SG10201501238UA - Optical device - Google Patents

Optical device

Info

Publication number
SG10201501238UA
SG10201501238UA SG10201501238UA SG10201501238UA SG10201501238UA SG 10201501238U A SG10201501238U A SG 10201501238UA SG 10201501238U A SG10201501238U A SG 10201501238UA SG 10201501238U A SG10201501238U A SG 10201501238UA SG 10201501238U A SG10201501238U A SG 10201501238UA
Authority
SG
Singapore
Prior art keywords
optical device
optical
Prior art date
Application number
SG10201501238UA
Other languages
English (en)
Inventor
Fukaya Kota
Kirihara Naotoshi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201501238UA publication Critical patent/SG10201501238UA/en

Links

SG10201501238UA 2014-03-03 2015-02-17 Optical device SG10201501238UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014040056A JP6277017B2 (ja) 2014-03-03 2014-03-03 光デバイス

Publications (1)

Publication Number Publication Date
SG10201501238UA true SG10201501238UA (en) 2015-10-29

Family

ID=54033313

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501238UA SG10201501238UA (en) 2014-03-03 2015-02-17 Optical device

Country Status (5)

Country Link
JP (1) JP6277017B2 (ko)
KR (1) KR102155917B1 (ko)
CN (1) CN104900777B (ko)
SG (1) SG10201501238UA (ko)
TW (1) TWI639253B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6605278B2 (ja) 2015-09-29 2019-11-13 浜松ホトニクス株式会社 レーザ加工方法
JP6605277B2 (ja) * 2015-09-29 2019-11-13 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP6745165B2 (ja) * 2016-08-09 2020-08-26 株式会社ディスコ ウェーハの加工方法
JP6746211B2 (ja) * 2016-09-21 2020-08-26 株式会社ディスコ ウェーハの加工方法
JP6775880B2 (ja) * 2016-09-21 2020-10-28 株式会社ディスコ ウェーハの加工方法
US20210328115A1 (en) * 2018-08-27 2021-10-21 Sony Semiconductor Solutions Corporation Light-emitting device and method for producing light-emitting device
JP7127208B2 (ja) * 2019-03-28 2022-08-29 東京エレクトロン株式会社 処理装置及び処理方法
CN111276577B (zh) * 2019-12-18 2021-12-10 北京中科优唯科技有限公司 一种led芯片的制造方法
JP7499116B2 (ja) 2020-08-25 2024-06-13 シャープ福山レーザー株式会社 画像表示素子
JP7206550B2 (ja) 2020-09-30 2023-01-18 日亜化学工業株式会社 発光素子の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10305420A (ja) 1997-03-04 1998-11-17 Ngk Insulators Ltd 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法
JP2007234707A (ja) * 2006-02-28 2007-09-13 Rohm Co Ltd 半導体発光素子
CN2891295Y (zh) * 2006-03-01 2007-04-18 东莞市福地电子材料有限公司 一种发光二极管
JP5221007B2 (ja) * 2006-05-31 2013-06-26 アイシン精機株式会社 発光ダイオードチップ及びウェハ分割加工方法
JP4909657B2 (ja) 2006-06-30 2012-04-04 株式会社ディスコ サファイア基板の加工方法
JP2008300645A (ja) * 2007-05-31 2008-12-11 Sharp Corp 窒化物系半導体ｌｅｄチップの製造方法
JP2011134955A (ja) * 2009-12-25 2011-07-07 Disco Abrasive Syst Ltd 板状材料からのチップ状部品の生産方法
TW201242122A (en) * 2011-04-15 2012-10-16 Chi Mei Lighting Tech Corp Light-emitting diode device
KR101861997B1 (ko) * 2011-10-31 2018-05-29 엘지이노텍 주식회사 발광소자 및 발광소자 제조방법

Also Published As

Publication number Publication date
TW201535781A (zh) 2015-09-16
CN104900777B (zh) 2019-05-31
JP6277017B2 (ja) 2018-02-07
CN104900777A (zh) 2015-09-09
KR20150103631A (ko) 2015-09-11
TWI639253B (zh) 2018-10-21
JP2015165532A (ja) 2015-09-17
KR102155917B1 (ko) 2020-09-14

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