SE443485B - WANT TO MAKE ELECTRONIC COMPONENTS - Google Patents

WANT TO MAKE ELECTRONIC COMPONENTS

Info

Publication number
SE443485B
SE443485B SE8205343A SE8205343A SE443485B SE 443485 B SE443485 B SE 443485B SE 8205343 A SE8205343 A SE 8205343A SE 8205343 A SE8205343 A SE 8205343A SE 443485 B SE443485 B SE 443485B
Authority
SE
Sweden
Prior art keywords
components
substrate
fracture
instructions
electrical
Prior art date
Application number
SE8205343A
Other languages
Swedish (sv)
Other versions
SE8205343L (en
SE8205343D0 (en
Inventor
L-A Olofsson
G Bjorklund
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE8205343A priority Critical patent/SE443485B/en
Publication of SE8205343D0 publication Critical patent/SE8205343D0/en
Priority to JP50301683A priority patent/JPS59501566A/en
Priority to PCT/SE1983/000326 priority patent/WO1984001259A1/en
Priority to DE8383902966T priority patent/DE3368848D1/en
Priority to EP83902966A priority patent/EP0119241B1/en
Publication of SE8205343L publication Critical patent/SE8205343L/en
Publication of SE443485B publication Critical patent/SE443485B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/255—Means for correcting the capacitance value
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H2069/025—Manufacture of fuses using lasers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Fuses (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

8205343-0 10 15 ZÛ 25 3D 35 visningar 6 som skär genom hälen 3. Brottanvisningarna 6 är vinkelräta mot anvisningarna 2 och bestämmer komponentens längd. Insidan av varje hal jämte ett mindre område runt halen pa var sida av underlaget belägges med metallpasta 4, för att bilda elektriska anslutningar för komponenten. Ett skikt av elektriskt motstandsmaterial 5 palägges i form av rutor i de fält som avgränsas av brottanvisningarna sa att samtliga rutor blir skilda fran varandra men far kontakt med vardera tva elektriska anslutningar, varvid rutorna blir radvis seriekopplade. Underlaget med sina motstand upphettas för att sintra metallpastan 4. Efter sintringen uppmätes motstandens individuella resistanser och värdena justeras genom exempelvis behandling medelst laserstràle eller bläster. Motstanden belägges eventuellt med ett skyddsskikt, varefter under- laget brytes i remsor efter brottanvisningarna2 och de erhållna remsorna brytes i enskilda komponenter efter brottanvisnignarna 6 vid hålen. Brottlinjen passerar härvid halens centra. Härvid delas halens ledande beläggning i tva mantelhalvor vilka utgör elektriska anslutningar för de enskilda komponenterna. 8205343-0 10 15 ZÛ 25 3D 35 views 6 which cut through the heel 3. The fracture instructions 6 are perpendicular to the instructions 2 and determine the length of the component. The inside of each halo and a small area around the halo on each side of the substrate are coated with metal paste 4, to form electrical connections for the component. A layer of electrical resistance material 5 is applied in the form of squares in the fields delimited by the fracture instructions, so that all the squares are separated from each other but come into contact with each two electrical connections, the squares being connected in series. The substrate with its resistors is heated to sinter the metal paste 4. After sintering, the individual resistances of the resistor are measured and the values are adjusted by, for example, treatment by means of a laser beam or blaster. The resistor is optionally coated with a protective layer, after which the substrate is broken into strips according to the fracture instructions2 and the obtained strips are broken into individual components according to the fracture instructions 6 at the holes. The fault line then passes the centers of the tail. In this case, the conductive coating of the tail is divided into two jacket halves which constitute electrical connections for the individual components.

Figur 2 visar ett underlag ll som pa samma sätt som i anordningen enligt figur 1 förses med brottanvisningar 12 och 16 samt hal 13. Halen förses med en ledande beläggning 14 som sintras för att åstadkomma elektriska anslutningar.Figure 2 shows a substrate 11 which, in the same way as in the device according to Figure 1, is provided with rupture instructions 12 and 16 and hall 13. The hall is provided with a conductive coating 14 which is sintered to make electrical connections.

