SE9803043D0 - Komponentbärare med förbättrad fasthållning av komponenter - Google Patents

Komponentbärare med förbättrad fasthållning av komponenter

Info

Publication number
SE9803043D0
SE9803043D0 SE9803043A SE9803043A SE9803043D0 SE 9803043 D0 SE9803043 D0 SE 9803043D0 SE 9803043 A SE9803043 A SE 9803043A SE 9803043 A SE9803043 A SE 9803043A SE 9803043 D0 SE9803043 D0 SE 9803043D0
Authority
SE
Sweden
Prior art keywords
component
carrier
component carrier
aperture
retention
Prior art date
Application number
SE9803043A
Other languages
English (en)
Other versions
SE515032C2 (sv
SE9803043L (sv
Inventor
Leif Bergstedt
Per Ligander
Katarina Boustedt
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9803043A priority Critical patent/SE515032C2/sv
Publication of SE9803043D0 publication Critical patent/SE9803043D0/sv
Priority to EP99968737A priority patent/EP1153429B1/en
Priority to AU60163/99A priority patent/AU6016399A/en
Priority to PCT/SE1999/001568 priority patent/WO2000014788A2/en
Priority to DE69941730T priority patent/DE69941730D1/de
Publication of SE9803043L publication Critical patent/SE9803043L/sv
Publication of SE515032C2 publication Critical patent/SE515032C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Capacitors (AREA)
SE9803043A 1998-09-09 1998-09-09 Elektronikanordning innefattande en komponentbärare samt dylik komponentbärare och en metod för framställning av anordningen SE515032C2 (sv)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE9803043A SE515032C2 (sv) 1998-09-09 1998-09-09 Elektronikanordning innefattande en komponentbärare samt dylik komponentbärare och en metod för framställning av anordningen
EP99968737A EP1153429B1 (en) 1998-09-09 1999-09-09 An electronic arrangement comprising a component carrier and a method of producing an electronic arrangement
AU60163/99A AU6016399A (en) 1998-09-09 1999-09-09 An electronic arrangement comprising a component carrier, a carrier for an electronic component, and a method of producing an electronic arrangement
PCT/SE1999/001568 WO2000014788A2 (en) 1998-09-09 1999-09-09 An electronic arrangement comprising a component carrier, a carrier for an electronic component, and a method of producing an electronic arrangement
DE69941730T DE69941730D1 (de) 1998-09-09 1999-09-09 Eine elektronische anordnung, welche einen komponententräger beinhaltet, und eine methode zur herstellung einer elektronischen anordnung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9803043A SE515032C2 (sv) 1998-09-09 1998-09-09 Elektronikanordning innefattande en komponentbärare samt dylik komponentbärare och en metod för framställning av anordningen

Publications (3)

Publication Number Publication Date
SE9803043D0 true SE9803043D0 (sv) 1998-09-09
SE9803043L SE9803043L (sv) 2000-03-10
SE515032C2 SE515032C2 (sv) 2001-06-05

Family

ID=20412527

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9803043A SE515032C2 (sv) 1998-09-09 1998-09-09 Elektronikanordning innefattande en komponentbärare samt dylik komponentbärare och en metod för framställning av anordningen

Country Status (5)

