JP2966215B2 - Manufacturing method of fixed resistor for high voltage - Google Patents

Manufacturing method of fixed resistor for high voltage

Info

Publication number
JP2966215B2
JP2966215B2 JP4301093A JP30109392A JP2966215B2 JP 2966215 B2 JP2966215 B2 JP 2966215B2 JP 4301093 A JP4301093 A JP 4301093A JP 30109392 A JP30109392 A JP 30109392A JP 2966215 B2 JP2966215 B2 JP 2966215B2
Authority
JP
Japan
Prior art keywords
resistor
trimming
insulating substrate
fixed
fixed resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4301093A
Other languages
Japanese (ja)
Other versions
JPH06151123A (en
Inventor
弘暢 長谷部
毅 太田
元治 樋上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOKURIKU DENKI KOGYO KK
Original Assignee
HOKURIKU DENKI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOKURIKU DENKI KOGYO KK filed Critical HOKURIKU DENKI KOGYO KK
Priority to JP4301093A priority Critical patent/JP2966215B2/en
Publication of JPH06151123A publication Critical patent/JPH06151123A/en
Application granted granted Critical
Publication of JP2966215B2 publication Critical patent/JP2966215B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、絶縁基板の表面にトリ
ミング抵抗体を含む固定抵抗体が印刷形成されてなる高
電圧用固定抵抗器の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a high-voltage fixed resistor having a fixed resistor including a trimming resistor printed on the surface of an insulating substrate.

【0002】[0002]

【従来の技術】フライバックトラスと高圧側に接続され
るフォーカスパックと呼ばれる高電圧用可変抵抗器のブ
リーダ抵抗等に高電圧用固定抵抗器が用いられている。
図3は、この種の高電圧用固定抵抗器の従来の製造方法
を示している。まず図3(A)に示すように、セラミッ
ク製の一枚の絶縁基板1の上にトリミング抵抗体Rtを
含む第1の固定抵抗体R1と第2の固定抵抗体R2を所
定のパターンで印刷形成し、各固定抵抗体の端部に半田
付け可能な電極T1〜T3を形成した印刷抵抗基板2を
用意する。次に印刷抵抗基板のトリミング抵抗体Rtに
トリミング処理を施して分圧比(R1/R1+R2)を
出す。その後図3(C)に示すように、電極T1〜T3
に引き出しリード線3を半田付け接続した後に、図3
(D)に示すようにリード線3の端部を残すようにして
エポキシ樹脂等の絶縁樹脂材料により全体を絶縁被覆す
る。
2. Description of the Related Art A fixed resistor for high voltage is used as a bleeder resistor of a variable resistor for high voltage called a focus pack connected to a flyback truss and a high voltage side.
FIG. 3 shows a conventional method of manufacturing such a high-voltage fixed resistor. First, as shown in FIG. 3A, a first fixed resistor R1 and a second fixed resistor R2 including a trimming resistor Rt are printed on a single insulating substrate 1 made of ceramic in a predetermined pattern. A printed resistor substrate 2 is prepared, which is formed and has electrodes T1 to T3 that can be soldered to the ends of each fixed resistor. Next, a trimming process is performed on the trimming resistor Rt of the printed resistor substrate to obtain a voltage division ratio (R1 / R1 + R2). Thereafter, as shown in FIG. 3C, the electrodes T1 to T3
After the lead wire 3 is connected by soldering to FIG.
As shown in (D), the whole is insulated and covered with an insulating resin material such as epoxy resin while leaving the end of the lead wire 3.

【0003】この様な一枚の絶縁基板に全ての固定抵抗
体を形成する高電圧用固定抵抗器は、製造は容易である
ものの、印加される電圧が高くなるほど、固定抵抗体の
パターン間における放電の発生を防止するために、絶縁
基板を大きくしなければならない。しかしながら絶縁基
板が大きくなると、それだけ絶縁基板は破損しやすくな
る。そのためフライバックトランス等のように高電圧用
固定抵抗器を硬質の樹脂中に埋設するような用途では、
この硬質の樹脂の応力で絶縁基板にクラックが入った
り、絶縁基板を覆う絶縁被覆層にクラックが入って、高
電圧用固定抵抗器の特性が影響を受ける問題が生じる。
そこで複数枚の絶縁基板に固定抵抗体を分散して形成
し、各絶縁基板の固定抵抗体を接続導体で接続して高電
圧用固定抵抗器を構成することが提案された。
[0003] Such a high-voltage fixed resistor in which all the fixed resistors are formed on one insulating substrate is easy to manufacture, but as the applied voltage increases, the fixed resistor between the patterns of the fixed resistors increases. In order to prevent the occurrence of discharge, the size of the insulating substrate must be increased. However, the larger the insulating substrate, the more easily the insulating substrate is damaged. Therefore, in applications where a high-voltage fixed resistor is embedded in hard resin, such as a flyback transformer,
Cracks occur in the insulating substrate due to the stress of the hard resin, and cracks occur in the insulating coating layer covering the insulating substrate, causing a problem that the characteristics of the high-voltage fixed resistor are affected.
Therefore, it has been proposed to form a fixed resistor for high voltage by dispersing and forming fixed resistors on a plurality of insulating substrates and connecting the fixed resistors on each insulating substrate with a connection conductor.

【0004】[0004]

【発明が解決しようとする課題】複数枚の絶縁基板に固
定抵抗体を分散して形成した場合、絶縁基板の組み合わ
せによって抵抗値が異なってくるため、必ずトリミング
が必要になる。しかしながら接続導体でつながっている
複数枚の絶縁基板をトリミングする作業は非常に作業性
が悪く、またトリミング作業中またはトリミング作業の
ための搬送中に接続導体の接続部に無理な力が加わっ
て、接続不良が発生する問題があった。
In the case where fixed resistors are dispersedly formed on a plurality of insulating substrates, the resistance value differs depending on the combination of the insulating substrates, so that trimming is always required. However, the work of trimming a plurality of insulating substrates connected by the connection conductor is extremely poor in workability, and excessive force is applied to the connection portion of the connection conductor during the trimming work or during transportation for the trimming work, There was a problem of poor connection.

【0005】本発明の目的は、複数枚の絶縁基板によっ
て高電圧用固定抵抗器を構成する場合でも、トリミング
作業を容易に行える高電圧用固定抵抗器の製造方法を提
供することにある。
An object of the present invention is to provide a method of manufacturing a high-voltage fixed resistor that can easily perform a trimming operation even when a high-voltage fixed resistor is formed by a plurality of insulating substrates.

【0006】[0006]

【課題を解決するための手段】本発明は、絶縁基板の表
面にトリミング抵抗体を含む固定抵抗体が印刷形成され
てなる高電圧用固定抵抗器の製造方法を対象として、ま
ず一枚の絶縁基板上に少なくともトリミング抵抗体を含
む第1の固定抵抗体と第2の固定抵抗体ないし第nの固
定抵抗体が電気的に接続された状態で印刷形成された印
刷抵抗基板を用意する。次に第1の固定抵抗体のトリミ
ング抵抗体にトリミングを施した後に、印刷抵抗基板を
前記第1〜第nの固定抵抗体をそれぞれ有する第1〜第
nの絶縁基板に分割する。その後第1の絶縁基板〜第n
の絶縁基板の上に形成した第1〜第nの固定抵抗体をそ
れぞれ接続導体を介して電気的に直列接続する。
SUMMARY OF THE INVENTION The present invention is directed to a method of manufacturing a high-voltage fixed resistor having a fixed resistor including a trimming resistor printed on the surface of an insulating substrate. A printed resistor substrate is prepared by printing on a substrate a first fixed resistor including at least a trimming resistor and a second fixed resistor or an n-th fixed resistor electrically connected. Next, after trimming the trimming resistor of the first fixed resistor, the printed resistor substrate is divided into first to n-th insulating substrates each having the first to n-th fixed resistors. Then, the first insulating substrate to the n-th insulating substrate
The first to n-th fixed resistors formed on the insulating substrate are electrically connected in series via connection conductors.

【0007】[0007]

【作用】最初に高電圧用固定抵抗体を構成する全ての固
定抵抗体を一枚の絶縁基板上に形成しておき、その状態
でトリミングを行えば、トリミング作業を簡単且つ高い
精度で行える。また第1〜第nの絶縁基板の各固定抵抗
体を接続導体で接続した後の作業工程を増やす必要がな
いため、作業工程中において接続不良が発生する可能性
が少なくなる。
First, all the fixed resistors constituting the high-voltage fixed resistor are formed on one insulating substrate, and trimming is performed in this state, so that the trimming operation can be performed easily and with high accuracy. Further, since it is not necessary to increase the number of work steps after connecting the respective fixed resistors of the first to n-th insulating substrates with the connection conductors, the possibility of occurrence of connection failure during the work steps is reduced.

【0008】[0008]

【実施例】以下図面を参照して本発明の実施例を詳細に
説明する。図1(A)〜(E)は、本発明の製造方法の
一実施例を説明するための工程図である。本実施例は、
本発明により二枚の絶縁基板を接続導体で接続した構造
の高電圧用固定抵抗器を製造する場合の実施例である。
まずセラミック製の一枚の絶縁基板11の上にトリミン
グ抵抗体Rtを含む第1の固定抵抗体R1と第2の固定
抵抗体R2を所定のパターンで印刷形成した印刷抵抗基
板12を製造する。絶縁基板11の中央部には、後の基
板分割を容易にするために予め分割線Lに沿って溝が形
成してある。この溝は絶縁基板11の片面側に向かって
開口する断面がV字状の溝であってもよく、また絶縁基
板11の両面側に向かってそれぞれ開口する二つのV字
状の溝等により構成できる。固定抵抗体R1の両端とト
リミング抵抗体Rtの一端には、それぞれ端子電極T1
〜T3が形成されている。また固定抵抗体R2の両端に
も端子電極T4及びT5が形成されている。そして分割
線Lの両側に位置する端子電極T3及びT4は、導電体
Cによって電気的に接続されている。これらの端子電極
T1〜T5及び導電体Cは、銀塗料等の半田付け可能な
導電塗料を印刷して同時に形成することができる。なお
導電性金属端子を適宜の固定方法により絶縁基板11に
固定して端子電極T1〜T5を構成してもよいのは勿論
である。
Embodiments of the present invention will be described below in detail with reference to the drawings. FIGS. 1A to 1E are process diagrams for explaining an embodiment of the manufacturing method of the present invention. In this embodiment,
This is an embodiment in the case of manufacturing a high-voltage fixed resistor having a structure in which two insulating substrates are connected by a connection conductor according to the present invention.
First, a printed resistor substrate 12 is manufactured by printing a first fixed resistor R1 including a trimming resistor Rt and a second fixed resistor R2 in a predetermined pattern on a single insulating substrate 11 made of ceramic. At the center of the insulating substrate 11, a groove is formed in advance along a division line L to facilitate later substrate division. This groove may be a V-shaped groove having a cross section that opens toward one side of the insulating substrate 11, or may include two V-shaped grooves that open toward both sides of the insulating substrate 11. it can. Terminal electrodes T1 are connected to both ends of the fixed resistor R1 and one end of the trimming resistor Rt, respectively.
To T3 are formed. Terminal electrodes T4 and T5 are also formed at both ends of the fixed resistor R2. The terminal electrodes T3 and T4 located on both sides of the dividing line L are electrically connected by the conductor C. The terminal electrodes T1 to T5 and the conductor C can be simultaneously formed by printing a solderable conductive paint such as a silver paint. It is needless to say that the terminal electrodes T1 to T5 may be formed by fixing the conductive metal terminal to the insulating substrate 11 by an appropriate fixing method.

【0009】次に図1(B)に示すように、レーザ光線
等を用いた公知のトリミング技術を用いて、トリミング
抵抗体Rtにトリミングを行う。次にこの例では、Rt
/[(R1−Rt)+R2]の分圧比を出すようにトリ
ミングを行う。そして次に図1(C)に示すように分割
線Lに沿って絶縁基板11を二枚の第1の絶縁基板13
と第2の絶縁基板14とに分割する。この分割は、レー
ザカッタ等の公知の切断技術を用いて行うことができ
る。
Next, as shown in FIG. 1B, trimming is performed on the trimming resistor Rt by using a known trimming technique using a laser beam or the like. Next, in this example, Rt
Trimming is performed to obtain a partial pressure ratio of / [(R1−Rt) + R2]. Then, as shown in FIG. 1C, the insulating substrate 11 is divided into two first insulating substrates 13 along the dividing line L.
And a second insulating substrate 14. This division can be performed using a known cutting technique such as a laser cutter.

【0010】次に第1の絶縁基板13上の端子電極T3
と第2の絶縁基板14の端子電極T4とを接続導体15
により接続する。接続導体15は、端子電極T3及びT
4に半田付けにより接続される。またこの半田付けの前
または後に、端子電極T1,T2及びT5に、リード線
16をそれぞれ半田付けする。なおリード線16の半田
付けは、絶縁基板11を分割する前に行ってもよいのは
勿論である。
Next, the terminal electrode T3 on the first insulating substrate 13
And the terminal electrode T4 of the second insulating substrate 14
Connect with The connection conductor 15 is connected to the terminal electrodes T3 and T
4 is connected by soldering. Before or after this soldering, the lead wires 16 are soldered to the terminal electrodes T1, T2 and T5, respectively. Of course, the soldering of the lead wires 16 may be performed before the insulating substrate 11 is divided.

【0011】半田付けが終了した後、図1(E)に示す
ようにリード線16の端部を残すようにしてエポキシ樹
脂等の絶縁樹脂材料により全体を絶縁被覆して絶縁被覆
層17を形成して、製造を完了する。
After the soldering is completed, as shown in FIG. 1 (E), the entire surface is insulated and coated with an insulating resin material such as epoxy resin so as to leave the end of the lead wire 16 to form an insulating coating layer 17. Then, the production is completed.

【0012】本発明の方法は上記実施例に限定されるも
のではなく、高電圧用可変抵抗器を構成する絶縁基板の
数は任意であり、印加される電圧に応じて適宜に増減す
ればよい。図2は、3枚の絶縁基板18〜20を接続導
体15で接続した構造の高電圧用固定抵抗器を製造する
場合の本発明の方法の実施例の工程図を示している。図
2の実施例において図1の実施例と同様の部分には、図
1に付した符号と同じ符号を付して説明を省略する。本
実施例のように、トリミング抵抗体Rtを中央の絶縁基
板19に形成した固定抵抗体に設けてもよいのは勿論で
ある。
The method of the present invention is not limited to the above embodiment. The number of insulating substrates constituting the high-voltage variable resistor is arbitrary, and may be appropriately increased or decreased according to the applied voltage. . FIG. 2 shows a process diagram of an embodiment of the method of the present invention in the case of manufacturing a high-voltage fixed resistor having a structure in which three insulating substrates 18 to 20 are connected by the connection conductor 15. In the embodiment of FIG. 2, the same parts as those of the embodiment of FIG. 1 are denoted by the same reference numerals as those of FIG. As in this embodiment, the trimming resistor Rt may be provided on the fixed resistor formed on the central insulating substrate 19 as a matter of course.

【0013】上記各実施例は、分圧比を得る高電圧用可
変抵抗器を製造する場合に本発明を適用したものである
が、分圧比を得ない一般的な高電圧用可変抵抗器を製造
する場合に、本発明を適用できるのは勿論である。
In each of the above embodiments, the present invention is applied to the case of manufacturing a high-voltage variable resistor capable of obtaining a division ratio. However, a general high-voltage variable resistor which does not obtain a division ratio is manufactured. In this case, the present invention can be applied.

【0014】[0014]

【発明の効果】本発明によれば、最初に高電圧用固定抵
抗体を構成する全ての固定抵抗体を一枚の絶縁基板上に
形成しておき、その状態でトリミングを行うため、トリ
ミング作業を簡単に且つ高い精度で行える利点がある。
また本発明によれば、複数枚の絶縁基板の各固定抵抗体
を接続導体で接続した後の作業工程を増やす必要がない
ため、作業工程中において接続導体の接続不良が発生す
る可能性が少なくなる。
According to the present invention, all the fixed resistors constituting the fixed resistor for high voltage are first formed on one insulating substrate, and the trimming is performed in that state. Has the advantage that it can be performed easily and with high accuracy.
Further, according to the present invention, it is not necessary to increase the number of work steps after connecting the respective fixed resistors of the plurality of insulating substrates with the connection conductors, so that the possibility of poor connection of the connection conductors during the work steps is reduced. Become.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(A)〜(E)は本発明の方法の一実施例を説
明するための工程図である。
FIGS. 1A to 1E are process diagrams for explaining an embodiment of the method of the present invention.

【図2】(A)〜(E)は本発明の方法の他の実施例を
説明するための工程図である。
2 (A) to 2 (E) are process diagrams for explaining another embodiment of the method of the present invention.

【図3】(A)〜(D)は従来の方法を説明するための
工程図である。
FIGS. 3A to 3D are process diagrams for explaining a conventional method.

【符号の説明】[Explanation of symbols]

1,11 絶縁基板 2,12 印刷抵抗体基板 3,16 リード線 4,17 絶縁被覆層 13 第1の絶縁基板 14 第2の絶縁基板 15 接続導体 Rt トリミング抵抗 R1 第1の抵抗体 R2 第2の抵抗体 T1〜T5 端子電極 DESCRIPTION OF SYMBOLS 1,11 Insulating substrate 2,12 Printed resistor substrate 3,16 Lead wire 4,17 Insulating coating layer 13 First insulating substrate 14 Second insulating substrate 15 Connection conductor Rt Trimming resistor R1 First resistor R2 Second Resistor T1 to T5 terminal electrode

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H01C 13/00,17/06,17/22 H01C 17/24 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01C 13/00, 17/06, 17/22 H01C 17/24

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 絶縁基板の表面にトリミング抵抗体を含
む固定抵抗体が印刷形成されてなる高圧用固定抵抗器の
製造方法であって、 一枚の絶縁基板上に少なくとも前記トリミング抵抗体を
含む第1の固定抵抗体と第2の固定抵抗体ないし第nの
固定抵抗体が電気的に接続された状態で印刷形成された
印刷抵抗基板を用意し、 前記第1の固定抵抗体の前記トリミング抵抗体にトリミ
ングを施した後に前記印刷抵抗基板を前記第1〜第nの
固定抵抗体をそれぞれ有する第1〜第nの絶縁基板に分
割し、 その後前記第1の絶縁基板〜前記第nの絶縁基板の上に
形成した前記第1〜第nの固定抵抗体をそれぞれ接続導
体を介して電気的に直列接続することを特徴とする高電
圧用固定抵抗器の製造方法。
1. A method for manufacturing a high-voltage fixed resistor comprising a fixed resistor including a trimming resistor printed on a surface of an insulating substrate, comprising at least the trimming resistor on a single insulating substrate. Preparing a printed resistor substrate formed by printing in a state where the first fixed resistor and the second to n-th fixed resistors are electrically connected; and trimming the first fixed resistor. After trimming the resistor, the printed resistor substrate is divided into first to n-th insulating substrates each having the first to n-th fixed resistors, and thereafter, the first insulating substrate to the n-th A method for manufacturing a high-voltage fixed resistor, wherein the first to n-th fixed resistors formed on an insulating substrate are electrically connected in series via connection conductors.
JP4301093A 1992-11-11 1992-11-11 Manufacturing method of fixed resistor for high voltage Expired - Fee Related JP2966215B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4301093A JP2966215B2 (en) 1992-11-11 1992-11-11 Manufacturing method of fixed resistor for high voltage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4301093A JP2966215B2 (en) 1992-11-11 1992-11-11 Manufacturing method of fixed resistor for high voltage

Publications (2)

Publication Number Publication Date
JPH06151123A JPH06151123A (en) 1994-05-31
JP2966215B2 true JP2966215B2 (en) 1999-10-25

Family

ID=17892776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4301093A Expired - Fee Related JP2966215B2 (en) 1992-11-11 1992-11-11 Manufacturing method of fixed resistor for high voltage

Country Status (1)

Country Link
JP (1) JP2966215B2 (en)

Also Published As

Publication number Publication date
JPH06151123A (en) 1994-05-31

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