SE8205343D0 - WANT TO MAKE ELECTRONIC COMPONENTS - Google Patents

WANT TO MAKE ELECTRONIC COMPONENTS

Info

Publication number
SE8205343D0
SE8205343D0 SE8205343A SE8205343A SE8205343D0 SE 8205343 D0 SE8205343 D0 SE 8205343D0 SE 8205343 A SE8205343 A SE 8205343A SE 8205343 A SE8205343 A SE 8205343A SE 8205343 D0 SE8205343 D0 SE 8205343D0
Authority
SE
Sweden
Prior art keywords
components
substrate
connections
impressions
holes
Prior art date
Application number
SE8205343A
Other languages
Swedish (sv)
Other versions
SE443485B (en
SE8205343L (en
Inventor
G Bjorklund
L-A Olofsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE8205343A priority Critical patent/SE443485B/en
Publication of SE8205343D0 publication Critical patent/SE8205343D0/en
Priority to EP83902966A priority patent/EP0119241B1/en
Priority to PCT/SE1983/000326 priority patent/WO1984001259A1/en
Priority to JP50301683A priority patent/JPS59501566A/en
Priority to DE8383902966T priority patent/DE3368848D1/en
Publication of SE8205343L publication Critical patent/SE8205343L/en
Publication of SE443485B publication Critical patent/SE443485B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/255—Means for correcting the capacitance value
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H2069/025—Manufacture of fuses using lasers

Abstract

Method of producing electronic components, e.g. resistors, capacitances, fuses and the like. The components consist of an insulating substrate with electrical connections, connected by layers or wires. In accordance with the invention, the components (5) and their connections are applied to a common substrate (1), which is provided with fractural impressions (6). The components lie in the areas between the impressions. The connections are produced by making holes in the substrate along certain of the fractural impressions (6), and the envelope surface of the holes being coated with conductive material (4), as well as an area about the holes on both sides of the substrate. The components (5) are connected to the connections, subsequent to which the substrate is divided into individual components along the fractural impressions. Certain components require adjustment in manufacture, e.g. by laser beam. This adjustment is carried out before the substrate is divided up.
SE8205343A 1982-09-17 1982-09-17 WANT TO MAKE ELECTRONIC COMPONENTS SE443485B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE8205343A SE443485B (en) 1982-09-17 1982-09-17 WANT TO MAKE ELECTRONIC COMPONENTS
EP83902966A EP0119241B1 (en) 1982-09-17 1983-09-14 A method of producing electronic components
PCT/SE1983/000326 WO1984001259A1 (en) 1982-09-17 1983-09-14 A method of producing electronic components
JP50301683A JPS59501566A (en) 1982-09-17 1983-09-14 Electronic element manufacturing method
DE8383902966T DE3368848D1 (en) 1982-09-17 1983-09-14 A method of producing electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8205343A SE443485B (en) 1982-09-17 1982-09-17 WANT TO MAKE ELECTRONIC COMPONENTS

Publications (3)

Publication Number Publication Date
SE8205343D0 true SE8205343D0 (en) 1982-09-17
SE8205343L SE8205343L (en) 1984-03-18
SE443485B SE443485B (en) 1986-02-24

Family

ID=20347902

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8205343A SE443485B (en) 1982-09-17 1982-09-17 WANT TO MAKE ELECTRONIC COMPONENTS

Country Status (5)

Country Link
EP (1) EP0119241B1 (en)
JP (1) JPS59501566A (en)
DE (1) DE3368848D1 (en)
SE (1) SE443485B (en)
WO (1) WO1984001259A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8403968D0 (en) * 1984-02-15 1984-03-21 Heraeus Gmbh W C Chip resistors
US4771260A (en) * 1987-03-24 1988-09-13 Cooper Industries, Inc. Wire bonded microfuse and method of making
GB2248345B (en) * 1990-09-27 1994-06-22 Stc Plc Edge soldering of electronic components
US5258738A (en) * 1991-04-16 1993-11-02 U.S. Philips Corporation SMD-resistor
US5852397A (en) * 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
EP0766867B1 (en) * 1994-06-09 2002-11-20 Tyco Electronics Corporation Electrical devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1236580A (en) * 1967-12-20 1971-06-23 Sangamo Weston Improvements in or relating to electrical resistors
AU5999669A (en) * 1969-08-25 1971-03-04 Technograph Limited Improved plated through hole printed circuit boards
FI52780C (en) * 1974-06-18 1977-11-10 Paramic Ab Oy Resistance network with adjustable resistance value.
US4032881A (en) * 1976-02-06 1977-06-28 Bourns, Inc. Resistance element with improved linearity and method of making the same
US4228418A (en) * 1979-03-28 1980-10-14 The United States Of America As Represented By The Secretary Of The Army Modular trim resistive network
DE3008143C2 (en) * 1980-03-04 1982-04-08 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Process for the production of printed circuit boards with perforations, the walls of which are metallized

Also Published As

Publication number Publication date
EP0119241B1 (en) 1986-12-30
SE443485B (en) 1986-02-24
WO1984001259A1 (en) 1984-03-29
EP0119241A1 (en) 1984-09-26
DE3368848D1 (en) 1987-02-05
JPS59501566A (en) 1984-08-30
SE8205343L (en) 1984-03-18

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