Country Link
EP (1) EP1153429B1 (sv)
AU (1) AU6016399A (sv)
DE (1) DE69941730D1 (sv)
SE (1) SE515032C2 (sv)
WO (1) WO2000014788A2 (sv)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10213881C1 (de) * 2002-03-27 2003-10-02 Infineon Technologies Ag Speichermodul mit aneinander haftenden Halbleiterchips und Herstellung sverfahren
DE10213879C1 (de) * 2002-03-27 2003-07-10 Infineon Technologies Ag Elektronisches Bauteil
FR2917234B1 (fr) 2007-06-07 2009-11-06 Commissariat Energie Atomique Dispositif multi composants integres dans une matrice semi-conductrice.
FR2934082B1 (fr) 2008-07-21 2011-05-27 Commissariat Energie Atomique Dispositif multi composants integres dans une matrice
FR2947948B1 (fr) 2009-07-09 2012-03-09 Commissariat Energie Atomique Plaquette poignee presentant des fenetres de visualisation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815241A (ja) * 1981-07-20 1983-01-28 Sumitomo Electric Ind Ltd 半導体装置用基板
JPS63155754A (ja) * 1986-12-19 1988-06-28 Nec Corp 配線基板
GB2202673B (en) * 1987-03-26 1990-11-14 Haroon Ahmed The semi-conductor fabrication
JPH04206797A (ja) * 1990-11-30 1992-07-28 Mitsubishi Electric Corp 半導体装置
JP2969237B2 (ja) * 1992-07-06 1999-11-02 日本特殊陶業株式会社 コンデンサー内蔵基板及びその製造方法
US5272113A (en) * 1992-11-12 1993-12-21 Xerox Corporation Method for minimizing stress between semiconductor chips having a coefficient of thermal expansion different from that of a mounting substrate

Also Published As

Publication number Publication date
EP1153429A2 (en) 2001-11-14
AU6016399A (en) 2000-03-27
DE69941730D1 (de) 2010-01-07
WO2000014788A3 (en) 2000-07-20
WO2000014788A2 (en) 2000-03-16
SE515032C2 (sv) 2001-06-05
SE9803043L (sv) 2000-03-10
EP1153429B1 (en) 2009-11-25

Similar Documents

Publication Publication Date Title
DE3587649D1 (de) Fluorchemische Biuretzusammensetzungen und damit behandelte fasrige Substrate.
KR920005827A (ko) 기판상의 회로 장착 방법 및 상기 방법에 사용되는 회로기판
ATE29052T1 (de) Maschinenteile bestehend aus einem verbund von keramikbauteilen und metallbauteilen.
EP0163880A3 (en) Data carrier with integrated circuit and method of producing such a carrier
IT8422056A0 (it) Substrato semiconduttore e processo di realizzazione dello stesso.
KR960013394A (ko) 스텐트 제조 방법
EP0907204A3 (en) Chip size package semiconductor device and method of forming the same
MY123249A (en) A semiconductor device and a method of manufacturing the same and an electronic device
WO1996019834A3 (en) Semiconductor device having an insulated gate
SE9403218D0 (sv) Metod och komponent gasdetektion
ES256771U (es) Un dispositivo de alojamiento de conectador electrico
FI941951A0 (sv) Kretskomponent av chip-typ och förfarande för dess framställning
SE9500013D0 (sv) Semiconductor device having a passivation layer
GB9909600D0 (en) Ceramic electronic part and mounting structure for the same
JPS56126614A (en) Catalyst carrier supporter
SE9803043L (sv) Komponentbärare med förbättrad fasthållning av komponenter
FR2667615B1 (fr) Materiau de base de type aluminium/fibres de carbone pour le montage de composants electroniques.
WO2003081313A3 (en) Optical element mounting technique
SE9903875L (sv) Fastener
DK0660003T3 (da) Fremgangsmåde til fremstilling af en udspilingsmuffe på en udspilingsdyvel
ES2015895B3 (es) Escobilla de carbon de dos componentes.
BR9910717A (pt) Método de fabricação de um cartão de circuito integrado e cartão obtido
ES8701958A1 (es) Disposicion perceptora para reconocer deposiciones de escar-cha,en especial junto a evaporadores de instalaciones de re-frigeracion
UA41975C2 (uk) Спосіб термічної обробки сплаву алюміній-літій та спосіб утворення склеєної адгезивом конструкції
EP0633610A3 (en) Opto-electronic integrated circuit and method of manufacturing the same.

Legal Events

Date Code Title Description
NUG Patent has lapsed