SE9704607D0 - A method and apparatus for magnetically enhanced sputtering - Google Patents
A method and apparatus for magnetically enhanced sputteringInfo
- Publication number
- SE9704607D0 SE9704607D0 SE9704607A SE9704607A SE9704607D0 SE 9704607 D0 SE9704607 D0 SE 9704607D0 SE 9704607 A SE9704607 A SE 9704607A SE 9704607 A SE9704607 A SE 9704607A SE 9704607 D0 SE9704607 D0 SE 9704607D0
- Authority
- SE
- Sweden
- Prior art keywords
- power
- pulses
- sputtering
- regions
- target
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/53—Generators characterised by the type of circuit or by the means used for producing pulses by the use of an energy-accumulating element discharged through the load by a switching device controlled by an external signal and not incorporating positive feedback
- H03K3/57—Generators characterised by the type of circuit or by the means used for producing pulses by the use of an energy-accumulating element discharged through the load by a switching device controlled by an external signal and not incorporating positive feedback the switching device being a semiconductor device
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9704607A SE9704607D0 (sv) | 1997-12-09 | 1997-12-09 | A method and apparatus for magnetically enhanced sputtering |
AU64291/98A AU6429198A (en) | 1997-12-09 | 1998-03-11 | A method and apparatus for magnetically enhanced sputtering |
CA002284181A CA2284181A1 (en) | 1997-03-11 | 1998-03-11 | A method and apparatus for magnetically enhanced sputtering |
PCT/SE1998/000442 WO1998040532A1 (en) | 1997-03-11 | 1998-03-11 | A method and apparatus for magnetically enhanced sputtering |
EP98909932.0A EP1038045B1 (en) | 1997-12-09 | 1998-03-11 | A method for magnetically enhanced sputtering |
US09/393,294 US6296742B1 (en) | 1997-03-11 | 1999-09-10 | Method and apparatus for magnetically enhanced sputtering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9704607A SE9704607D0 (sv) | 1997-12-09 | 1997-12-09 | A method and apparatus for magnetically enhanced sputtering |
Publications (1)
Publication Number | Publication Date |
---|---|
SE9704607D0 true SE9704607D0 (sv) | 1997-12-09 |
Family
ID=20409338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9704607A SE9704607D0 (sv) | 1997-03-11 | 1997-12-09 | A method and apparatus for magnetically enhanced sputtering |
Country Status (5)
Country | Link |
---|---|
US (1) | US6296742B1 (xx) |
EP (1) | EP1038045B1 (xx) |
AU (1) | AU6429198A (xx) |
SE (1) | SE9704607D0 (xx) |
WO (1) | WO1998040532A1 (xx) |
Families Citing this family (71)
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SE519931C2 (sv) * | 2000-06-19 | 2003-04-29 | Chemfilt R & D Ab | Anordning och förfarande för pulsad, starkt joniserad magnetronsputtering |
DE10124749A1 (de) * | 2001-05-21 | 2002-11-28 | Wolf-Dieter Muenz | Kombiniertes Beschichtungs Verfahren magnetfeldunterstützte Hochleistungs-Impuls-Kathodenzerstäubung und Unbalanziertes Magnetron |
SE525231C2 (sv) | 2001-06-14 | 2005-01-11 | Chemfilt R & D Ab | Förfarande och anordning för att alstra plasma |
EP1488444B1 (de) * | 2002-03-15 | 2016-11-02 | Oerlikon Surface Solutions AG, Pfäffikon | Vakuumplasmagenerator |
US6808607B2 (en) * | 2002-09-25 | 2004-10-26 | Advanced Energy Industries, Inc. | High peak power plasma pulsed supply with arc handling |
US7147759B2 (en) | 2002-09-30 | 2006-12-12 | Zond, Inc. | High-power pulsed magnetron sputtering |
