SG10201600959YA - Cutting apparatus and wafer cutting method - Google Patents

Cutting apparatus and wafer cutting method

Info

Publication number
SG10201600959YA
SG10201600959YA SG10201600959YA SG10201600959YA SG10201600959YA SG 10201600959Y A SG10201600959Y A SG 10201600959YA SG 10201600959Y A SG10201600959Y A SG 10201600959YA SG 10201600959Y A SG10201600959Y A SG 10201600959YA SG 10201600959Y A SG10201600959Y A SG 10201600959YA
Authority
SG
Singapore
Prior art keywords
cutting
wafer
cutting apparatus
cutting method
wafer cutting
Prior art date
Application number
SG10201600959YA
Other languages
English (en)
Inventor
Takenouchi Kenji
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201600959YA publication Critical patent/SG10201600959YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
SG10201600959YA 2015-03-03 2016-02-10 Cutting apparatus and wafer cutting method SG10201600959YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015041177A JP6462422B2 (ja) 2015-03-03 2015-03-03 切削装置及びウエーハの加工方法

Publications (1)

Publication Number Publication Date
SG10201600959YA true SG10201600959YA (en) 2016-10-28

Family

ID=56738494

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201600959YA SG10201600959YA (en) 2015-03-03 2016-02-10 Cutting apparatus and wafer cutting method

Country Status (7)

Country Link
US (1) US10354893B2 (zh)
JP (1) JP6462422B2 (zh)
KR (1) KR20160107099A (zh)
CN (1) CN105936095B (zh)
DE (1) DE102016203320A1 (zh)
SG (1) SG10201600959YA (zh)
TW (1) TWI671175B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6890893B2 (ja) * 2017-08-08 2021-06-18 株式会社ディスコ 金属が露出した基板の加工方法
JP6974979B2 (ja) * 2017-08-22 2021-12-01 株式会社ディスコ 研削装置
JP6998158B2 (ja) * 2017-09-07 2022-01-18 株式会社ディスコ 切削ブレード供給装置
JP6974087B2 (ja) * 2017-09-14 2021-12-01 株式会社ディスコ 切削装置
JP6967276B2 (ja) * 2017-12-28 2021-11-17 三星ダイヤモンド工業株式会社 ブレーク装置
CN108312369B (zh) * 2018-03-28 2024-05-07 深圳赛意法微电子有限公司 晶圆切割设备及晶圆切割方法
JP7150551B2 (ja) 2018-10-02 2022-10-11 エヌ・ティ・ティ・コミュニケーションズ株式会社 制御装置、ネットワーク構築システム、ネットワーク構築方法、及びプログラム

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Publication number Priority date Publication date Assignee Title
US3916584A (en) 1973-03-22 1975-11-04 Minnesota Mining & Mfg Spheroidal composite particle and method of making
JPS6112373B2 (zh) * 1974-09-04 1986-04-08 Hitachi Ltd
US4787362A (en) 1986-10-20 1988-11-29 Thermocarbon, Inc. Abrasive blade having a polycrystalline ceramic core
US5718615A (en) 1995-10-20 1998-02-17 Boucher; John N. Semiconductor wafer dicing method
KR100225909B1 (ko) * 1997-05-29 1999-10-15 윤종용 웨이퍼 소잉 장치
JP3257968B2 (ja) * 1997-07-22 2002-02-18 株式会社ディスコ 切削装置のブレードカバー
US6357330B1 (en) 1999-01-07 2002-03-19 Intel Corporation Method and apparatus for cutting a wafer
US6458018B1 (en) 1999-04-23 2002-10-01 3M Innovative Properties Company Abrasive article suitable for abrading glass and glass ceramic workpieces
JP4387010B2 (ja) 1999-11-10 2009-12-16 株式会社ディスコ 切削装置
JP2004082038A (ja) * 2002-08-28 2004-03-18 Seiko Epson Corp 超音波洗浄方法、超音波洗浄装置および、超音波洗浄ノズルのノズル部の製造方法
TWI231523B (en) 2003-06-18 2005-04-21 Hon Hai Prec Ind Co Ltd Method of cleaning surface of semiconductor wafer
JP4471632B2 (ja) 2003-11-18 2010-06-02 株式会社ディスコ ウエーハの加工方法
JP4890746B2 (ja) 2004-06-14 2012-03-07 株式会社ディスコ ウエーハの加工方法
TWI282299B (en) 2004-09-23 2007-06-11 Ind Tech Res Inst Ceramic blade and fabrication method thereof
WO2007007683A1 (ja) * 2005-07-07 2007-01-18 National University Corporation Kumamoto University 基板およびその研磨方法、並びに研磨装置
JP4813985B2 (ja) 2006-06-23 2011-11-09 株式会社ディスコ ウエーハの加工条件設定方法
US20080210066A1 (en) * 2007-03-02 2008-09-04 Russell Donovan Arterburn Method for chopping unwound items and coated chopper blades
JP5315573B2 (ja) * 2007-10-12 2013-10-16 国立大学法人 熊本大学 加工装置および加工方法
JP2011108979A (ja) * 2009-11-20 2011-06-02 Disco Abrasive Syst Ltd 被加工物の切削方法
JP2012015293A (ja) * 2010-06-30 2012-01-19 Shibaura Mechatronics Corp 基板処理装置及び基板処理方法
JP2013111713A (ja) * 2011-11-29 2013-06-10 Tokyo Seimitsu Co Ltd 切削水の供給装置及び供給方法
US9017809B2 (en) 2013-01-25 2015-04-28 Kennametal Inc. Coatings for cutting tools
AU2014100540A4 (en) * 2013-06-11 2014-06-26 Bissell Homecare, Inc. Surface cleaning apparatus with hydrogen peroxide generator
JP5622158B2 (ja) * 2013-08-21 2014-11-12 学校法人立命館 ワークの研磨方法および研磨液
US20150105006A1 (en) 2013-10-11 2015-04-16 HGST Netherlands B.V. Method to sustain minimum required aspect ratios of diamond grinding blades throughout service lifetime
CN105216130B (zh) * 2014-06-24 2019-04-19 恩智浦美国有限公司 用于半导体切单锯的清洁装置
US9318424B2 (en) * 2014-07-31 2016-04-19 Alpha And Omega Semiconductor Incorporated MCSP power semiconductor devices and preparation methods thereof

Also Published As

Publication number Publication date
US20160260626A1 (en) 2016-09-08
DE102016203320A1 (de) 2016-09-08
CN105936095B (zh) 2019-11-29
TWI671175B (zh) 2019-09-11
KR20160107099A (ko) 2016-09-13
TW201707911A (zh) 2017-03-01
US10354893B2 (en) 2019-07-16
CN105936095A (zh) 2016-09-14
JP6462422B2 (ja) 2019-01-30
JP2016162916A (ja) 2016-09-05

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