Skikt av elektriskt ledande material palägges i form av tva fran varandra skilda rutor 17 och 18 inom ett fält som avgränsas av brottanvisningarna, sa att dessa rutor star i elektrisk kontakt med vardera en anslutning. Till skillnad fran förfarandet enligt figur 1 fästes därefter metalltradar 15, utgörande säkrings- element, mellan rutorna 17 och 18, exempelvis genom termokompressions- förbindníng eller ultraljudsvetsning. Ett skyddsskikt av exempelvis plast kan anbringas över metalltradarna. Vid ett alternativt förfarande för att framställa smältsäkringar anbringas skikt mellan tva anslutningar pa det sätt som framgår av beskrivningen till figur 1. Dessa skikt är vid denna tillämpning elektriskt ledande och dess tjocklek, bredd och längd avpassas för en viss strömstyrka, vid vilken skiktet smälter. Skikten kan värmeisoleras fran underlaget medelst ett glasskikt, varigenom dess strömtalighet minskas. Slutsteget vid tillverkning av smältsäkringar sker pa samma sätt som vid förfarandet enligt figur 1, nämligen att de enskilda komponenterna erhålles genom att det gemensamma underlaget brytas längs brottanvisningarna. Figur 3 visar en elektrisk anslutning i tvär- sektion. Metallpastan paföres genom tryckning efter behov fran en eller bada sidor, varvid det trögflytande materialet bildar beläggning pa halets innervägg.Layers of electrically conductive material are applied in the form of two spaced apart boxes 17 and 18 within a field delimited by the breaking instructions, so that these boxes are in electrical contact with each one connection. In contrast to the method according to Figure 1, metal wires 15, constituting securing elements, are then fastened between the windows 17 and 18, for example by thermocompression connection or ultrasonic welding. A protective layer of, for example, plastic can be applied over the metal wires. In an alternative method of manufacturing fuses, layers are applied between two connections in the manner shown in the description of Figure 1. These layers are electrically conductive in this application and their thickness, width and length are adapted for a certain current at which the layer melts. The layers can be heat-insulated from the substrate by means of a glass layer, whereby its current resistance is reduced. The final step in the manufacture of fuses is carried out in the same way as in the method according to Figure 1, namely that the individual components are obtained by breaking the common substrate along the fracture instructions. Figure 3 shows an electrical connection in cross section. The metal paste is applied by pressing as required from one or both sides, the viscous material forming a coating on the inner wall of the tail.

Såsom det framgar star det ledande materialet, som utgör halets beläggning, i :eooiz QUALITY 8205545-0 elektrisk kontakt med skiktet 5. Förfarandet enligt ovanstående innebär det framsteget framför hittills känd teknik att de individuella komponenterna vid tillverkningen kan behandlas i en operation medan dessa alltjämt sitter ihop i en enhet, där varje enhet omfattar exempelvis storleksordningen 100 komponenter.As can be seen, the conductive material, which constitutes the coating of the tail, is in electrical contact with the layer 5. Eooiz QUALITY 8205545-0. are assembled in one unit, where each unit comprises, for example, on the order of 100 components.

Sådana operationer möjliggöres av att varje komponent har en väldefinierad, fixerad position i det gemensamma underlaget. En fördel erhålles om man enligt uppfinningen gör de elektriska anslutningarna åtkomliga från båda sidor av underlaget. Detta gör de färdiga komponenterna lätta att montera pâ ett kretskort medelst s k ytlödning.Such operations are made possible by the fact that each component has a well-defined, fixed position in the common substrate. An advantage is obtained if, according to the invention, the electrical connections are made accessible from both sides of the substrate. This makes the finished components easy to mount on a circuit board by means of so-called surface soldering.

POOR QUALITYPOOR QUALITY

Claims (2)

1. 8205343-0 H PATENTKRAV l Sätt att framställa elektroniska komponenter (motstånd, kapacitanser, säkringar o dyl) vilka omfattar med skikt eller tradar försedda isolerande underlag och elektriska anslutningar för komponenterna och komponenterna och deras anslutningar anbringas pà ett gemensamt underlag inom varsitt fält vilka är avgränsade genom brottanvisningar k ä n n e t e c k n a t därav att de elekt- riska anslutningarna framställes genom att hal upptages i det isolerande underlaget längs brottanvisningar och halens mantelyta jämte ett omrâde kring hålen pa var sida av underlaget förses med en ledande beläggning pa sadant sätt att komponenterna kommer i elektrisk kontakt med beläggningen i halet, varefter underlaget uppdelas utefter brottanvisningarna sa att mantelytans respektive halvor utgör anslutningsyta för intilliggande komponent.1. 8205343-0 H PATENT REQUIREMENTS Methods of producing electronic components (resistors, capacitors, fuses, etc.) which comprise layers or wires provided with insulating substrates and electrical connections for the components and components and their connections are applied to a common substrate in each field which are delimited by fracture indications characterized in that the electrical connections are made by absorbing sludge into the insulating substrate along fracture indications and the mantle surface of the tail and an area around the holes on each side of the substrate is provided with a conductive coating in such a way that the components come into electrical contact with the coating in the tail, after which the substrate is divided according to the fracture instructions so that the respective halves of the mantle surface constitute the connecting surface for the adjacent component. 2. Sätt enligt patentkrav 1, k ä n n e t e c k n a t därav att vid tillverkning av komponenter vilkas elektriska värde vid tillverkningen maste justeras genom behandling med laserstrale, bläster eller dylikt, en mätanordning anslutes till de genom brottanvisningarna avgränsade komponenterna för att mäta deras elek- triska värde och justeringen utföres innan uppdelningen sker utefter brott- anvisningarna.2. A method according to claim 1, characterized in that in the manufacture of components whose electrical value in the manufacture must be adjusted by treatment with laser beam, blaster or the like, a measuring device is connected to the components delimited by the fracture instructions to measure their electrical value and the adjustment is performed before the division takes place according to the breaking instructions.
SE8205343A 1982-09-17 1982-09-17 WANT TO MAKE ELECTRONIC COMPONENTS SE443485B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE8205343A SE443485B (en) 1982-09-17 1982-09-17 WANT TO MAKE ELECTRONIC COMPONENTS
JP50301683A JPS59501566A (en) 1982-09-17 1983-09-14 Electronic element manufacturing method
PCT/SE1983/000326 WO1984001259A1 (en) 1982-09-17 1983-09-14 A method of producing electronic components
DE8383902966T DE3368848D1 (en) 1982-09-17 1983-09-14 A method of producing electronic components
EP83902966A EP0119241B1 (en) 1982-09-17 1983-09-14 A method of producing electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8205343A SE443485B (en) 1982-09-17 1982-09-17 WANT TO MAKE ELECTRONIC COMPONENTS

Publications (3)

Publication Number Publication Date
SE8205343D0 SE8205343D0 (en) 1982-09-17
SE8205343L SE8205343L (en) 1984-03-18
SE443485B true SE443485B (en) 1986-02-24

Family

ID=20347902

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8205343A SE443485B (en) 1982-09-17 1982-09-17 WANT TO MAKE ELECTRONIC COMPONENTS

Country Status (5)

Country Link
EP (1) EP0119241B1 (en)
JP (1) JPS59501566A (en)
DE (1) DE3368848D1 (en)
SE (1) SE443485B (en)
WO (1) WO1984001259A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8403968D0 (en) * 1984-02-15 1984-03-21 Heraeus Gmbh W C Chip resistors
US4771260A (en) * 1987-03-24 1988-09-13 Cooper Industries, Inc. Wire bonded microfuse and method of making
GB2248345B (en) * 1990-09-27 1994-06-22 Stc Plc Edge soldering of electronic components
EP0509582B1 (en) * 1991-04-16 1996-09-04 Koninklijke Philips Electronics N.V. SMD-resistor
US5852397A (en) * 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
CN1113369C (en) * 1994-06-09 2003-07-02 雷伊化学公司 Electrical devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1236580A (en) * 1967-12-20 1971-06-23 Sangamo Weston Improvements in or relating to electrical resistors
AU5999669A (en) * 1969-08-25 1971-03-04 Technograph Limited Improved plated through hole printed circuit boards
FI52780C (en) * 1974-06-18 1977-11-10 Paramic Ab Oy Resistance network with adjustable resistance value.
US4032881A (en) * 1976-02-06 1977-06-28 Bourns, Inc. Resistance element with improved linearity and method of making the same
US4228418A (en) * 1979-03-28 1980-10-14 The United States Of America As Represented By The Secretary Of The Army Modular trim resistive network
DE3008143C2 (en) * 1980-03-04 1982-04-08 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Process for the production of printed circuit boards with perforations, the walls of which are metallized

Also Published As

Publication number Publication date
JPS59501566A (en) 1984-08-30
EP0119241A1 (en) 1984-09-26
SE8205343L (en) 1984-03-18
WO1984001259A1 (en) 1984-03-29
DE3368848D1 (en) 1987-02-05
EP0119241B1 (en) 1986-12-30
SE8205343D0 (en) 1982-09-17

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