SG10201801305PA - Polishing Apparatus And Polishing Method - Google Patents

Polishing Apparatus And Polishing Method

Info

Publication number
SG10201801305PA
SG10201801305PA SG10201801305PA SG10201801305PA SG10201801305PA SG 10201801305P A SG10201801305P A SG 10201801305PA SG 10201801305P A SG10201801305P A SG 10201801305PA SG 10201801305P A SG10201801305P A SG 10201801305PA SG 10201801305P A SG10201801305P A SG 10201801305PA
Authority
SG
Singapore
Prior art keywords
polishing
polishing apparatus
polishing method
Prior art date
Application number
SG10201801305PA
Other languages
English (en)
Inventor
Taro Takahashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201801305PA publication Critical patent/SG10201801305PA/en

Links

SG10201801305PA 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method SG10201801305PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014223293 2014-10-31
JP2015168088A JP2016087780A (ja) 2014-10-31 2015-08-27 研磨装置および研磨方法

Publications (1)

Publication Number Publication Date
SG10201801305PA true SG10201801305PA (en) 2018-03-28

Family

ID=56015959

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201801305PA SG10201801305PA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method
SG10201508881RA SG10201508881RA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201508881RA SG10201508881RA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method

Country Status (2)

Country Link
JP (1) JP2016087780A (enrdf_load_stackoverflow)
SG (2) SG10201801305PA (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064899A (ja) * 2015-10-01 2017-04-06 株式会社荏原製作所 研磨装置
JP6779633B2 (ja) * 2016-02-23 2020-11-04 株式会社荏原製作所 研磨装置
CN113714934B (zh) * 2016-10-21 2024-04-26 应用材料公司 用于原位电磁感应监测系统的芯配置
JP7227909B2 (ja) * 2017-01-13 2023-02-22 アプライド マテリアルズ インコーポレイテッド インシトゥ監視からの測定値の、抵抗率に基づく調整

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001041828A (ja) * 1999-07-27 2001-02-16 Tokyo Gas Co Ltd 温度測定装置及びそれを利用した測定方法
TWI273947B (en) * 2002-02-06 2007-02-21 Applied Materials Inc Method and apparatus of eddy current monitoring for chemical mechanical polishing
JP2004014999A (ja) * 2002-06-11 2004-01-15 Hitachi Chem Co Ltd Ｃｍｐ研磨装置及び研磨方法
KR100506942B1 (ko) * 2003-09-03 2005-08-05 삼성전자주식회사 화학적 기계적 연마장치
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
JP2009125825A (ja) * 2007-11-20 2009-06-11 Ebara Corp 電解複合研磨方法及び電解複合研磨装置
US8523429B2 (en) * 2009-10-19 2013-09-03 Tsi Technologies Llc Eddy current thermometer

Also Published As

Publication number Publication date
JP2016087780A (ja) 2016-05-23
SG10201508881RA (en) 2016-05-30

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