SG10201904917VA - Thermal management with variable conductance heat pipe - Google Patents

Thermal management with variable conductance heat pipe

Info

Publication number
SG10201904917VA
SG10201904917VA SG10201904917VA SG10201904917VA SG10201904917VA SG 10201904917V A SG10201904917V A SG 10201904917VA SG 10201904917V A SG10201904917V A SG 10201904917VA SG 10201904917V A SG10201904917V A SG 10201904917VA SG 10201904917V A SG10201904917V A SG 10201904917VA
Authority
SG
Singapore
Prior art keywords
heat pipe
thermal management
variable conductance
conductance heat
variable
Prior art date
Application number
SG10201904917VA
Other languages
English (en)
Inventor
Roberto Marcoccia
Brian Robert Koch
Theodore J Schmidt
Christopher Paul Wyland
Robert S Guzzon
Gregory Alan Fish
Original Assignee
Juniper Networks Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juniper Networks Inc filed Critical Juniper Networks Inc
Publication of SG10201904917VA publication Critical patent/SG10201904917VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG10201904917VA 2018-06-29 2019-05-30 Thermal management with variable conductance heat pipe SG10201904917VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16/022,924 US11051431B2 (en) 2018-06-29 2018-06-29 Thermal management with variable conductance heat pipe

Publications (1)

Publication Number Publication Date
SG10201904917VA true SG10201904917VA (en) 2020-01-30

Family

ID=67145512

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201904917VA SG10201904917VA (en) 2018-06-29 2019-05-30 Thermal management with variable conductance heat pipe

Country Status (6)

Country Link
US (2) US11051431B2 (zh)
EP (1) EP3589100A1 (zh)
KR (2) KR102334791B1 (zh)
CN (2) CN113534365B (zh)
SG (1) SG10201904917VA (zh)
TW (2) TW202203399A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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US11051431B2 (en) 2018-06-29 2021-06-29 Juniper Networks, Inc. Thermal management with variable conductance heat pipe
WO2020018484A1 (en) * 2018-07-18 2020-01-23 Thermal Corp. Heat pipes having wick structures with variable permeability
US11013141B2 (en) * 2019-05-31 2021-05-18 Microsoft Technology Licensing, Llc Decoupled conduction/convection dual heat sink for on-board memory microcontrollers
US11243550B2 (en) * 2020-05-29 2022-02-08 Juniper Networks, Inc. Optical-electrical device using hybrid automated testing equipment
US11249264B2 (en) * 2020-07-02 2022-02-15 Google Llc Thermal optimizations for OSFP optical transceiver modules
EP4214457A1 (en) * 2020-09-18 2023-07-26 Honeywell International Inc. Low-pressure heat pipes and heat transfer methods using low-pressure for heat pipes
CN112357054B (zh) * 2020-11-19 2022-06-24 中国航天空气动力技术研究院 一种自启式防热结构及高速飞行器
US20210108860A1 (en) * 2020-12-22 2021-04-15 Devdatta Prakash Kulkarni Variable conductance heat pipes for improved reliability
JPWO2022149337A1 (zh) * 2021-01-06 2022-07-14
US20230139714A1 (en) * 2021-10-29 2023-05-04 The Boeing Company Mil-aero conduction cooling chassis

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US4917178A (en) * 1989-05-18 1990-04-17 Grumman Aerospace Corporation Heat pipe for reclaiming vaporized metal
US5253260A (en) 1991-12-20 1993-10-12 Hughes Aircraft Company Apparatus and method for passive heat pipe cooling of solid state laser heads
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Also Published As

Publication number Publication date
TW202006908A (zh) 2020-02-01
CN113534365A (zh) 2021-10-22
TW202203399A (zh) 2022-01-16
CN110658594A (zh) 2020-01-07
EP3589100A1 (en) 2020-01-01
US20200008321A1 (en) 2020-01-02
US20210227723A1 (en) 2021-07-22
CN110658594B (zh) 2021-07-27
KR20200002624A (ko) 2020-01-08
KR20210152425A (ko) 2021-12-15
US11653477B2 (en) 2023-05-16
US11051431B2 (en) 2021-06-29
KR102499249B1 (ko) 2023-02-10
KR102334791B1 (ko) 2021-12-06
TWI736910B (zh) 2021-08-21
CN113534365B (zh) 2023-02-17

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