SE9802899D0 - Metod för vertikal förbindning av ledare i en anordning på mikrovågsområdet - Google Patents

Metod för vertikal förbindning av ledare i en anordning på mikrovågsområdet

Info

Publication number
SE9802899D0
SE9802899D0 SE9802899A SE9802899A SE9802899D0 SE 9802899 D0 SE9802899 D0 SE 9802899D0 SE 9802899 A SE9802899 A SE 9802899A SE 9802899 A SE9802899 A SE 9802899A SE 9802899 D0 SE9802899 D0 SE 9802899D0
Authority
SE
Sweden
Prior art keywords
conductor
layer
conductors
component
conductive layer
Prior art date
Application number
SE9802899A
Other languages
English (en)
Other versions
SE512566C2 (sv
SE9802899L (sv
Inventor
Leif Bergstedt
Katarina Boustedt
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9802899A priority Critical patent/SE512566C2/sv
Publication of SE9802899D0 publication Critical patent/SE9802899D0/sv
Priority to PCT/SE1999/001466 priority patent/WO2000013254A1/en
Priority to CA002341645A priority patent/CA2341645A1/en
Priority to KR1020017002521A priority patent/KR20010079698A/ko
Priority to EP99946524A priority patent/EP1110268B1/en
Priority to DE69937357T priority patent/DE69937357T2/de
Priority to AU58921/99A priority patent/AU5892199A/en
Priority to CNB998104108A priority patent/CN1147021C/zh
Priority to US09/384,222 priority patent/US6459347B1/en
Publication of SE9802899L publication Critical patent/SE9802899L/sv
Publication of SE512566C2 publication Critical patent/SE512566C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SE9802899A 1998-08-28 1998-08-28 Metod för vertikal förbindning av ledare i en anordning på mikrovågsområdet SE512566C2 (sv)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SE9802899A SE512566C2 (sv) 1998-08-28 1998-08-28 Metod för vertikal förbindning av ledare i en anordning på mikrovågsområdet
CNB998104108A CN1147021C (zh) 1998-08-28 1999-08-26 微波范围器件中导体的垂直连接方法
EP99946524A EP1110268B1 (en) 1998-08-28 1999-08-26 Method for vertical connection of conductors in a device in the microwave range
CA002341645A CA2341645A1 (en) 1998-08-28 1999-08-26 Method for vertical connection of conductors in a device in the microwave range
KR1020017002521A KR20010079698A (ko) 1998-08-28 1999-08-26 마이크로파 범위에서 장치내의 도체를 수직 접속시키는 방법
PCT/SE1999/001466 WO2000013254A1 (en) 1998-08-28 1999-08-26 Method for vertical connection of conductors in a device in the microwave range
DE69937357T DE69937357T2 (de) 1998-08-28 1999-08-26 Verfahren zur senkrechten verbindung von leitern in einer anordnung im mikrowellenbereich
AU58921/99A AU5892199A (en) 1998-08-28 1999-08-26 Method for vertical connection of conductors in a device in the microwave range
US09/384,222 US6459347B1 (en) 1998-08-28 1999-08-27 Method for vertical connection of conductors in a device in the microwave range

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9802899A SE512566C2 (sv) 1998-08-28 1998-08-28 Metod för vertikal förbindning av ledare i en anordning på mikrovågsområdet

Publications (3)

Publication Number Publication Date
SE9802899D0 true SE9802899D0 (sv) 1998-08-28
SE9802899L SE9802899L (sv) 2000-02-29
SE512566C2 SE512566C2 (sv) 2000-04-03

Family

ID=20412401

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9802899A SE512566C2 (sv) 1998-08-28 1998-08-28 Metod för vertikal förbindning av ledare i en anordning på mikrovågsområdet

Country Status (9)

Country Link
US (1) US6459347B1 (sv)
EP (1) EP1110268B1 (sv)
KR (1) KR20010079698A (sv)
CN (1) CN1147021C (sv)
AU (1) AU5892199A (sv)
CA (1) CA2341645A1 (sv)
DE (1) DE69937357T2 (sv)
SE (1) SE512566C2 (sv)
WO (1) WO2000013254A1 (sv)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4029759B2 (ja) * 2003-04-04 2008-01-09 株式会社デンソー 多層回路基板およびその製造方法
WO2014034443A1 (ja) * 2012-08-31 2014-03-06 ソニー株式会社 配線基板及び配線基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3218584A (en) 1964-01-02 1965-11-16 Sanders Associates Inc Strip line connection
US3303439A (en) 1965-06-14 1967-02-07 Western Electric Co Strip transmission line interboard connection
SE426894B (sv) * 1981-06-30 1983-02-14 Ericsson Telefon Ab L M Impedansriktig koaxialovergang for mikrovagssignaler
US4816791A (en) * 1987-11-27 1989-03-28 General Electric Company Stripline to stripline coaxial transition
US5644276A (en) * 1996-05-29 1997-07-01 The United States Of America As Represented By The Secretary Of The Army Multi-layer controllable impedance transition device for microwaves/millimeter waves

Also Published As

Publication number Publication date
DE69937357D1 (de) 2007-11-29
CN1147021C (zh) 2004-04-21
EP1110268A1 (en) 2001-06-27
KR20010079698A (ko) 2001-08-22
SE512566C2 (sv) 2000-04-03
DE69937357T2 (de) 2008-07-24
AU5892199A (en) 2000-03-21
CA2341645A1 (en) 2000-03-09
EP1110268B1 (en) 2007-10-17
CN1316116A (zh) 2001-10-03
US6459347B1 (en) 2002-10-01
SE9802899L (sv) 2000-02-29
WO2000013254A1 (en) 2000-03-09

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