SE8902068D0 - Metod foer snittning av moensterkort - Google Patents
Metod foer snittning av moensterkortInfo
- Publication number
- SE8902068D0 SE8902068D0 SE8902068A SE8902068A SE8902068D0 SE 8902068 D0 SE8902068 D0 SE 8902068D0 SE 8902068 A SE8902068 A SE 8902068A SE 8902068 A SE8902068 A SE 8902068A SE 8902068 D0 SE8902068 D0 SE 8902068D0
- Authority
- SE
- Sweden
- Prior art keywords
- equipment
- sample
- retainer
- adjustment
- cut
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Sampling And Sample Adjustment (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8902068A SE464792B (sv) | 1989-06-08 | 1989-06-08 | Metod foer snittning av moensterkort |
PCT/SE1990/000383 WO1990015519A1 (en) | 1989-06-08 | 1990-06-01 | Method for cutting printed boards for examination of the plating result on the walls in holes arranged in the board |
EP90909496A EP0476029B1 (en) | 1989-06-08 | 1990-06-01 | Method for cutting printed boards for examination of the plating result on the walls in holes arranged in the board |
DE69012993T DE69012993T2 (de) | 1989-06-08 | 1990-06-01 | Verfahren zum schneiden von gedruckten leiterplatten zur prüfung der beschichtung an den wänden der bohrungen der platte. |
JP50897590A JPH04506256A (ja) | 1989-06-08 | 1990-06-01 | プリント基板の切断方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8902068A SE464792B (sv) | 1989-06-08 | 1989-06-08 | Metod foer snittning av moensterkort |
Publications (3)
Publication Number | Publication Date |
---|---|
SE8902068D0 true SE8902068D0 (sv) | 1989-06-08 |
SE8902068L SE8902068L (sv) | 1990-12-09 |
SE464792B SE464792B (sv) | 1991-06-10 |
Family
ID=20376213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8902068A SE464792B (sv) | 1989-06-08 | 1989-06-08 | Metod foer snittning av moensterkort |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0476029B1 (sv) |
JP (1) | JPH04506256A (sv) |
DE (1) | DE69012993T2 (sv) |
SE (1) | SE464792B (sv) |
WO (1) | WO1990015519A1 (sv) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105043828B (zh) * | 2015-06-03 | 2018-06-29 | 洛阳伟信电子科技有限公司 | 一种pcb金相切片精确磨抛到位的方法 |
CN111315143A (zh) * | 2020-04-01 | 2020-06-19 | 艾因蒂克检测科技(上海)股份有限公司 | 一种取缔焊接导通的粘接分切工艺 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK125217B (da) * | 1970-02-23 | 1973-01-15 | Struers Chem Labor | Slibe- eller polereemne med tilhørende prøveholder til anvendelse ved slibning eller polering til mikroundersøgelsesformål. |
SE452660B (sv) * | 1983-03-01 | 1987-12-07 | Tore Gottfrid Hesselgren | Metod for att preparera prov for undersokning av kvaliteten pa metallbeleggningar i hal i ett monsterkort |
-
1989
- 1989-06-08 SE SE8902068A patent/SE464792B/sv not_active IP Right Cessation
-
1990
- 1990-06-01 DE DE69012993T patent/DE69012993T2/de not_active Expired - Fee Related
- 1990-06-01 EP EP90909496A patent/EP0476029B1/en not_active Expired - Lifetime
- 1990-06-01 JP JP50897590A patent/JPH04506256A/ja active Pending
- 1990-06-01 WO PCT/SE1990/000383 patent/WO1990015519A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0476029A1 (en) | 1992-03-25 |
EP0476029B1 (en) | 1994-09-28 |
SE464792B (sv) | 1991-06-10 |
JPH04506256A (ja) | 1992-10-29 |
SE8902068L (sv) | 1990-12-09 |
WO1990015519A1 (en) | 1990-12-13 |
DE69012993T2 (de) | 1995-05-11 |
DE69012993D1 (de) | 1994-11-03 |
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