SG10201904917VA - Thermal management with variable conductance heat pipe - Google Patents
Thermal management with variable conductance heat pipeInfo
- Publication number
- SG10201904917VA SG10201904917VA SG10201904917VA SG10201904917VA SG10201904917VA SG 10201904917V A SG10201904917V A SG 10201904917VA SG 10201904917V A SG10201904917V A SG 10201904917VA SG 10201904917V A SG10201904917V A SG 10201904917VA SG 10201904917V A SG10201904917V A SG 10201904917VA
- Authority
- SG
- Singapore
- Prior art keywords
- heat pipe
- thermal management
- variable conductance
- conductance heat
- variable
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/022,924 US11051431B2 (en) | 2018-06-29 | 2018-06-29 | Thermal management with variable conductance heat pipe |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201904917VA true SG10201904917VA (en) | 2020-01-30 |
Family
ID=67145512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201904917VA SG10201904917VA (en) | 2018-06-29 | 2019-05-30 | Thermal management with variable conductance heat pipe |
Country Status (6)
Country | Link |
---|---|
US (2) | US11051431B2 (en) |
EP (1) | EP3589100A1 (en) |
KR (2) | KR102334791B1 (en) |
CN (2) | CN110658594B (en) |
SG (1) | SG10201904917VA (en) |
TW (2) | TW202203399A (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11051431B2 (en) | 2018-06-29 | 2021-06-29 | Juniper Networks, Inc. | Thermal management with variable conductance heat pipe |
US11480394B2 (en) * | 2018-07-18 | 2022-10-25 | Aavid Thermal Corp. | Heat pipes having wick structures with variable permeability |
US11013141B2 (en) * | 2019-05-31 | 2021-05-18 | Microsoft Technology Licensing, Llc | Decoupled conduction/convection dual heat sink for on-board memory microcontrollers |
US11243550B2 (en) * | 2020-05-29 | 2022-02-08 | Juniper Networks, Inc. | Optical-electrical device using hybrid automated testing equipment |
US11249264B2 (en) * | 2020-07-02 | 2022-02-15 | Google Llc | Thermal optimizations for OSFP optical transceiver modules |
US20220107138A1 (en) * | 2020-09-18 | 2022-04-07 | Honeywell International Inc. | Low-pressure heat pipes and heat transfer methods using low-pressure for heat pipes |
CN112357054B (en) * | 2020-11-19 | 2022-06-24 | 中国航天空气动力技术研究院 | Self-starting type heat-proof structure and high-speed aircraft |
US20210108860A1 (en) * | 2020-12-22 | 2021-04-15 | Devdatta Prakash Kulkarni | Variable conductance heat pipes for improved reliability |
WO2022149337A1 (en) * | 2021-01-06 | 2022-07-14 | 株式会社フジクラ | Optical transceiver |
US20230139714A1 (en) * | 2021-10-29 | 2023-05-04 | The Boeing Company | Mil-aero conduction cooling chassis |
Family Cites Families (44)
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US3225820A (en) | 1962-11-01 | 1965-12-28 | Gen Precision Inc | Device for controlling temperature by heat conduction |
US3693374A (en) | 1970-11-18 | 1972-09-26 | Honeywell Inc | Variable temperature cooling apparatus |
JPS60202291A (en) * | 1984-03-26 | 1985-10-12 | Matsushita Electric Ind Co Ltd | Heat exchanger |
US4951740A (en) * | 1988-06-27 | 1990-08-28 | Texas A & M University System | Bellows heat pipe for thermal control of electronic components |
US4917178A (en) * | 1989-05-18 | 1990-04-17 | Grumman Aerospace Corporation | Heat pipe for reclaiming vaporized metal |
US5253260A (en) | 1991-12-20 | 1993-10-12 | Hughes Aircraft Company | Apparatus and method for passive heat pipe cooling of solid state laser heads |
US5269832A (en) * | 1992-06-03 | 1993-12-14 | Winfield Industries | Method and apparatus for continuously measuring the concentration of chemicals in solutions |
US5771967A (en) * | 1996-09-12 | 1998-06-30 | The United States Of America As Represented By The Secretary Of The Navy | Wick-interrupt temperature controlling heat pipe |
US6230790B1 (en) * | 1999-05-10 | 2001-05-15 | Lockheed Martin Corporation | Thermal control system for spacecraft |
US20030103880A1 (en) * | 2001-08-11 | 2003-06-05 | Bunk Kenneth J. | Fuel processor utilizing heat pipe cooling |
US6675887B2 (en) | 2002-03-26 | 2004-01-13 | Thermal Corp. | Multiple temperature sensitive devices using two heat pipes |
US6771498B2 (en) * | 2002-10-25 | 2004-08-03 | Thermal Corp. | Cooling system for hinged portable computing device |
CN100449244C (en) | 2002-10-28 | 2009-01-07 | 斯沃勒斯联合公司 | Heat transfer system |
JP2004190976A (en) * | 2002-12-12 | 2004-07-08 | Sony Corp | Heat transport device and electronic device |
US7299859B2 (en) * | 2003-04-28 | 2007-11-27 | Lucent Technologies Inc. | Temperature control of thermooptic devices |
KR100555024B1 (en) | 2003-11-12 | 2006-03-03 | (주) 대홍기업 | Variable Conductance Heat Pipe type Cooling Device |
