SG10201404395UA - Method and apparatus for measuring wafer bias potential - Google Patents

Method and apparatus for measuring wafer bias potential

Info

Publication number
SG10201404395UA
SG10201404395UA SG10201404395UA SG10201404395UA SG10201404395UA SG 10201404395U A SG10201404395U A SG 10201404395UA SG 10201404395U A SG10201404395U A SG 10201404395UA SG 10201404395U A SG10201404395U A SG 10201404395UA SG 10201404395U A SG10201404395U A SG 10201404395UA
Authority
SG
Singapore
Prior art keywords
bias potential
wafer bias
measuring wafer
measuring
potential
Prior art date
Application number
SG10201404395UA
Other languages
English (en)
Inventor
Konstantin Makhratchev
John Valcore
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201404395UA publication Critical patent/SG10201404395UA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Plasma Technology (AREA)
SG10201404395UA 2009-08-21 2010-08-18 Method and apparatus for measuring wafer bias potential SG10201404395UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/545,293 US9299539B2 (en) 2009-08-21 2009-08-21 Method and apparatus for measuring wafer bias potential

Publications (1)

Publication Number Publication Date
SG10201404395UA true SG10201404395UA (en) 2014-10-30

Family

ID=43604835

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201404395UA SG10201404395UA (en) 2009-08-21 2010-08-18 Method and apparatus for measuring wafer bias potential
SG2012008272A SG178285A1 (en) 2009-08-21 2010-08-18 Method and apparatus for measuring wafer bias potential

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012008272A SG178285A1 (en) 2009-08-21 2010-08-18 Method and apparatus for measuring wafer bias potential

Country Status (7)

Country Link
US (1) US9299539B2 (https=)
JP (1) JP5661113B2 (https=)
KR (1) KR20120060827A (https=)
CN (1) CN102484062B (https=)
SG (2) SG10201404395UA (https=)
TW (1) TWI562259B (https=)
WO (1) WO2011021160A2 (https=)

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Also Published As

Publication number Publication date
SG178285A1 (en) 2012-03-29
TWI562259B (en) 2016-12-11
JP2013502718A (ja) 2013-01-24
KR20120060827A (ko) 2012-06-12
US20110043228A1 (en) 2011-02-24
CN102484062A (zh) 2012-05-30
WO2011021160A3 (en) 2011-08-11
US9299539B2 (en) 2016-03-29
JP5661113B2 (ja) 2015-01-28
WO2011021160A2 (en) 2011-02-24
TW201133678A (en) 2011-10-01
CN102484062B (zh) 2015-03-04

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