US6896775B2 (en) | 2002-10-29 | 2005-05-24 | Zond, Inc. | High-power pulsed magnetically enhanced plasma processing |
US6853142B2 (en) | 2002-11-04 | 2005-02-08 | Zond, Inc. | Methods and apparatus for generating high-density plasma |
US6896773B2 (en) | 2002-11-14 | 2005-05-24 | Zond, Inc. | High deposition rate sputtering |
US20040112735A1 (en) * | 2002-12-17 | 2004-06-17 | Applied Materials, Inc. | Pulsed magnetron for sputter deposition |
US6805779B2 (en) | 2003-03-21 | 2004-10-19 | Zond, Inc. | Plasma generation using multi-step ionization |
US6806651B1 (en) | 2003-04-22 | 2004-10-19 | Zond, Inc. | High-density plasma source |
GB2401116A (en) * | 2003-04-28 | 2004-11-03 | Hauzer Techno Coating Bv | Plasma Assisted Chemical Vapour Deposition |
US6903511B2 (en) * | 2003-05-06 | 2005-06-07 | Zond, Inc. | Generation of uniformly-distributed plasma |
SE0302045D0 (sv) * | 2003-07-10 | 2003-07-10 | Chemfilt R & D Ab | Work piece processing by pulsed electric discharges in solid-gas plasmas |
US20050103620A1 (en) * | 2003-11-19 | 2005-05-19 | Zond, Inc. | Plasma source with segmented magnetron cathode |
US9771648B2 (en) * | 2004-08-13 | 2017-09-26 | Zond, Inc. | Method of ionized physical vapor deposition sputter coating high aspect-ratio structures |
US7081186B2 (en) | 2003-11-20 | 2006-07-25 | Sheffield Hallam University | Combined coating process comprising magnetic field-assisted, high power, pulsed cathode sputtering and an unbalanced magnetron |
US7663319B2 (en) | 2004-02-22 | 2010-02-16 | Zond, Inc. | Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities |
US9123508B2 (en) | 2004-02-22 | 2015-09-01 | Zond, Llc | Apparatus and method for sputtering hard coatings |
US7095179B2 (en) | 2004-02-22 | 2006-08-22 | Zond, Inc. | Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities |
US20070144901A1 (en) * | 2004-03-15 | 2007-06-28 | Skotheim Terje A | Pulsed cathodic arc plasma |
US7750575B2 (en) | 2004-04-07 | 2010-07-06 | Zond, Inc. | High density plasma source |
EP1622085A1 (en) * | 2004-07-19 | 2006-02-01 | Deutsches Krebsforschungszentrum | Method of producing x-ray computer tomography images from limited data of an image object |
EP1803142A1 (en) * | 2004-09-24 | 2007-07-04 | Zond, Inc. | Apparatus for generating high-current electrical discharges |
US9997338B2 (en) * | 2005-03-24 | 2018-06-12 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for operating a pulsed arc source |
WO2006099759A2 (de) * | 2005-03-24 | 2006-09-28 | Oerlikon Trading Ag, Trübbach | Vakuumplasmagenerator |
US7914586B2 (en) * | 2005-06-10 | 2011-03-29 | The Ohio Willow Wood Company | Prosthetic device utilizing electric vacuum pump |
US20060283702A1 (en) * | 2005-06-21 | 2006-12-21 | Applied Materials, Inc. | Random pulsed DC power supply |
DE102005033769B4 (de) * | 2005-07-15 | 2009-10-22 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Verfahren und Vorrichtung zur Mehrkathoden-PVD-Beschichtung und Substrat mit PVD-Beschichtung |
US7432184B2 (en) * | 2005-08-26 | 2008-10-07 | Applied Materials, Inc. | Integrated PVD system using designated PVD chambers |
US20070048451A1 (en) * | 2005-08-26 | 2007-03-01 | Applied Materials, Inc. | Substrate movement and process chamber scheduling |
DE102006017382A1 (de) * | 2005-11-14 | 2007-05-16 | Itg Induktionsanlagen Gmbh | Verfahren und Vorrichtung zum Beschichten und/oder zur Behandlung von Oberflächen |
DE102006061324B4 (de) * | 2006-06-20 | 2008-07-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Regelung eines reaktiven Hochleistungs-Puls-Magnetronsputterprozesses und Vorrichtung hierzu |
