SG10201504271YA - Power module - Google Patents
Power moduleInfo
- Publication number
- SG10201504271YA SG10201504271YA SG10201504271YA SG10201504271YA SG10201504271YA SG 10201504271Y A SG10201504271Y A SG 10201504271YA SG 10201504271Y A SG10201504271Y A SG 10201504271YA SG 10201504271Y A SG10201504271Y A SG 10201504271YA SG 10201504271Y A SG10201504271Y A SG 10201504271YA
- Authority
- SG
- Singapore
- Prior art keywords
- power module
- module
- power
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1035—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the device being entirely enclosed by the support, e.g. high-density interconnect [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10174—Diode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Ceramic Engineering (AREA)
- Geometry (AREA)
- Inverter Devices (AREA)
- Electronic Switches (AREA)
- Rectifiers (AREA)
- Power Conversion In General (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG10201504271YA SG10201504271YA (en) | 2015-05-29 | 2015-05-29 | Power module |
US15/165,863 US9871463B2 (en) | 2015-05-29 | 2016-05-26 | Power module |
CN201610364955.4A CN106206483B (zh) | 2015-05-29 | 2016-05-27 | 电源模块 |
EP16171741.8A EP3107120B1 (en) | 2015-05-29 | 2016-05-27 | Power semiconductor module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG10201504271YA SG10201504271YA (en) | 2015-05-29 | 2015-05-29 | Power module |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201504271YA true SG10201504271YA (en) | 2016-12-29 |
Family
ID=57399304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201504271YA SG10201504271YA (en) | 2015-05-29 | 2015-05-29 | Power module |
Country Status (4)
Country | Link |
---|---|
US (1) | US9871463B2 (zh) |
EP (1) | EP3107120B1 (zh) |
CN (1) | CN106206483B (zh) |
SG (1) | SG10201504271YA (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI550391B (zh) * | 2015-10-23 | 2016-09-21 | 台達電子工業股份有限公司 | 整合功率模組封裝結構 |
DE102017101185B4 (de) * | 2017-01-23 | 2020-07-16 | Infineon Technologies Ag | Ein Halbleitermodul umfassend Transistorchips, Diodenchips und Treiberchips, angeordnet in einer gemeinsamen Ebene, Verfahren zu dessen Herstellung und integriertes Leistungsmodul |
CN108346645A (zh) * | 2017-01-24 | 2018-07-31 | 比亚迪股份有限公司 | 一种功率模块及其制造方法 |
EP3355349B1 (en) * | 2017-01-26 | 2022-05-11 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Efficient heat removal from component carrier with embedded diode |
JP6809294B2 (ja) * | 2017-03-02 | 2021-01-06 | 三菱電機株式会社 | パワーモジュール |
US10411609B2 (en) * | 2017-12-22 | 2019-09-10 | Panasonic Intellectual Property Management Co., Ltd. | Substrate mounted inverter device |
EP3557614A1 (de) | 2018-04-17 | 2019-10-23 | Siemens Aktiengesellschaft | Leistungsmodul mit einem leistungselektronischen bauelement auf einer substratplatte und leistungselektronische schaltung mit einem solchen leistungsmodul |
US11183460B2 (en) * | 2018-09-17 | 2021-11-23 | Texas Instruments Incorporated | Embedded die packaging with integrated ceramic substrate |
FR3087614B1 (fr) * | 2018-10-19 | 2020-10-09 | Sagemcom Energy & Telecom Sas | Carte electrique comprenant un pont de redressement |
SG10201809987YA (en) * | 2018-11-09 | 2020-06-29 | Delta Electronics Int’L Singapore Pte Ltd | Package structure and packaging process |
