SG10201901843XA - Sealable sheet - Google Patents
Sealable sheetInfo
- Publication number
- SG10201901843XA SG10201901843XA SG10201901843XA SG10201901843XA SG 10201901843X A SG10201901843X A SG 10201901843XA SG 10201901843X A SG10201901843X A SG 10201901843XA SG 10201901843X A SG10201901843X A SG 10201901843XA
- Authority
- SG
- Singapore
- Prior art keywords
- sheet
- sealable
- sealable sheet
- thickness direction
- length
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Sealing Material Composition (AREA)
- Laminated Bodies (AREA)
Abstract
SEALABLE SHEET A sealable sheet contains an epoxy resin, a novolak phenol resin, and a thermoplastic resin containing a carboxyl group, and a protruding length LI measured by the following method is 3 mm or less. In a state where the sealable sheet having a thickness of 260 ~m, a length of 5 cm, and a width of 5 cm is supported by a peeling sheet having the same length-width size as that of the sealable sheet, the sealable sheet is disposed on a one-side surface in a thickness direction of an alumina board having a length of 6 cm and a width of 6 cm so that the alumina board, the sealable sheet, and the peeling sheet are disposed to be sequentially aligned toward one side in the thickness direction, and then, the alumina board, the sealable sheet, and the peeling sheet are thermally pressed in the thickness direction at 70°C for 60 seconds at a strength of 360 N; and thereafter, the protruding length LI of the sealable sheet from the peeling sheet outwardly in a direction perpendicular to the thickness direction is measured. FIG. I
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018041969A JP6997654B2 (en) | 2018-03-08 | 2018-03-08 | Sealing sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201901843XA true SG10201901843XA (en) | 2019-10-30 |
Family
ID=67882978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201901843X SG10201901843XA (en) | 2018-03-08 | 2019-03-01 | Sealable sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6997654B2 (en) |
| CN (1) | CN110246810A (en) |
| SG (1) | SG10201901843XA (en) |
| TW (1) | TW201938746A (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4754185B2 (en) | 2004-05-27 | 2011-08-24 | リンテック株式会社 | Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same |
| JP2009212511A (en) | 2008-02-07 | 2009-09-17 | Sumitomo Bakelite Co Ltd | Dicing sheet function-provided film for semiconductor, and semiconductor device |
| JP2014210880A (en) | 2013-04-19 | 2014-11-13 | 日東電工株式会社 | Thermosetting resin composition and method for manufacturing semiconductor device |
| JPWO2014208694A1 (en) | 2013-06-27 | 2017-02-23 | 日立化成株式会社 | Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device |
| SG11201604064RA (en) | 2013-11-28 | 2016-07-28 | Nitto Denko Corp | Sealing thermosetting-resin sheet and hollow-package manufacturing method |
| JP6280400B2 (en) | 2014-03-07 | 2018-02-14 | 日東電工株式会社 | Underfill material, laminated sheet, and method of manufacturing semiconductor device |
| JP2016102166A (en) | 2014-11-28 | 2016-06-02 | 日東電工株式会社 | Sheet-like resin composition, laminate sheet and manufacturing method of semiconductor device |
-
2018
- 2018-03-08 JP JP2018041969A patent/JP6997654B2/en active Active
-
2019
- 2019-03-01 SG SG10201901843X patent/SG10201901843XA/en unknown
- 2019-03-06 TW TW108107372A patent/TW201938746A/en unknown
- 2019-03-06 CN CN201910168524.4A patent/CN110246810A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP6997654B2 (en) | 2022-01-17 |
| CN110246810A (en) | 2019-09-17 |
| JP2019160870A (en) | 2019-09-19 |
| TW201938746A (en) | 2019-10-01 |
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