DE69937357D1 - Verfahren zur senkrechten verbindung von leitern in einer anordnung im mikrowellenbereich - Google Patents

Verfahren zur senkrechten verbindung von leitern in einer anordnung im mikrowellenbereich

Info

Publication number
DE69937357D1
DE69937357D1 DE69937357T DE69937357T DE69937357D1 DE 69937357 D1 DE69937357 D1 DE 69937357D1 DE 69937357 T DE69937357 T DE 69937357T DE 69937357 T DE69937357 T DE 69937357T DE 69937357 D1 DE69937357 D1 DE 69937357D1
Authority
DE
Germany
Prior art keywords
ladders
right connection
microwave arrangement
microwave
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69937357T
Other languages
English (en)
Other versions
DE69937357T2 (de
Inventor
Leif Bergstedt
Katarina Boustedt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of DE69937357D1 publication Critical patent/DE69937357D1/de
Publication of DE69937357T2 publication Critical patent/DE69937357T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguides (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69937357T 1998-08-28 1999-08-26 Verfahren zur senkrechten verbindung von leitern in einer anordnung im mikrowellenbereich Expired - Lifetime DE69937357T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9802899 1998-08-28
SE9802899A SE512566C2 (sv) 1998-08-28 1998-08-28 Metod för vertikal förbindning av ledare i en anordning på mikrovågsområdet
PCT/SE1999/001466 WO2000013254A1 (en) 1998-08-28 1999-08-26 Method for vertical connection of conductors in a device in the microwave range

Publications (2)

Publication Number Publication Date
DE69937357D1 true DE69937357D1 (de) 2007-11-29
DE69937357T2 DE69937357T2 (de) 2008-07-24

Family

ID=20412401

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69937357T Expired - Lifetime DE69937357T2 (de) 1998-08-28 1999-08-26 Verfahren zur senkrechten verbindung von leitern in einer anordnung im mikrowellenbereich

Country Status (9)

Country Link
US (1) US6459347B1 (de)
EP (1) EP1110268B1 (de)
KR (1) KR20010079698A (de)
CN (1) CN1147021C (de)
AU (1) AU5892199A (de)
CA (1) CA2341645A1 (de)
DE (1) DE69937357T2 (de)
SE (1) SE512566C2 (de)
WO (1) WO2000013254A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4029759B2 (ja) * 2003-04-04 2008-01-09 株式会社デンソー 多層回路基板およびその製造方法
CN104604345A (zh) * 2012-08-31 2015-05-06 索尼公司 布线板及布线板的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3218584A (en) 1964-01-02 1965-11-16 Sanders Associates Inc Strip line connection
US3303439A (en) 1965-06-14 1967-02-07 Western Electric Co Strip transmission line interboard connection
SE426894B (sv) * 1981-06-30 1983-02-14 Ericsson Telefon Ab L M Impedansriktig koaxialovergang for mikrovagssignaler
US4816791A (en) * 1987-11-27 1989-03-28 General Electric Company Stripline to stripline coaxial transition
US5644276A (en) * 1996-05-29 1997-07-01 The United States Of America As Represented By The Secretary Of The Army Multi-layer controllable impedance transition device for microwaves/millimeter waves

Also Published As

Publication number Publication date
US6459347B1 (en) 2002-10-01
DE69937357T2 (de) 2008-07-24
SE9802899L (sv) 2000-02-29
SE512566C2 (sv) 2000-04-03
CN1147021C (zh) 2004-04-21
WO2000013254A1 (en) 2000-03-09
KR20010079698A (ko) 2001-08-22
EP1110268A1 (de) 2001-06-27
CA2341645A1 (en) 2000-03-09
SE9802899D0 (sv) 1998-08-28
EP1110268B1 (de) 2007-10-17
CN1316116A (zh) 2001-10-03
AU5892199A (en) 2000-03-21

Similar Documents

Publication Publication Date Title
DE69529271D1 (de) Verfahren zur verbesserung der funkflachendeckung in einer mikrozellulosen umgebung
DE69739444D1 (de) Verfahren zur Verbesserung der Lötbarkeit einer Oberfläche
DE59807264D1 (de) Verfahren zur koordination von netzwerkkomponenten
DE69932105D1 (de) Verfahren zum Verpacken einer Subträgerbaugruppe
DE69835962D1 (de) Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte
DE69931218D1 (de) Verfahren zur synchronisierung von netzwerkknoten
DE69714583D1 (de) Verfahren zur zerstäubung von flüssigkeiten
DE69838618D1 (de) Verfahren zur anzeige einer empfangenen nachricht
DE69838581D1 (de) Verfahren zur determinierung von fehlern im form einer willkürlichen krummen oberflache
DE59901519D1 (de) Verfahren zur ermittlung einer anfahr-gangstufe
DE59911205D1 (de) Verfahren und anordnung zur authentifikation von einer ersten instanz und einer zweiten instanz
DE69933427D1 (de) Verfahren zur Entfernung einer Wärmedämmschicht
DE59814131D1 (de) Verfahren zur Bestimmung der Viskosität einer Flüssigkeit
DE69938857D1 (de) Verfahren zur Wiederzuweisung der Verbindungserkennung in einem Verbindugsorientierten Netz
DE60022003D1 (de) Schaufelbefestigungsanordnung und Verfahren zur Reduzierung von Spannungen in einer Schaufelbefestigungsanordnung
DE69936159D1 (de) Verfahren zur Abstützung einer Leiterplatte
DE69841079D1 (de) Verfahren zur herstellung von inorganischem material in einer kapillare
DE69920629D1 (de) Verfahren zur Herstellung einer biegsamen Schaltungsplatte
DE59902287D1 (de) Verfahren zur ermittlung einer anfahr-gangstufe
DE69534099D1 (de) Verfahren zur isolierung einer quadrupolionenfalle
DE69837431D1 (de) Verfahren zur verfügungsstellung von zeitssynchronisierung in einem netzwerk
DE59710783D1 (de) Verfahren zur Einrichtung einer Düsenanordnung in einem Waschturm
DE69904438D1 (de) Verfahren zur entfernung von halogenverbindungen in einem gas oder einer flüssigkeit
DE69824451D1 (de) Verfahren zur durchgehenden beschichtung von nahtstellen aufweisenden bahnen
DE69918678D1 (de) Verfahren zur bestimmung von handbetätigten auslösungen in einer intelligenten elektronischen vorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition