EP0119241B1 - A method of producing electronic components - Google Patents
A method of producing electronic componentsInfo
- Publication number
- EP0119241B1 EP0119241B1 EP83902966A EP83902966A EP0119241B1 EP 0119241 B1 EP0119241 B1 EP 0119241B1 EP 83902966 A EP83902966 A EP 83902966A EP 83902966 A EP83902966 A EP 83902966A EP 0119241 B1 EP0119241 B1 EP 0119241B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- components
- substrate
- impressions
- holes
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/255—Means for correcting the capacitance value
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H2069/025—Manufacture of fuses using lasers
Definitions
- the invention relates to a method of producing electronic components (resistors, capac tances, fuses and the like ) which includes an insula ⁇ ting substrate provided with layers or wires and electrical connections for the components.
- Microelectronic components have so small dimensions that difficulties occur in their manufacture. This applies to handling individual compo ⁇ nents in the manufacturing process itself, as well as tnei r after treatment
- One example of the former is fuses,of which the dimensions up to now must exceed a given minimum, because a reduction thereof would result in complicated time-consuming handling.
- An example of the latter is resistances which require adjustment after manufacture.
- the basic concept of the invention is to manufacture electronic compo ⁇ nents of the type mentioned in the introduction on a common substrate and to perform all operations before the substrate is divided up to individual components.
- Figure 1 is a portion of the substrate provided with resistors
- Figure 2 is a portion of the substrate provided with wire fuses
- Figure 3 is a cross-section to a larger scale of a resistor with connections.
- a non-conductive substrate 1, according to figure ' is provided during the course of production with a first set of parallel fractural impres ⁇ sions 2, e.g. grooves, which define strips with the width of the ready
- the substrate is then provided with uniformly spaced through holes 3 along the central lines of these strips, so that the holes form columns.
- the substrate is provided with a second set of parallel frac ⁇ tural impressions 6 passing through the holes 3.
- the impressions 6 are at right angles to the impressions 2 and define the length of the compo ⁇ nent.
- the inside of each hole, together with a minor area round the hole on both sides of the substrate, is coated with a metal paste 4 to form electrical connections for the component.
- a layer of electrically resistive material 5 is deposited in the form of squares in the areas defined by the fractural impressions, such that all squares will be separated from each other but each has contact with two electrical connections, the squares thus being connected in series in rows.
- FIG. 1 illustrates a substrate 11, provided witn fractural impressions 12,16 and holes 13, in the same way as the embodiment of figure 1.
- the holes are provided with a conductive coating 14, which is sintered to provide electrical connections.
- a layer of electrically conductive material is applied, in the form of two mutually separated squares 17 and 18 within a field defined by the fractural impressions, such that these squares are each in electrical contact with a connection.
- metal wires 15, constituting fuse elements are fastened between the squares 17 and 18, e.g. by thermo-compression or supersonic welding.
- a Layer is applied between two connections in the manner apparent from the description applying to figure 1.
- These Layers are electrically conductive in this application, and their thickness, width and Length adapted to a given current strength at which the layer fuses.
- the layer may be heatinsulated from the sub ⁇ strate with the aid of a glass coating, whereby its ability to with ⁇ stand current is decreased.
- the final step in the manufacture of fusable fuses is performed in the same way as with the method according to figure 1, namely in that the individual components are obtained by the common substrate being ruptured along the fractural impressions.
- Figure 3 illustrates an electrical connection in cross-section.
- the metal paste is applied by impressing from one or two sides, according to need, subsequent to which the viscous material forms a coating on the inner wall of the hole.
- the conductive material constituting the coating of the hole is in electrical contact with the layer 5.
- the method in accordance with the above signifies the advance in respect to the prior art residing in that the individual components can be processed in one operation during manufacture, while these are still in one continuous unit, where each unit embraces a number of components in the order of magnitude of 100, for example. Such operations are enabled since each component has a well-defined fixed location in the common substrate.
- An advantage is obtained if, in accordance with the invention, the electrical connections are made available from both of the substrate. This makes the ready components easy to assemble on a printed board assembly with the aid of so-called surface soldering.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8205343A SE443485B (en) | 1982-09-17 | 1982-09-17 | WANT TO MAKE ELECTRONIC COMPONENTS |
SE8205343 | 1982-09-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0119241A1 EP0119241A1 (en) | 1984-09-26 |
EP0119241B1 true EP0119241B1 (en) | 1986-12-30 |
Family
ID=20347902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP83902966A Expired EP0119241B1 (en) | 1982-09-17 | 1983-09-14 | A method of producing electronic components |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0119241B1 (en) |
JP (1) | JPS59501566A (en) |
DE (1) | DE3368848D1 (en) |
SE (1) | SE443485B (en) |
WO (1) | WO1984001259A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8403968D0 (en) * | 1984-02-15 | 1984-03-21 | Heraeus Gmbh W C | Chip resistors |
US4771260A (en) * | 1987-03-24 | 1988-09-13 | Cooper Industries, Inc. | Wire bonded microfuse and method of making |
GB2248345B (en) * | 1990-09-27 | 1994-06-22 | Stc Plc | Edge soldering of electronic components |
US5258738A (en) * | 1991-04-16 | 1993-11-02 | U.S. Philips Corporation | SMD-resistor |
US5852397A (en) * | 1992-07-09 | 1998-12-22 | Raychem Corporation | Electrical devices |
EP0766867B1 (en) * | 1994-06-09 | 2002-11-20 | Tyco Electronics Corporation | Electrical devices |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1236580A (en) * | 1967-12-20 | 1971-06-23 | Sangamo Weston | Improvements in or relating to electrical resistors |
AU5999669A (en) * | 1969-08-25 | 1971-03-04 | Technograph Limited | Improved plated through hole printed circuit boards |
FI52780C (en) * | 1974-06-18 | 1977-11-10 | Paramic Ab Oy | Resistance network with adjustable resistance value. |
US4032881A (en) * | 1976-02-06 | 1977-06-28 | Bourns, Inc. | Resistance element with improved linearity and method of making the same |
US4228418A (en) * | 1979-03-28 | 1980-10-14 | The United States Of America As Represented By The Secretary Of The Army | Modular trim resistive network |
DE3008143C2 (en) * | 1980-03-04 | 1982-04-08 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Process for the production of printed circuit boards with perforations, the walls of which are metallized |
-
1982
- 1982-09-17 SE SE8205343A patent/SE443485B/en not_active IP Right Cessation
-
1983
- 1983-09-14 JP JP50301683A patent/JPS59501566A/en active Pending
- 1983-09-14 DE DE8383902966T patent/DE3368848D1/en not_active Expired
- 1983-09-14 WO PCT/SE1983/000326 patent/WO1984001259A1/en not_active Application Discontinuation
- 1983-09-14 EP EP83902966A patent/EP0119241B1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
SE443485B (en) | 1986-02-24 |
WO1984001259A1 (en) | 1984-03-29 |
SE8205343D0 (en) | 1982-09-17 |
EP0119241A1 (en) | 1984-09-26 |
DE3368848D1 (en) | 1987-02-05 |
JPS59501566A (en) | 1984-08-30 |
SE8205343L (en) | 1984-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19840418 |
|
AK | Designated contracting states |
Designated state(s): DE FR GB |
|
17Q | First examination report despatched |
Effective date: 19860213 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
PUAC | Information related to the publication of a b1 document modified or deleted |
Free format text: ORIGINAL CODE: 0009299EPPU |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
DB1 | B1 document deleted | ||
REF | Corresponds to: |
Ref document number: 3368848 Country of ref document: DE Date of ref document: 19870205 |
|
18W | Application withdrawn |
Withdrawal date: 19861125 |
|
EN | Fr: translation not filed | ||
GBPC | Gb: european patent ceased through non-payment of renewal fee | ||
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: BJOERKLUND, FRITZ, LARS, GUNNAR Inventor name: OLOFSSON, LARS, ANDERS |