SG10201803980XA - Polishing apparatus and polishing method - Google Patents
Polishing apparatus and polishing methodInfo
- Publication number
- SG10201803980XA SG10201803980XA SG10201803980XA SG10201803980XA SG10201803980XA SG 10201803980X A SG10201803980X A SG 10201803980XA SG 10201803980X A SG10201803980X A SG 10201803980XA SG 10201803980X A SG10201803980X A SG 10201803980XA SG 10201803980X A SG10201803980X A SG 10201803980XA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- polishing apparatus
- ytzm
- rzytut
- rfeft
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017098254A JP6829653B2 (ja) | 2017-05-17 | 2017-05-17 | 研磨装置および研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201803980XA true SG10201803980XA (en) | 2018-12-28 |
Family
ID=64400139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201803980XA SG10201803980XA (en) | 2017-05-17 | 2018-05-11 | Polishing apparatus and polishing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US11045921B2 (zh) |
JP (1) | JP6829653B2 (zh) |
KR (1) | KR102522882B1 (zh) |
CN (1) | CN108942640B (zh) |
SG (1) | SG10201803980XA (zh) |
TW (1) | TWI758478B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023071317A (ja) | 2021-11-11 | 2023-05-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06511082A (ja) * | 1991-09-18 | 1994-12-08 | アイオワ・ステート・ユニバーシティー・リサーチ・ファウンデーション・インコーポレーテッド | 二波長型光度計及びファイバオプチック検知器プローブ |
TW428079B (en) * | 1998-12-24 | 2001-04-01 | Sharp Kk | Thickness measurement apparatus of thin film using light interference method |
JP3717340B2 (ja) * | 1999-07-27 | 2005-11-16 | シャープ株式会社 | 電子部品製造装置 |
US6511363B2 (en) | 2000-12-27 | 2003-01-28 | Tokyo Seimitsu Co., Ltd. | Polishing end point detecting device for wafer polishing apparatus |
JP2003249472A (ja) * | 2002-02-26 | 2003-09-05 | Hitachi Ltd | 膜厚計測方法および膜厚計測装置および薄膜デバイスの製造方法 |
US8025759B2 (en) * | 2003-07-02 | 2011-09-27 | Ebara Corporation | Polishing apparatus and polishing method |
JP5302133B2 (ja) | 2009-08-07 | 2013-10-02 | 株式会社堀場製作所 | 干渉膜厚計 |
JP5050024B2 (ja) | 2009-09-28 | 2012-10-17 | 株式会社荏原製作所 | 基板研磨装置および基板研磨方法 |
JP5728239B2 (ja) | 2010-03-02 | 2015-06-03 | 株式会社荏原製作所 | 研磨監視方法、研磨方法、研磨監視装置、および研磨装置 |
US8694144B2 (en) | 2010-08-30 | 2014-04-08 | Applied Materials, Inc. | Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing |
JP5980476B2 (ja) * | 2010-12-27 | 2016-08-31 | 株式会社荏原製作所 | ポリッシング装置およびポリッシング方法 |
US8535115B2 (en) * | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
JP2013222856A (ja) * | 2012-04-17 | 2013-10-28 | Ebara Corp | 研磨装置および研磨方法 |
FR2994734B1 (fr) | 2012-08-21 | 2017-08-25 | Fogale Nanotech | Dispositif et procede pour faire des mesures dimensionnelles sur des objets multi-couches tels que des wafers. |
TWI635929B (zh) | 2013-07-11 | 2018-09-21 | 日商荏原製作所股份有限公司 | 研磨裝置及研磨狀態監視方法 |
ITBO20130403A1 (it) | 2013-07-26 | 2015-01-27 | Marposs Spa | Metodo e apparecchiatura per il controllo ottico mediante interferometria dello spessore di un oggetto in lavorazione |
WO2015163164A1 (ja) * | 2014-04-22 | 2015-10-29 | 株式会社 荏原製作所 | 研磨方法および研磨装置 |
JP6307428B2 (ja) | 2014-12-26 | 2018-04-04 | 株式会社荏原製作所 | 研磨装置およびその制御方法 |
US9921149B2 (en) | 2015-04-24 | 2018-03-20 | Otsuka Electronics Co., Ltd. | Optical measurement apparatus and optical measurement method |
JP6473050B2 (ja) | 2015-06-05 | 2019-02-20 | 株式会社荏原製作所 | 研磨装置 |
-
2017
- 2017-05-17 JP JP2017098254A patent/JP6829653B2/ja active Active
-
2018
- 2018-05-11 SG SG10201803980XA patent/SG10201803980XA/en unknown
- 2018-05-11 TW TW107116209A patent/TWI758478B/zh active
- 2018-05-14 KR KR1020180054753A patent/KR102522882B1/ko active IP Right Grant
- 2018-05-14 US US15/979,180 patent/US11045921B2/en active Active
- 2018-05-15 CN CN201810461546.5A patent/CN108942640B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN108942640A (zh) | 2018-12-07 |
TW201900334A (zh) | 2019-01-01 |
KR102522882B1 (ko) | 2023-04-18 |
KR20180126374A (ko) | 2018-11-27 |
TWI758478B (zh) | 2022-03-21 |
US11045921B2 (en) | 2021-06-29 |
CN108942640B (zh) | 2021-09-03 |
JP6829653B2 (ja) | 2021-02-10 |
JP2018194427A (ja) | 2018-12-06 |
US20180339392A1 (en) | 2018-11-29 |
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