TWI248667B (en) | 2004-11-25 | 2006-02-01 | Advanced Semiconductor Eng | Semiconductor package having heat pipes |
JP4639850B2 (en) * | 2005-03-02 | 2011-02-23 | 株式会社Ihi | Cooling method and apparatus |
US7457126B2 (en) * | 2005-06-27 | 2008-11-25 | Intel Corporation | Optical transponder with active heat transfer |
TWM288396U (en) | 2005-09-09 | 2006-03-01 | Arima Optoelectronics Corp | Heat dissipation structure for backlight module |
JP2007088282A (en) * | 2005-09-22 | 2007-04-05 | Mitsubishi Electric Corp | Peripheral equipment and electronic equipment |
CN101212885B (en) * | 2006-12-27 | 2011-08-31 | 富准精密工业(深圳)有限公司 | Heat radiation module |
US20090294117A1 (en) * | 2008-05-28 | 2009-12-03 | Lucent Technologies, Inc. | Vapor Chamber-Thermoelectric Module Assemblies |
JP2010054121A (en) | 2008-08-28 | 2010-03-11 | Mitsubishi Electric Corp | Variable conductance heat pipe |
JP5125889B2 (en) | 2008-08-28 | 2013-01-23 | 三菱電機株式会社 | Variable conductance heat pipe |
JP2010107153A (en) * | 2008-10-31 | 2010-05-13 | Toshiba Corp | Evaporator and circulation type cooling device using the same |
US9721868B2 (en) | 2009-07-30 | 2017-08-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate |
JP5568289B2 (en) | 2009-11-30 | 2014-08-06 | 新光電気工業株式会社 | Heat dissipation component and manufacturing method thereof |
EP2622286A2 (en) * | 2010-09-28 | 2013-08-07 | InvenSor GmbH | Condensate recirculation system in an adsorption refrigeration machine |
US8644020B2 (en) * | 2010-12-01 | 2014-02-04 | Google Inc. | Cooling heat-generating electronics |
KR20130084870A (en) | 2012-01-18 | 2013-07-26 | 주식회사 럭스퍼트 | Plugable optical transceiver with heat sink |
EP2859391B1 (en) | 2012-04-19 | 2022-11-30 | OE Solutions America Inc. | Heat removal system for devices and subassemblies |
US9267739B2 (en) * | 2012-07-18 | 2016-02-23 | Applied Materials, Inc. | Pedestal with multi-zone temperature control and multiple purge capabilities |
US8587945B1 (en) | 2012-07-27 | 2013-11-19 | Outlast Technologies Llc | Systems structures and materials for electronic device cooling |
US9846287B2 (en) | 2013-07-11 | 2017-12-19 | Ciena Corporation | Method of cooling stacked, pluggable optical transceivers |
US9518785B2 (en) | 2013-07-24 | 2016-12-13 | Tyco Electronics Corporation | Receptacle assembly for receiving a pluggable module |
CN103591568B (en) | 2013-11-19 | 2015-10-28 | 深圳市华星光电技术有限公司 | Heat-radiation loop pipe and the backlight module with this heat-radiation loop pipe |
US9923252B2 (en) | 2014-12-17 | 2018-03-20 | X Development Llc | Battery pack with variable-conductance heat pipe (VCHP) cooling |
US10110318B2 (en) | 2015-02-19 | 2018-10-23 | Elenion Technologies, Llc | Optical delay lines for electrical skew compensation |
WO2016182958A1 (en) | 2015-05-08 | 2016-11-17 | Rizopoulos John | Vaporization systems and methods of using the same |
WO2017127059A1 (en) | 2016-01-20 | 2017-07-27 | Hewlett Packard Enterprise Development Lp | Directional coolant control |
CN107247312A (en) * | 2017-06-05 | 2017-10-13 | 深圳市光为光通信科技有限公司 | CXP optical modules and its communication equipment |
CN207369503U (en) | 2017-09-29 | 2018-05-15 | 索士亚科技股份有限公司 | Heat pipe with non-condensable gas |
US11051431B2 (en) | 2018-06-29 | 2021-06-29 | Juniper Networks, Inc. | Thermal management with variable conductance heat pipe |
-
2018
- 2018-06-29 US US16/022,924 patent/US11051431B2/en active Active
-
2019
- 2019-05-30 SG SG10201904917VA patent/SG10201904917VA/en unknown
- 2019-06-14 TW TW110129022A patent/TW202203399A/en unknown
- 2019-06-14 TW TW108120634A patent/TWI736910B/en active
- 2019-06-18 EP EP19180815.3A patent/EP3589100A1/en active Pending
- 2019-06-24 CN CN201910548082.6A patent/CN110658594B/en active Active
- 2019-06-24 KR KR1020190074938A patent/KR102334791B1/en active IP Right Grant
- 2019-06-24 CN CN202110818962.8A patent/CN113534365B/en active Active
-
2021
- 2021-04-02 US US17/221,373 patent/US11653477B2/en active Active
- 2021-11-30 KR KR1020210168291A patent/KR102499249B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP3589100A1 (en) | 2020-01-01 |
TW202006908A (en) | 2020-02-01 |
KR102334791B1 (en) | 2021-12-06 |
TWI736910B (en) | 2021-08-21 |
US11653477B2 (en) | 2023-05-16 |
KR20200002624A (en) | 2020-01-08 |
US20210227723A1 (en) | 2021-07-22 |
US11051431B2 (en) | 2021-06-29 |
US20200008321A1 (en) | 2020-01-02 |
KR102499249B1 (en) | 2023-02-10 |
TW202203399A (en) | 2022-01-16 |
CN113534365A (en) | 2021-10-22 |
KR20210152425A (en) | 2021-12-15 |
CN110658594A (en) | 2020-01-07 |
CN110658594B (en) | 2021-07-27 |
CN113534365B (en) | 2023-02-17 |
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