SE8008879L - Halvledaranordning - Google Patents
HalvledaranordningInfo
- Publication number
- SE8008879L SE8008879L SE8008879A SE8008879A SE8008879L SE 8008879 L SE8008879 L SE 8008879L SE 8008879 A SE8008879 A SE 8008879A SE 8008879 A SE8008879 A SE 8008879A SE 8008879 L SE8008879 L SE 8008879L
- Authority
- SE
- Sweden
- Prior art keywords
- pct
- base region
- semiconductor
- disc
- zone
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0814—Diodes only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10157—Shape being other than a cuboid at the active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2855972A DE2855972C2 (de) | 1978-12-23 | 1978-12-23 | Halbleiteranordnung mit zwei integrierten und antiparallel geschalteten Dioden sowie Verfahren zu ihrer Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
SE8008879L true SE8008879L (sv) | 1980-12-17 |
SE443476B SE443476B (sv) | 1986-02-24 |
Family
ID=6058262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8008879A SE443476B (sv) | 1978-12-23 | 1980-12-17 | Halvledaranordning med tva antiparallella dioder utforda i en halvledarkropp och forfarande for framstellning av denna |
Country Status (8)
Country | Link |
---|---|
US (1) | US4525924A (sv) |
EP (1) | EP0020666A1 (sv) |
JP (1) | JPS55501161A (sv) |
DE (1) | DE2855972C2 (sv) |
GB (1) | GB2064869B (sv) |
IT (1) | IT1126607B (sv) |
SE (1) | SE443476B (sv) |
WO (1) | WO1980001334A1 (sv) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3435306A1 (de) * | 1984-09-26 | 1986-04-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von laserdioden mit jutierter integrierter waermesenke |
KR940016546A (ko) * | 1992-12-23 | 1994-07-23 | 프레데릭 얀 스미트 | 반도체 장치 및 제조방법 |
GB2285882B (en) * | 1994-01-14 | 1997-12-17 | Westinghouse Brake & Signal | Semiconductor switching devices |
US6033489A (en) * | 1998-05-29 | 2000-03-07 | Fairchild Semiconductor Corp. | Semiconductor substrate and method of making same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2748041A (en) * | 1952-08-30 | 1956-05-29 | Rca Corp | Semiconductor devices and their manufacture |
US3039028A (en) * | 1955-09-26 | 1962-06-12 | Hoffman Electronics Corp | Double based diode |
US2985805A (en) * | 1958-03-05 | 1961-05-23 | Rca Corp | Semiconductor devices |
US3005937A (en) * | 1958-08-21 | 1961-10-24 | Rca Corp | Semiconductor signal translating devices |
NL125803C (sv) * | 1961-01-16 | |||
US3519900A (en) * | 1967-11-13 | 1970-07-07 | Motorola Inc | Temperature compensated reference diodes and methods for making same |
DE1916555A1 (de) * | 1969-04-01 | 1971-03-04 | Semikron Gleichrichterbau | Halbleiter-Gleichrichter-Anordnung und Verfahren zu ihrer Herstellung |
US3978514A (en) * | 1969-07-18 | 1976-08-31 | Hitachi, Ltd. | Diode-integrated high speed thyristor |
US3706129A (en) * | 1970-07-27 | 1972-12-19 | Gen Electric | Integrated semiconductor rectifiers and processes for their fabrication |
FR2126904B1 (sv) * | 1970-12-07 | 1974-04-26 | Silec Semi Conducteurs | |
JPS567304B2 (sv) * | 1972-08-28 | 1981-02-17 | ||
US3972113A (en) * | 1973-05-14 | 1976-08-03 | Mitsubishi Denki Kabushiki Kaisha | Process of producing semiconductor devices |
DE2610942C2 (de) * | 1976-03-16 | 1983-04-28 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen eines Halbleiterbauelements mit in einem Halbleiterkörper monolithisch integrierten Halbleiterelementeinheiten |
US4219835A (en) * | 1978-02-17 | 1980-08-26 | Siliconix, Inc. | VMOS Mesa structure and manufacturing process |
-
1978
- 1978-12-23 DE DE2855972A patent/DE2855972C2/de not_active Expired
-
1979
- 1979-12-11 WO PCT/DE1979/000145 patent/WO1980001334A1/de not_active Application Discontinuation
- 1979-12-11 US US06/503,078 patent/US4525924A/en not_active Expired - Fee Related
- 1979-12-11 GB GB8101369A patent/GB2064869B/en not_active Expired
- 1979-12-11 JP JP50005679A patent/JPS55501161A/ja active Pending
- 1979-12-19 IT IT28210/79A patent/IT1126607B/it active
-
1980
- 1980-07-01 EP EP80900001A patent/EP0020666A1/de not_active Withdrawn
- 1980-12-17 SE SE8008879A patent/SE443476B/sv not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE2855972A1 (de) | 1980-06-26 |
JPS55501161A (sv) | 1980-12-18 |
US4525924A (en) | 1985-07-02 |
EP0020666A1 (de) | 1981-01-07 |
WO1980001334A1 (en) | 1980-06-26 |
GB2064869B (en) | 1983-05-18 |
IT1126607B (it) | 1986-05-21 |
GB2064869A (en) | 1981-06-17 |
IT7928210A0 (it) | 1979-12-19 |
SE443476B (sv) | 1986-02-24 |
DE2855972C2 (de) | 1984-09-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |
Ref document number: 8008879-2 Effective date: 19890301 Format of ref document f/p: F |