SE7514242L - Forfarande vid framstellning av ett flerlagerkort - Google Patents

Forfarande vid framstellning av ett flerlagerkort

Info

Publication number
SE7514242L
SE7514242L SE7514242A SE7514242A SE7514242L SE 7514242 L SE7514242 L SE 7514242L SE 7514242 A SE7514242 A SE 7514242A SE 7514242 A SE7514242 A SE 7514242A SE 7514242 L SE7514242 L SE 7514242L
Authority
SE
Sweden
Prior art keywords
procedure
making
store card
multiple store
card
Prior art date
Application number
SE7514242A
Other languages
English (en)
Other versions
SE404863B (sv
Inventor
J P Nilsson
J K Konicek
H R Malm
Original Assignee
Perstorp Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perstorp Ab filed Critical Perstorp Ab
Priority to SE7514242A priority Critical patent/SE404863B/sv
Priority to US05/712,863 priority patent/US4075757A/en
Publication of SE7514242L publication Critical patent/SE7514242L/sv
Publication of SE404863B publication Critical patent/SE404863B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SE7514242A 1975-12-17 1975-12-17 Forfarande vid framstellning av ett flerlagerkort SE404863B (sv)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE7514242A SE404863B (sv) 1975-12-17 1975-12-17 Forfarande vid framstellning av ett flerlagerkort
US05/712,863 US4075757A (en) 1975-12-17 1976-08-09 Process in the production of a multilayer printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7514242A SE404863B (sv) 1975-12-17 1975-12-17 Forfarande vid framstellning av ett flerlagerkort

Publications (2)

Publication Number Publication Date
SE7514242L true SE7514242L (sv) 1977-06-18
SE404863B SE404863B (sv) 1978-10-30

Family

ID=20326361

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7514242A SE404863B (sv) 1975-12-17 1975-12-17 Forfarande vid framstellning av ett flerlagerkort

Country Status (2)

Country Link
US (1) US4075757A (sv)
SE (1) SE404863B (sv)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2713393C3 (de) * 1977-03-23 1980-02-28 Ruwel-Werke Spezialfabrik Fuer Hochfrequenzbauteile Gmbh, 4170 Geldern Verfahren zum Herstellen von gedruckten Schaltungen
US4288530A (en) * 1979-10-15 1981-09-08 Motorola, Inc. Method of tuning apparatus by low power laser beam removal
EP0083488A3 (en) * 1981-12-31 1985-11-06 O'Hara, James Brian Method of producing printed circuits
US4431685A (en) * 1982-07-02 1984-02-14 International Business Machines Corporation Decreasing plated metal defects
US4703392A (en) * 1982-07-06 1987-10-27 General Electric Company Microstrip line and method for fabrication
US4608274A (en) * 1982-08-06 1986-08-26 Faultless Pcbs Method of manufacturing circuit boards
JPS60149196A (ja) * 1984-01-17 1985-08-06 ソニー株式会社 プリント基板およびその製造方法
US4543153A (en) * 1984-05-17 1985-09-24 Psi Star Process and apparatus for etching copper masked by a nickel-gold mask
US4651417A (en) * 1984-10-23 1987-03-24 New West Technology Corporation Method for forming printed circuit board
US4943334A (en) * 1986-09-15 1990-07-24 Compositech Ltd. Method for making reinforced plastic laminates for use in the production of circuit boards
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards
US4946563A (en) * 1988-12-12 1990-08-07 General Electric Company Process for manufacturing a selective plated board for surface mount components
US4992059A (en) * 1989-12-01 1991-02-12 Westinghouse Electric Corp. Ultra fine line cable and a method for fabricating the same
US5948533A (en) * 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
US5069628A (en) * 1990-03-13 1991-12-03 Hughes Aircraft Company Flexible electrical cable connector with double sided dots
JPH04278598A (ja) * 1991-03-07 1992-10-05 Nec Corp 多層印刷配線板の製造方法
US5440805A (en) * 1992-03-09 1995-08-15 Rogers Corporation Method of manufacturing a multilayer circuit
US5329695A (en) * 1992-09-01 1994-07-19 Rogers Corporation Method of manufacturing a multilayer circuit board
US5309629A (en) * 1992-09-01 1994-05-10 Rogers Corporation Method of manufacturing a multilayer circuit board
US5274912A (en) * 1992-09-01 1994-01-04 Rogers Corporation Method of manufacturing a multilayer circuit board
TW277204B (sv) * 1994-12-02 1996-06-01 Nippon Paint Co Ltd
US5908542A (en) * 1997-07-02 1999-06-01 Gould Electronics Inc. Metal foil with improved bonding to substrates and method for making the foil
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
JP2000286549A (ja) 1999-03-24 2000-10-13 Fujitsu Ltd バイアコネクションを備えた基板の製造方法
US20020139668A1 (en) * 1999-11-03 2002-10-03 Raghbir Singh Bhullar Embedded metallic deposits
EP1250395A4 (en) 1999-12-09 2005-06-08 Valspar Sourcing Inc ABRASIVE COATING
DE10000090A1 (de) * 2000-01-04 2001-08-30 Elfo Ag Sachseln Sachseln Verfahren zum Herstellen einer mehrlagigen Planarspule
JP4070470B2 (ja) * 2002-01-24 2008-04-02 新光電気工業株式会社 半導体装置用多層回路基板及びその製造方法並びに半導体装置
WO2004079795A2 (en) * 2003-03-04 2004-09-16 Rohm And Haas Electronic Materials, L.L.C. Coaxial waveguide microstructures and methods of formation thereof
KR101476438B1 (ko) 2006-12-30 2014-12-24 누보트로닉스, 엘.엘.씨 3차원 미세구조 및 그 형성방법
US7755174B2 (en) 2007-03-20 2010-07-13 Nuvotonics, LLC Integrated electronic components and methods of formation thereof
US7898356B2 (en) 2007-03-20 2011-03-01 Nuvotronics, Llc Coaxial transmission line microstructures and methods of formation thereof
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
JP5639194B2 (ja) * 2010-01-22 2014-12-10 ヌボトロニクス，エルエルシー 熱制御
US8917150B2 (en) * 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) * 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
JP6335782B2 (ja) 2011-07-13 2018-05-30 ヌボトロニクス、インク． 電子的および機械的な構造を製作する方法
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
KR20160133422A (ko) 2014-01-17 2016-11-22 누보트로닉스, 인크. 웨이퍼 규모 테스트 인터페이스 유닛 및 컨택터
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
CN112040670A (zh) * 2020-11-09 2020-12-04 广东科翔电子科技股份有限公司 一种超薄刚挠结合板的揭盖方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075866A (en) * 1958-06-19 1963-01-29 Xerox Corp Method of making printed circuits
US3306830A (en) * 1963-06-13 1967-02-28 Bell Telephone Labor Inc Printed circuit boards and their fabrication
US3508330A (en) * 1967-04-06 1970-04-28 Gen Dynamics Corp Method of fabricating multitube electronic circuit boards
US3654097A (en) * 1969-07-22 1972-04-04 Gen Dynamics Corp Method of making multilayer printed circuits
GB1411799A (en) 1972-12-08 1975-10-29 Fortin Laminating Corp Laminates of electrically conducting and insulating material
DE2304685C3 (de) * 1973-01-31 1975-07-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung mikroskopisch kleiner Metall- oder Metallegierungs-Strukturen

Also Published As

Publication number Publication date
US4075757A (en) 1978-02-28
SE404863B (sv) 1978-10-30

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