EP1936008A1 (fr) * | 2006-12-22 | 2008-06-25 | AGC Flat Glass Europe SA | Formation de couches par magnétron |
US7782569B2 (en) * | 2007-01-18 | 2010-08-24 | Sae Magnetics (Hk) Ltd. | Magnetic recording head and media comprising aluminum oxynitride underlayer and a diamond-like carbon overcoat |
US20080187781A1 (en) * | 2007-02-05 | 2008-08-07 | Sae Magnetics (Hk) Ltd. | Magnetic recording head and media overcoat |
US8014104B2 (en) * | 2007-03-21 | 2011-09-06 | Sae Magnetics (Hk) Ltd. | Magnetic head/disk with transition metal oxynitride adhesion/corrosion barrier and diamond-like carbon overcoat bilayer |
DE102007021386A1 (de) * | 2007-05-04 | 2008-11-06 | Christof-Herbert Diener | Kurztaktniederdruckplasmaanlage |
SE533395C2 (sv) * | 2007-06-08 | 2010-09-14 | Sandvik Intellectual Property | Sätt att göra PVD-beläggningar |
US7966909B2 (en) * | 2007-07-25 | 2011-06-28 | The Gillette Company | Process of forming a razor blade |
WO2009040406A2 (de) * | 2007-09-25 | 2009-04-02 | Von Ardenne Anlagentechnik Gmbh | Verfahren und anordnung zum redundanten anoden-sputtern mit einer dual-anoden-anordnung |
SE532505C2 (sv) * | 2007-12-12 | 2010-02-09 | Plasmatrix Materials Ab | Förfarande för plasmaaktiverad kemisk ångdeponering och plasmasönderdelningsenhet |
CN101983253B (zh) | 2008-04-03 | 2012-10-24 | Oc欧瑞康巴尔查斯股份有限公司 | 溅射设备及制造金属化结构的方法 |
DE102008019202A1 (de) | 2008-04-17 | 2009-10-22 | Kennametal Inc. | Beschichtungsverfahren , Werkstück oder Werkzeug und dessen Verwendung |
EP2272080B1 (de) | 2008-04-28 | 2012-08-01 | CemeCon AG | Vorrichtung und verfahren zum vorbehandeln und beschichten von körpern |
DE102008021912C5 (de) | 2008-05-01 | 2018-01-11 | Cemecon Ag | Beschichtungsverfahren |
ATE535629T1 (de) | 2008-07-29 | 2011-12-15 | Sulzer Metaplas Gmbh | Gepulstes hochleistungs-magnetronsputterverfahren sowie hochleistungs-elektroenergiequelle |
US20100055826A1 (en) * | 2008-08-26 | 2010-03-04 | General Electric Company | Methods of Fabrication of Solar Cells Using High Power Pulsed Magnetron Sputtering |
JP2010065240A (ja) | 2008-09-08 | 2010-03-25 | Kobe Steel Ltd | スパッタ装置 |
DE102008050499B4 (de) | 2008-10-07 | 2014-02-06 | Systec System- Und Anlagentechnik Gmbh & Co. Kg | PVD-Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens und nach dem Verfahren beschichtete Substrate |
US20110005920A1 (en) * | 2009-07-13 | 2011-01-13 | Seagate Technology Llc | Low Temperature Deposition of Amorphous Thin Films |
US20110011737A1 (en) * | 2009-07-17 | 2011-01-20 | Institute Of Nuclear Energy Research Atomic Energy Council, Executive Yuan | High-power pulse magnetron sputtering apparatus and surface treatment apparatus using the same |
WO2011135100A1 (de) | 2010-04-30 | 2011-11-03 | Cemecon Ag | Beschichteter körper sowie ein verfahren zur beschichtung eines körpers |
CN101824602B (zh) * | 2010-05-07 | 2011-08-10 | 西安理工大学 | 一种具有高启动电压的磁控溅射脉冲电源 |
US9249498B2 (en) * | 2010-06-28 | 2016-02-02 | Micron Technology, Inc. | Forming memory using high power impulse magnetron sputtering |
CN101949000A (zh) * | 2010-09-17 | 2011-01-19 | 温州市佳能真空电镀设备科技有限公司 | 真空磁控溅射多弧离子复合镀膜机 |
DE102010061487A1 (de) | 2010-12-22 | 2012-06-28 | EB Immobilien und Maschinen GmbH & Co. KG | Verfahren zum Behandeln und/oder Beschichten von Oberflächen |
SE536285C2 (sv) * | 2011-04-07 | 2013-07-30 | Ionautics Ab | Sputtringsprocess för att sputtra ett target av kol |
