SE8003204L - PROCEDURE FOR CURRENTLY COPPER PROVISION - Google Patents

PROCEDURE FOR CURRENTLY COPPER PROVISION

Info

Publication number
SE8003204L
SE8003204L SE8003204A SE8003204A SE8003204L SE 8003204 L SE8003204 L SE 8003204L SE 8003204 A SE8003204 A SE 8003204A SE 8003204 A SE8003204 A SE 8003204A SE 8003204 L SE8003204 L SE 8003204L
Authority
SE
Sweden
Prior art keywords
electroless
copper deposition
electroless copper
provision
procedure
Prior art date
Application number
SE8003204A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE453925B (en
Inventor
R J Zeblisky
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE8003204L publication Critical patent/SE8003204L/en
Publication of SE453925B publication Critical patent/SE453925B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1621—Protection of inner surfaces of the apparatus
    • C23C18/1623—Protection of inner surfaces of the apparatus through electrochemical processes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
    • C23F13/005—Anodic protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Prevention Of Electric Corrosion (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The metallic surfaces of plating equipment in use during electroless copper deposition, such as vessels 2, racks 26 supporting substrates 24 to be plated, plumbing are rendered substantially resistant to electroless copper deposition for extended periods by initially imposing on such equipment surfaces an electrical potential via power supply 10 more positive than the mixed potential of the electroless copper deposition solution and sufficiently positive to resist electroless deposition. The workpiece substrate 24 is insulated from rack 26 by non-conductor 27. The electrical potential supplied by electrode 6 and the vessel walls 12a, 12b, is monitored during the electroless plating using reference electrode 22. <IMAGE>
SE8003204A 1979-04-30 1980-04-28 PROCEDURE TO AVOID UNUSED COPPER PROPOSALS BY POWERLESS COPPER PLATING SE453925B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3481279A 1979-04-30 1979-04-30
US13045180A 1980-03-28 1980-03-28

Publications (2)

Publication Number Publication Date
SE8003204L true SE8003204L (en) 1980-10-31
SE453925B SE453925B (en) 1988-03-14

Family

ID=26711403

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8003204A SE453925B (en) 1979-04-30 1980-04-28 PROCEDURE TO AVOID UNUSED COPPER PROPOSALS BY POWERLESS COPPER PLATING

Country Status (11)

Country Link
AT (1) AT369037B (en)
AU (1) AU5767780A (en)
CA (1) CA1183101A (en)
CH (1) CH646732A5 (en)
DE (1) DE3016994C2 (en)
DK (1) DK151233C (en)
FR (1) FR2455641B1 (en)
GB (1) GB2052560B (en)
IT (1) IT1128151B (en)
NL (1) NL189769B (en)
SE (1) SE453925B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1277642B (en) * 1964-01-14 1968-09-12 Bayer Ag Process for the protection of metallic surfaces against metal deposition in chemical metallization baths
DE1521246B2 (en) * 1965-12-30 1976-06-16 Bayer Ag, 5090 Leverkusen PROCESS AND CIRCUIT FOR THE PROTECTION OF METALLIC SURFACES AGAINST CHEMICAL METALLIZATION
GB1224047A (en) * 1968-12-10 1971-03-03 Tsniitmash Method of inhibiting the formation of a coating on chemical equipment
CH613475A5 (en) * 1976-07-28 1979-09-28 Bbc Brown Boveri & Cie Appliance for the electroless metal coating of objects
US4125642A (en) * 1977-08-25 1978-11-14 The United States Of America As Represented By The United States Department Of Energy Method for conducting electroless metal-plating processes

Also Published As

Publication number Publication date
SE453925B (en) 1988-03-14
FR2455641A1 (en) 1980-11-28
GB2052560A (en) 1981-01-28
IT8048537A0 (en) 1980-04-29
IT1128151B (en) 1986-05-28
CH646732A5 (en) 1984-12-14
NL189769B (en) 1993-02-16
AT369037B (en) 1982-11-25
CA1183101A (en) 1985-02-26
DE3016994A1 (en) 1980-11-06
NL8002515A (en) 1980-11-03
DK151233C (en) 1988-12-12
GB2052560B (en) 1982-11-10
DE3016994C2 (en) 1983-09-08
DK151233B (en) 1987-11-16
AU5767780A (en) 1980-11-06
DK185080A (en) 1980-10-31
FR2455641B1 (en) 1985-07-26
ATA230980A (en) 1982-04-15

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