SE7810945L - Tillsatskomposition for elektropleteringsbad - Google Patents

Tillsatskomposition for elektropleteringsbad

Info

Publication number
SE7810945L
SE7810945L SE7810945A SE7810945A SE7810945L SE 7810945 L SE7810945 L SE 7810945L SE 7810945 A SE7810945 A SE 7810945A SE 7810945 A SE7810945 A SE 7810945A SE 7810945 L SE7810945 L SE 7810945L
Authority
SE
Sweden
Prior art keywords
electropletation
bath
additional composition
additional
composition
Prior art date
Application number
SE7810945A
Other languages
English (en)
Other versions
SE444823B (sv
Inventor
W E Eckles
W J Willis
Original Assignee
Hull & Company Inc R O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hull & Company Inc R O filed Critical Hull & Company Inc R O
Publication of SE7810945L publication Critical patent/SE7810945L/sv
Publication of SE444823B publication Critical patent/SE444823B/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/34—Electroplating: Baths therefor from solutions of lead
    • C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE7810945A 1978-04-05 1978-10-20 Blekmedel for vattenhaltiga, sura tenn- och/eller blypleteringsbad samt anvendning av detsamma vid galvanisk utfellning av tenn, bly eller tenn-blylegeringar SE444823B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/893,618 US4139425A (en) 1978-04-05 1978-04-05 Composition, plating bath, and method for electroplating tin and/or lead

Publications (2)

Publication Number Publication Date
SE7810945L true SE7810945L (sv) 1979-10-06
SE444823B SE444823B (sv) 1986-05-12

Family

ID=25401818

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7810945A SE444823B (sv) 1978-04-05 1978-10-20 Blekmedel for vattenhaltiga, sura tenn- och/eller blypleteringsbad samt anvendning av detsamma vid galvanisk utfellning av tenn, bly eller tenn-blylegeringar

Country Status (7)

Country Link
US (1) US4139425A (sv)
JP (1) JPS54134041A (sv)
AU (1) AU526543B2 (sv)
DE (1) DE2845137A1 (sv)
FR (1) FR2421929A1 (sv)
GB (1) GB1600186A (sv)
SE (1) SE444823B (sv)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL120216B1 (en) * 1979-01-11 1982-02-27 Politechnika Warszawska Process for electrochemical manufacture of bright tin coatingsovjannykh pokrytijj
US4381228A (en) * 1981-06-16 1983-04-26 Occidental Chemical Corporation Process and composition for the electrodeposition of tin and tin alloys
BG34691A1 (en) * 1981-07-14 1983-11-15 Todorov Electrolyte for depositing bright tin coatings
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4586990A (en) * 1982-03-15 1986-05-06 Gsp Metals & Chemicals Corporation Chelating metals
US4417957A (en) * 1982-09-03 1983-11-29 Columbia Chemical Corporation Aqueous acid plating bath and brightener mixture for producing semibright to bright electrodeposits of tin
JPS59182986A (ja) * 1983-04-01 1984-10-17 Keigo Obata スズ、鉛及びすず−鉛合金メツキ浴
US4502926A (en) * 1983-08-22 1985-03-05 Macdermid, Incorporated Method for electroplating metals using microemulsion additive compositions
JPS61117297A (ja) * 1984-11-13 1986-06-04 Ebara Yuujiraito Kk スズ属金属めつき液
US4818248A (en) * 1986-10-10 1989-04-04 Ciba-Geigy Corporation Process for dyeing natural or synthetic polyamide fibre materials with 1:1 metal complex dyes in presence of alkali metal fluordsilicate or amindnlum silicate
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
DE3854551T2 (de) * 1987-12-10 1996-04-18 Lea Ronal Inc Zinn-, Blei- und Zinn-Blei-Legierungs-Elektrolyten für Elekroplattieren bei hoher Geschwindigkeit.
US4981564A (en) * 1988-07-06 1991-01-01 Technic Inc. Additives for electroplating compositions and methods for their use
US4923576A (en) * 1988-07-06 1990-05-08 Technic, Inc. Additives for electroplating compositions and methods for their use
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
DE3934866A1 (de) * 1989-10-19 1991-04-25 Blasberg Oberflaechentech Verfahren zur abscheidung von blei- und bleihaltigen schichten, elektrolyte zur durchfuehrung des verfahrens sowie verwendung von tensiden in sauren blei-elektrolyten
US5061351A (en) * 1990-07-23 1991-10-29 Enthone-Omi, Inc. Bright tin electrodeposition composition
US5282954A (en) * 1991-12-30 1994-02-01 Atotech Usa, Inc. Alkoxylated diamine surfactants in high-speed tin plating
US6022467A (en) * 1997-10-14 2000-02-08 Usx Corporation Electrolytic tin plating process with reduced sludge production
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production
US6063172A (en) * 1998-10-13 2000-05-16 Mcgean-Rohco, Inc. Aqueous immersion plating bath and method for plating
CN1558967A (zh) * 2001-09-19 2004-12-29 霍尼韦尔国际公司 电极与阳极组件的装接
US20040231978A1 (en) * 2001-09-19 2004-11-25 White Tamara L Electrode attachment to anode assembly
US20060096867A1 (en) * 2004-11-10 2006-05-11 George Bokisa Tin alloy electroplating system
FR2906542B1 (fr) * 2006-10-03 2008-12-05 Electro Rech Sarl Bain d'electrodeposition de zinc ou d'alliages zinc nickel sur un substrat conducteur.
US7905994B2 (en) * 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US20090188553A1 (en) * 2008-01-25 2009-07-30 Emat Technology, Llc Methods of fabricating solar-cell structures and resulting solar-cell structures
US20120027948A1 (en) * 2009-04-07 2012-02-02 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
JP5033979B1 (ja) * 2011-09-29 2012-09-26 ユケン工業株式会社 スズからなるめっき用酸性水系組成物
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
TWI762731B (zh) * 2017-11-08 2022-05-01 美商羅門哈斯電子材料有限公司 銅電鍍組合物及在基板上電鍍銅之方法
CN113430594B (zh) * 2021-05-31 2022-04-01 季华实验室 一种含氮小分子的应用及电镀液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR880185A (fr) * 1941-03-25 1943-03-16 Roehm & Haas Gmbh Procédé pour préparer des produits de réaction à poids moléculaire élevé à partir de dioxo-imidazolidines et d'aldéhydes
NL124247C (sv) * 1963-08-28
JPS5529159B2 (sv) * 1972-02-22 1980-08-01
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating

Also Published As

Publication number Publication date
FR2421929B1 (sv) 1982-05-21
JPS54134041A (en) 1979-10-18
SE444823B (sv) 1986-05-12
AU4066178A (en) 1980-05-01
US4139425A (en) 1979-02-13
AU526543B2 (en) 1983-01-20
GB1600186A (en) 1981-10-14
FR2421929A1 (fr) 1979-11-02
DE2845137A1 (de) 1979-10-18

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