EP2541584B1 (en) * | 2011-06-27 | 2018-08-08 | TRUMPF Huettinger Sp. Z o. o. | Generating a highly ionized plasma in a plasma chamber |
US9761424B1 (en) | 2011-09-07 | 2017-09-12 | Nano-Product Engineering, LLC | Filtered cathodic arc method, apparatus and applications thereof |
US10304665B2 (en) | 2011-09-07 | 2019-05-28 | Nano-Product Engineering, LLC | Reactors for plasma-assisted processes and associated methods |
US9088207B2 (en) * | 2012-06-04 | 2015-07-21 | Stangenes Industries, Inc. | Long pulse droop compensator |
US9412569B2 (en) | 2012-09-14 | 2016-08-09 | Vapor Technologies, Inc. | Remote arc discharge plasma assisted processes |
US10056237B2 (en) | 2012-09-14 | 2018-08-21 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
US9793098B2 (en) | 2012-09-14 | 2017-10-17 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
US9508532B2 (en) | 2013-03-13 | 2016-11-29 | Bb Plasma Design Ab | Magnetron plasma apparatus |
DE102014105414A1 (de) | 2014-04-16 | 2015-11-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Erzeugen eines Plasmas |
US11834204B1 (en) | 2018-04-05 | 2023-12-05 | Nano-Product Engineering, LLC | Sources for plasma assisted electric propulsion |
DE102018112335A1 (de) * | 2018-05-23 | 2019-11-28 | Hartmetall-Werkzeugfabrik Paul Horn Gmbh | Magnetronsputtervorrichtung |
GB2586971B (en) * | 2019-09-06 | 2023-11-01 | Edwards Vacuum Llc | Reducing plasma formation in an ion pump |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4049533A (en) * | 1975-09-10 | 1977-09-20 | Golyanov Vyacheslav Mikhailovi | Device for producing coatings by means of ion sputtering |
US4167370A (en) * | 1976-11-01 | 1979-09-11 | Massachusetts Institute Of Technology | Method of an apparatus for self-sustaining high vacuum in a high voltage environment |
JPS61238958A (ja) | 1985-04-15 | 1986-10-24 | Hitachi Ltd | 複合薄膜形成法及び装置 |
DE3700633C2 (de) | 1987-01-12 | 1997-02-20 | Reinar Dr Gruen | Verfahren und Vorrichtung zum schonenden Beschichten elektrisch leitender Gegenstände mittels Plasma |
FR2670829B1 (fr) | 1990-12-19 | 1993-04-16 | Labo Ind | Generateur d'allumage haute energie notamment pour turbine a gaz. |
DE4127317C2 (de) | 1991-08-17 | 1999-09-02 | Leybold Ag | Einrichtung zum Behandeln von Substraten |
DE4202425C2 (de) | 1992-01-29 | 1997-07-17 | Leybold Ag | Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten |
FR2699934B1 (fr) | 1992-12-30 | 1995-03-17 | Lorraine Inst Nat Polytech | Procédé de contrôle de la concentration en métalloïde d'un dépôt réalisés par voie physique en phase vapeur réactive à l'aide d'un plasma froid de pulvérisation. |
US5718813A (en) * | 1992-12-30 | 1998-02-17 | Advanced Energy Industries, Inc. | Enhanced reactive DC sputtering system |
US5993613A (en) * | 1997-11-07 | 1999-11-30 | Sierra Applied Sciences, Inc. | Method and apparatus for periodic polarity reversal during an active state |
-
1997
- 1997-12-09 SE SE9704607A patent/SE9704607D0/xx unknown
-
1998
- 1998-03-11 WO PCT/SE1998/000442 patent/WO1998040532A1/en active Application Filing
- 1998-03-11 EP EP98909932.0A patent/EP1038045B1/en not_active Expired - Lifetime
- 1998-03-11 AU AU64291/98A patent/AU6429198A/en not_active Abandoned
-
1999
- 1999-09-10 US US09/393,294 patent/US6296742B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO1998040532A1 (en) | 1998-09-17 |
EP1038045B1 (en) | 2013-11-13 |
US6296742B1 (en) | 2001-10-02 |
EP1038045A1 (en) | 2000-09-27 |
AU6429198A (en) | 1998-09-29 |
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