US20200161206A1 (en) * | 2018-11-20 | 2020-05-21 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and semiconductor manufacturing process |
CN109461720A (zh) * | 2018-12-12 | 2019-03-12 | 湖北方晶电子科技有限责任公司 | 一种功率半导体贴片封装结构 |
US20200194347A1 (en) * | 2018-12-18 | 2020-06-18 | Alpha And Omega Semiconductor (Cayman) Ltd. | Semiconductor package and method of making the same |
CN111599697A (zh) * | 2020-05-28 | 2020-08-28 | 矽磐微电子(重庆)有限公司 | 半导体模块封装方法及半导体模块 |
US11849539B2 (en) * | 2020-08-13 | 2023-12-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Embedded cooling systems utilizing heat pipes |
DE102022113636A1 (de) | 2022-05-31 | 2023-11-30 | Rolls-Royce Deutschland Ltd & Co Kg | Elektrisches Modul |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10355925B4 (de) * | 2003-11-29 | 2006-07-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Verfahren seiner Herstellung |
DE102004019443B3 (de) * | 2004-04-19 | 2005-08-11 | Siemens Ag | Leistungsmodul |
US7880283B2 (en) | 2006-04-25 | 2011-02-01 | International Rectifier Corporation | High reliability power module |
US8138587B2 (en) * | 2008-09-30 | 2012-03-20 | Infineon Technologies Ag | Device including two mounting surfaces |
WO2010096213A2 (en) * | 2009-02-20 | 2010-08-26 | National Semiconductor Corporation | Integrated circuit micro-module |
DE102009002993B4 (de) * | 2009-05-11 | 2012-10-04 | Infineon Technologies Ag | Leistungshalbleitermodul mit beabstandeten Schaltungsträgern |
WO2010147202A1 (ja) * | 2009-06-19 | 2010-12-23 | 株式会社安川電機 | 電力変換装置 |
US8120158B2 (en) * | 2009-11-10 | 2012-02-21 | Infineon Technologies Ag | Laminate electronic device |
US8810008B2 (en) * | 2010-03-18 | 2014-08-19 | Nec Corporation | Semiconductor element-embedded substrate, and method of manufacturing the substrate |
JP5062302B2 (ja) * | 2010-06-29 | 2012-10-31 | 株式会社デンソー | 冷却器への電子部品内蔵配線基板の取付構造及びその取付方法 |
US9064869B2 (en) | 2013-08-23 | 2015-06-23 | Infineon Technologies Ag | Semiconductor module and a method for fabrication thereof by extended embedding technologies |
SG10201400396WA (en) * | 2014-03-05 | 2015-10-29 | Delta Electronics Int’L Singapore Pte Ltd | Package structure and stacked package module with the same |
SG10201400390YA (en) * | 2014-03-05 | 2015-10-29 | Delta Electronics Int L Singapore Pte Ltd | Package structure |
SG10201401622RA (en) * | 2014-04-17 | 2015-11-27 | Delta Electronics Int’L Singapore Pte Ltd | Package structure |
SG10201501021PA (en) * | 2015-02-10 | 2016-09-29 | Delta Electronics Int L Singapore Pte Ltd | Package structure |
SG10201504273UA (en) * | 2015-05-29 | 2016-12-29 | Delta Electronics Int’L Singapore Pte Ltd | Power module |
SG10201508520PA (en) * | 2015-10-14 | 2017-05-30 | Delta Electronics Int’L Singapore Pte Ltd | Power module |
-
2015
- 2015-05-29 SG SG10201504271YA patent/SG10201504271YA/en unknown
-
2016
- 2016-05-26 US US15/165,863 patent/US9871463B2/en active Active
- 2016-05-27 CN CN201610364955.4A patent/CN106206483B/zh active Active
- 2016-05-27 EP EP16171741.8A patent/EP3107120B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3107120B1 (en) | 2023-08-30 |
CN106206483A (zh) | 2016-12-07 |
CN106206483B (zh) | 2018-12-14 |
US20160352246A1 (en) | 2016-12-01 |
US9871463B2 (en) | 2018-01-16 |
EP3107120A1 (en) | 2016-12-21 |
EP3107120C0 (en) | 2023-08-30 |
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