AT369037B - METHOD FOR PREVENTING UNWANTED COPPER DEPOSITS FROM LOW-WORKING COPPER BLADES - Google Patents

METHOD FOR PREVENTING UNWANTED COPPER DEPOSITS FROM LOW-WORKING COPPER BLADES

Info

Publication number
AT369037B
AT369037B AT0230980A AT230980A AT369037B AT 369037 B AT369037 B AT 369037B AT 0230980 A AT0230980 A AT 0230980A AT 230980 A AT230980 A AT 230980A AT 369037 B AT369037 B AT 369037B
Authority
AT
Austria
Prior art keywords
copper
low
blades
working
preventing unwanted
Prior art date
Application number
AT0230980A
Other languages
German (de)
Other versions
ATA230980A (en
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ATA230980A publication Critical patent/ATA230980A/en
Application granted granted Critical
Publication of AT369037B publication Critical patent/AT369037B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1621—Protection of inner surfaces of the apparatus
    • C23C18/1623—Protection of inner surfaces of the apparatus through electrochemical processes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
    • C23F13/005—Anodic protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Prevention Of Electric Corrosion (AREA)
AT0230980A 1979-04-30 1980-04-30 METHOD FOR PREVENTING UNWANTED COPPER DEPOSITS FROM LOW-WORKING COPPER BLADES AT369037B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3481279A 1979-04-30 1979-04-30
US13045180A 1980-03-28 1980-03-28

Publications (2)

Publication Number Publication Date
ATA230980A ATA230980A (en) 1982-04-15
AT369037B true AT369037B (en) 1982-11-25

Family

ID=26711403

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0230980A AT369037B (en) 1979-04-30 1980-04-30 METHOD FOR PREVENTING UNWANTED COPPER DEPOSITS FROM LOW-WORKING COPPER BLADES

Country Status (11)

Country Link
AT (1) AT369037B (en)
AU (1) AU5767780A (en)
CA (1) CA1183101A (en)
CH (1) CH646732A5 (en)
DE (1) DE3016994C2 (en)
DK (1) DK151233C (en)
FR (1) FR2455641B1 (en)
GB (1) GB2052560B (en)
IT (1) IT1128151B (en)
NL (1) NL189769B (en)
SE (1) SE453925B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1277642B (en) * 1964-01-14 1968-09-12 Bayer Ag Process for the protection of metallic surfaces against metal deposition in chemical metallization baths
DE1521246B2 (en) * 1965-12-30 1976-06-16 Bayer Ag, 5090 Leverkusen PROCESS AND CIRCUIT FOR THE PROTECTION OF METALLIC SURFACES AGAINST CHEMICAL METALLIZATION
GB1224047A (en) * 1968-12-10 1971-03-03 Tsniitmash Method of inhibiting the formation of a coating on chemical equipment
CH613475A5 (en) * 1976-07-28 1979-09-28 Bbc Brown Boveri & Cie Appliance for the electroless metal coating of objects
US4125642A (en) * 1977-08-25 1978-11-14 The United States Of America As Represented By The United States Department Of Energy Method for conducting electroless metal-plating processes

Also Published As

Publication number Publication date
DK151233C (en) 1988-12-12
IT8048537A0 (en) 1980-04-29
GB2052560A (en) 1981-01-28
NL8002515A (en) 1980-11-03
NL189769B (en) 1993-02-16
CH646732A5 (en) 1984-12-14
FR2455641A1 (en) 1980-11-28
FR2455641B1 (en) 1985-07-26
AU5767780A (en) 1980-11-06
IT1128151B (en) 1986-05-28
DK151233B (en) 1987-11-16
SE453925B (en) 1988-03-14
GB2052560B (en) 1982-11-10
SE8003204L (en) 1980-10-31
ATA230980A (en) 1982-04-15
DE3016994C2 (en) 1983-09-08
DK185080A (en) 1980-10-31
CA1183101A (en) 1985-02-26
DE3016994A1 (en) 1980-11-06

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Legal Events

Date Code Title Description
EIH Change in the person of patent owner
EIH Change in the person of patent owner
ELJ Ceased due to non-payment of the annual fee