe card assembly |
US7884627B2 (en) * | 2006-12-29 | 2011-02-08 | Formfactor, Inc. | Stiffener assembly for use with testing devices |
WO2010096711A2 (en) * | 2009-02-19 | 2010-08-26 | Touchdown Technologies, Inc. | Probe head for a microelectronic contactor assembly, and methods of making same |
JP5499303B2 (en) * | 2011-02-04 | 2014-05-21 | 株式会社日本マイクロニクス | Probe card wiring board adjustment jig, wiring board correction method, and inspection method and inspection system using a probe card adjusted using the wiring board adjustment jig |
JP6076695B2 (en) * | 2012-10-30 | 2017-02-08 | 株式会社日本マイクロニクス | Inspection unit, probe card, inspection device, and control system for inspection device |
JP6374642B2 (en) * | 2012-11-28 | 2018-08-15 | 株式会社日本マイクロニクス | Probe card and inspection device |
JP6110117B2 (en) * | 2012-11-29 | 2017-04-05 | 株式会社日本マイクロニクス | Probe assembly and probe board |
JP6084882B2 (en) * | 2013-04-04 | 2017-02-22 | 株式会社日本マイクロニクス | Probe assembly and probe board |
JP7075725B2 (en) * | 2017-05-30 | 2022-05-26 | 株式会社日本マイクロニクス | Electrical connection device |
-
2018
- 2018-12-13 JP JP2018233811A patent/JP7262990B2/en active Active
-
2019
- 2019-11-08 US US16/677,887 patent/US11067602B2/en active Active
- 2019-11-08 SG SG10201910447XA patent/SG10201910447XA/en unknown
- 2019-11-15 TW TW108141512A patent/TWI742465B/en active
Also Published As
Publication number | Publication date |
---|---|
US20200191829A1 (en) | 2020-06-18 |
TW202032134A (en) | 2020-09-01 |
US11067602B2 (en) | 2021-07-20 |
TWI742465B (en) | 2021-10-11 |
JP2020094941A (en) | 2020-06-18 |
JP7262990B2 (en) | 2023-04-24 |
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