SG10201600487WA - Photoresist stripping solution, stripping solution recycling system and operating method, and method for recycling stripping solution - Google Patents
Photoresist stripping solution, stripping solution recycling system and operating method, and method for recycling stripping solutionInfo
- Publication number
- SG10201600487WA SG10201600487WA SG10201600487WA SG10201600487WA SG10201600487WA SG 10201600487W A SG10201600487W A SG 10201600487WA SG 10201600487W A SG10201600487W A SG 10201600487WA SG 10201600487W A SG10201600487W A SG 10201600487WA SG 10201600487W A SG10201600487W A SG 10201600487WA
- Authority
- SG
- Singapore
- Prior art keywords
- stripping solution
- recycling
- photoresist
- operating method
- recycling system
- Prior art date
Links
- 238000004064 recycling Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 238000011017 operating method Methods 0.000 title 1
- 229920002120 photoresistant polymer Polymers 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011114207A JP5809444B2 (ja) | 2011-05-20 | 2011-05-20 | フォトレジスト用剥離液 |
JP2011114208A JP5712051B2 (ja) | 2011-05-20 | 2011-05-20 | 剥離液リサイクルシステムと運転方法および剥離液のリサイクル方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201600487WA true SG10201600487WA (en) | 2016-02-26 |
Family
ID=47216819
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013075213A SG194145A1 (en) | 2011-05-20 | 2011-10-06 | Photoresist stripping solution, stripping solution recycling system and operating method, and method for recycling stripping solution |
SG10201600487WA SG10201600487WA (en) | 2011-05-20 | 2011-10-06 | Photoresist stripping solution, stripping solution recycling system and operating method, and method for recycling stripping solution |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013075213A SG194145A1 (en) | 2011-05-20 | 2011-10-06 | Photoresist stripping solution, stripping solution recycling system and operating method, and method for recycling stripping solution |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140083458A1 (ko) |
KR (1) | KR20140030185A (ko) |
CN (1) | CN103688222B (ko) |
SG (2) | SG194145A1 (ko) |
TW (1) | TWI495967B (ko) |
WO (1) | WO2012160721A1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6098790B2 (ja) * | 2012-10-11 | 2017-03-22 | パナソニックIpマネジメント株式会社 | レジスト剥離液の調合方法および調合装置 |
US8961744B2 (en) * | 2013-02-25 | 2015-02-24 | Korex Corporation | System and method for recycling high-boiling-point waste photoresist stripper |
EP2819162B1 (en) * | 2013-06-24 | 2020-06-17 | IMEC vzw | Method for producing contact areas on a semiconductor substrate |
JP5575318B1 (ja) * | 2013-09-02 | 2014-08-20 | パナソニック株式会社 | レジスト剥離液 |
JP6249217B2 (ja) * | 2013-12-27 | 2017-12-20 | パナソニックIpマネジメント株式会社 | レジスト剥離液の組成比維持装置およびレジスト剥離液の組成比維持方法 |
WO2016027986A1 (ko) * | 2014-08-20 | 2016-02-25 | 주식회사 엘지화학 | 포토레지스트용 스트리퍼 폐액의 재생 방법 |
JP6456176B2 (ja) * | 2015-02-10 | 2019-01-23 | 東京応化工業株式会社 | 厚膜用化学増幅型ポジ型感光性樹脂組成物 |
EP3210945B1 (en) * | 2016-02-29 | 2019-04-10 | Agfa-Gevaert | Method of manufacturing an etched glass article |
JP6681066B2 (ja) * | 2016-03-14 | 2020-04-15 | 株式会社平間理化研究所 | 水系レジスト剥離液の調製装置および非水系レジスト剥離液の調製装置 |
JP7191831B2 (ja) * | 2017-08-02 | 2022-12-19 | 株式会社クラレ | 回収レジスト剥離剤からのジメチルスルホキシドの回収方法 |
CN108054119B (zh) * | 2017-12-06 | 2021-03-23 | 深圳市华星光电半导体显示技术有限公司 | 用于剥离工艺的剥离液机台及其工作方法 |
CN108470693B (zh) * | 2018-03-15 | 2019-03-01 | 福建省福联集成电路有限公司 | 一种蚀刻装置控制方法和系统 |
CN110981054A (zh) * | 2018-11-23 | 2020-04-10 | 叶旖婷 | 一种可降低cod污染的线路板褪膜废液处理方法及装置 |
CN110384995A (zh) * | 2019-07-24 | 2019-10-29 | 中国电子工程设计院有限公司 | 一种高沸点有机物废气处理设备及其处理方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW451358B (en) * | 1998-11-27 | 2001-08-21 | Showa Denko Kk | Composition for removing sidewall residue and method of removing sidewall residue |
JP3914722B2 (ja) * | 2001-06-25 | 2007-05-16 | 株式会社平間理化研究所 | 水系レジスト剥離液管理装置及び水系レジスト剥離液管理方法 |
US8003587B2 (en) * | 2002-06-06 | 2011-08-23 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
JP2006106616A (ja) * | 2004-10-08 | 2006-04-20 | Tokyo Ohka Kogyo Co Ltd | ホトレジスト除去用処理液および基板の処理方法 |
KR101285775B1 (ko) * | 2006-02-07 | 2013-07-18 | 주식회사 동진쎄미켐 | 레지스트 처리액의 재생방법 및 그 장치 |
WO2009004988A1 (ja) * | 2007-07-03 | 2009-01-08 | Toagosei Co., Ltd. | ナノろ過によるレジスト剥離液連続使用システム |
CN102227687A (zh) * | 2008-12-25 | 2011-10-26 | 长瀬化成株式会社 | 光致抗蚀剂剥离剂组合物、层积金属布线基板的光致抗蚀剂剥离方法和制造方法 |
WO2010090146A1 (ja) * | 2009-02-03 | 2010-08-12 | 出光興産株式会社 | レジスト剥離剤組成物及びそれを用いたレジスト剥離方法 |
CN102124414B (zh) * | 2009-04-17 | 2014-04-02 | 长瀬化成株式会社 | 光致抗蚀剂剥离剂组合物以及光致抗蚀剂剥离方法 |
-
2011
- 2011-10-06 KR KR1020137030146A patent/KR20140030185A/ko not_active Application Discontinuation
- 2011-10-06 SG SG2013075213A patent/SG194145A1/en unknown
- 2011-10-06 US US14/115,658 patent/US20140083458A1/en not_active Abandoned
- 2011-10-06 WO PCT/JP2011/073115 patent/WO2012160721A1/ja active Application Filing
- 2011-10-06 CN CN201180071024.0A patent/CN103688222B/zh active Active
- 2011-10-06 SG SG10201600487WA patent/SG10201600487WA/en unknown
-
2012
- 2012-05-16 TW TW101117392A patent/TWI495967B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2012160721A1 (ja) | 2012-11-29 |
CN103688222B (zh) | 2016-11-16 |
TWI495967B (zh) | 2015-08-11 |
SG194145A1 (en) | 2013-11-29 |
CN103688222A (zh) | 2014-03-26 |
US20140083458A1 (en) | 2014-03-27 |
KR20140030185A (ko) | 2014-03-11 |
TW201308031A (zh) | 2013-02-16 |
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