SG10201803980XA - Polishing apparatus and polishing method - Google Patents

Polishing apparatus and polishing method

Info

Publication number
SG10201803980XA
SG10201803980XA SG10201803980XA SG10201803980XA SG10201803980XA SG 10201803980X A SG10201803980X A SG 10201803980XA SG 10201803980X A SG10201803980X A SG 10201803980XA SG 10201803980X A SG10201803980X A SG 10201803980XA SG 10201803980X A SG10201803980X A SG 10201803980XA
Authority
SG
Singapore
Prior art keywords
polishing
polishing apparatus
ytzm
rzytut
rfeft
Prior art date
Application number
SG10201803980XA
Inventor
Kimba Toshifumi
Kinoshita Masaki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201803980XA publication Critical patent/SG10201803980XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

HApc r £ riS-Ct, £ }fe^«J¥$!l^S<£>igfc IEST-T 6 ¥<Dmm<DWkm%j&Bk\z.wmi-z> ^mmm. m&M7F£ti?>0 mmmm^ ytzm-rzytut, Mft%&m^^x/M%Lr&%i-M:X(DEiMyt(D3m&a®-r6<^^ Mm ®I®M£rfeft£<55tci^<5v^-c?^<z) 7-f 53feS^ilitR 0 1 23
SG10201803980XA 2017-05-17 2018-05-11 Polishing apparatus and polishing method SG10201803980XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017098254A JP6829653B2 (en) 2017-05-17 2017-05-17 Polishing equipment and polishing method

Publications (1)

Publication Number Publication Date
SG10201803980XA true SG10201803980XA (en) 2018-12-28

Family

ID=64400139

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201803980XA SG10201803980XA (en) 2017-05-17 2018-05-11 Polishing apparatus and polishing method

Country Status (6)

Country Link
US (1) US11045921B2 (en)
JP (1) JP6829653B2 (en)
KR (1) KR102522882B1 (en)
CN (1) CN108942640B (en)
SG (1) SG10201803980XA (en)
TW (1) TWI758478B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023071317A (en) 2021-11-11 2023-05-23 株式会社荏原製作所 Polishing device and polishing method

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993006459A1 (en) * 1991-09-18 1993-04-01 Iowa State University Research Foundation, Inc. Dual-wavelength photometer and fiber optic sensor probe
JP3717340B2 (en) * 1999-07-27 2005-11-16 シャープ株式会社 Electronic component manufacturing equipment
US7304744B1 (en) 1998-12-24 2007-12-04 Sharp Kabushiki Kaisha Apparatus and method for measuring the thickness of a thin film via the intensity of reflected light
US6511363B2 (en) 2000-12-27 2003-01-28 Tokyo Seimitsu Co., Ltd. Polishing end point detecting device for wafer polishing apparatus
JP2003249472A (en) * 2002-02-26 2003-09-05 Hitachi Ltd Method and device for film thickness measurement and manufacturing method of thin film device
WO2005004218A1 (en) 2003-07-02 2005-01-13 Ebara Corporation Polishing apparatus and polishing method
JP5302133B2 (en) 2009-08-07 2013-10-02 株式会社堀場製作所 Interference film thickness meter
JP5050024B2 (en) 2009-09-28 2012-10-17 株式会社荏原製作所 Substrate polishing apparatus and substrate polishing method
JP5728239B2 (en) 2010-03-02 2015-06-03 株式会社荏原製作所 Polishing monitoring method, polishing method, polishing monitoring apparatus, and polishing apparatus
US8694144B2 (en) 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
JP5980476B2 (en) * 2010-12-27 2016-08-31 株式会社荏原製作所 Polishing apparatus and polishing method
US8535115B2 (en) 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
JP2013222856A (en) * 2012-04-17 2013-10-28 Ebara Corp Polishing device and polishing method
FR2994734B1 (en) 2012-08-21 2017-08-25 Fogale Nanotech DEVICE AND METHOD FOR MAKING DIMENSION MEASUREMENTS ON MULTI-LAYER OBJECTS SUCH AS WAFERS.
TWI635929B (en) 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 Polishing apparatus and polished-state monitoring method
ITBO20130403A1 (en) 2013-07-26 2015-01-27 Marposs Spa METHOD AND EQUIPMENT FOR OPTICAL CONTROL BY INTERFEROMETRY OF THE THICKNESS OF A PROCESSED OBJECT
WO2015163164A1 (en) * 2014-04-22 2015-10-29 株式会社 荏原製作所 Polishing method and polishing apparatus
JP6307428B2 (en) 2014-12-26 2018-04-04 株式会社荏原製作所 Polishing apparatus and control method thereof
US9921149B2 (en) 2015-04-24 2018-03-20 Otsuka Electronics Co., Ltd. Optical measurement apparatus and optical measurement method
JP6473050B2 (en) * 2015-06-05 2019-02-20 株式会社荏原製作所 Polishing equipment

Also Published As

Publication number Publication date
KR102522882B1 (en) 2023-04-18
US20180339392A1 (en) 2018-11-29
CN108942640B (en) 2021-09-03
KR20180126374A (en) 2018-11-27
TWI758478B (en) 2022-03-21
TW201900334A (en) 2019-01-01
JP6829653B2 (en) 2021-02-10
CN108942640A (en) 2018-12-07
JP2018194427A (en) 2018-12-06
US11045921B2 (en) 2021-06-29

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