SE455243B - Elektro-optiskt kopplingsdon innefattande ett holje som omsluter ett elektrooptiskt element, vilket holje inrymmer en optiskt aktiv kavitet fylld med ett transparent lim - Google Patents
Elektro-optiskt kopplingsdon innefattande ett holje som omsluter ett elektrooptiskt element, vilket holje inrymmer en optiskt aktiv kavitet fylld med ett transparent limInfo
- Publication number
- SE455243B SE455243B SE8002444A SE8002444A SE455243B SE 455243 B SE455243 B SE 455243B SE 8002444 A SE8002444 A SE 8002444A SE 8002444 A SE8002444 A SE 8002444A SE 455243 B SE455243 B SE 455243B
- Authority
- SE
- Sweden
- Prior art keywords
- electro
- optical
- optic
- housing
- chip
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2913262A DE2913262C2 (de) | 1979-04-03 | 1979-04-03 | Elektro-optische Verbindungsvorrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
SE8002444L SE8002444L (sv) | 1980-10-04 |
SE455243B true SE455243B (sv) | 1988-06-27 |
Family
ID=6067264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8002444A SE455243B (sv) | 1979-04-03 | 1980-03-31 | Elektro-optiskt kopplingsdon innefattande ett holje som omsluter ett elektrooptiskt element, vilket holje inrymmer en optiskt aktiv kavitet fylld med ett transparent lim |
Country Status (5)
Country | Link |
---|---|
JP (2) | JPS5612780A (lt) |
DE (1) | DE2913262C2 (lt) |
FR (1) | FR2453555A1 (lt) |
GB (1) | GB2046472B (lt) |
SE (1) | SE455243B (lt) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3113146C2 (de) * | 1981-04-01 | 1985-03-28 | Siemens AG, 1000 Berlin und 8000 München | Elektro-optischer Modulsteckverbinder |
FR2533710A1 (fr) * | 1982-09-24 | 1984-03-30 | Radiotechnique Compelec | Procede d'assemblage d'un dispositif de transmission par fibre optique |
DE3302373A1 (de) * | 1983-01-25 | 1984-07-26 | WAGO Verwaltungsgesellschaft mbH, 4950 Minden | Schaltanlagen-reihenklemme |
CA1247902A (en) * | 1983-09-30 | 1989-01-03 | Timothy R. Ponn | Fiber optic connector assembly |
DE3513229A1 (de) * | 1985-04-12 | 1986-10-16 | Schott Glaswerke, 6500 Mainz | Lichtzuendbarer thyristor |
JPH0830776B2 (ja) * | 1986-01-31 | 1996-03-27 | 京セラ株式会社 | 光通信用モジュール |
DE3736026A1 (de) * | 1987-10-24 | 1989-05-03 | Standard Elektrik Lorenz Ag | Optoelektrisches bauelement und verfahren zu dessen herstellung |
GB2230349A (en) * | 1989-04-08 | 1990-10-17 | Oxley Dev Co Ltd | "fibre optic/led coupling". |
EP0450560B1 (en) * | 1990-04-03 | 1998-07-22 | Sumitomo Electric Industries, Ltd. | An optical device |
JP2792722B2 (ja) * | 1990-07-16 | 1998-09-03 | 三菱電機株式会社 | 半導体発光装置 |
DE4114156A1 (de) * | 1991-04-30 | 1992-11-05 | Burndy Deutschland | Steckverbinder fuer lichtwellenleiter |
DE19541139C1 (de) | 1995-10-27 | 1997-05-15 | Siemens Ag | Aufnahmeanordnung und Verfahren zum Herstellen einer Aufnahmeanordnung für mindestens einen umhüllten Lichtwellenleiter |
GB9608381D0 (en) * | 1996-04-23 | 1996-06-26 | Baillie Hamilton William J | Combined light emitting and light guide collection and output device |
GB2365990A (en) * | 2000-08-04 | 2002-02-27 | Kymata Ltd | Optical device with strengthening member and guide formations |
DE10257128B3 (de) * | 2002-12-05 | 2004-05-27 | Schott Glas | Vorrichtung zur Einkopplung von Licht in einen Lichtleiter |
JP2005353816A (ja) * | 2004-06-10 | 2005-12-22 | Olympus Corp | 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE794374A (fr) * | 1972-02-03 | 1973-07-23 | Trefilunion | Machine et procede de fabrication d'un treillis cylindrique expansible notament pour la realisation d'une armature de tuyau a emboitement, et treillis obtenu |
DE2207900B1 (de) * | 1972-02-19 | 1972-10-12 | Messerschmitt-Bölkow-Blohm GmbH, 8000 München | Kupplungselement für Lichtleitfaserkabel |
US3938177A (en) * | 1973-06-25 | 1976-02-10 | Amp Incorporated | Narrow lead contact for automatic face down bonding of electronic chips |
US3840741A (en) * | 1973-09-18 | 1974-10-08 | Bell Telephone Labor Inc | Semiconductor delay line detector for equalization of optical fiber dispersion |
US4076376A (en) * | 1973-10-16 | 1978-02-28 | Bicc Limited | Optical transmission systems |
GB1461693A (en) * | 1974-01-15 | 1977-01-19 | Marconi Co Ltd | Fibre optic couplers |
FR2262407B1 (lt) * | 1974-02-22 | 1977-09-16 | Radiotechnique Compelec | |
GB1557685A (en) * | 1976-02-02 | 1979-12-12 | Fairchild Camera Instr Co | Optically coupled isolator device |
GB1569615A (en) * | 1976-10-19 | 1980-06-18 | Standard Telephones Cables Ltd | Coupling optical fibres |
US4144541A (en) * | 1977-01-27 | 1979-03-13 | Electric Power Research Institute, Inc. | Light-activated semiconductor device package unit |
DE2707190B2 (de) * | 1977-02-18 | 1979-05-17 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Anordnung zur optoelektronischen Kopplung von eigensicheren und nichteigensicheren Stromkreisen, insbesondere in Schlagwetter- oder explosionsgeschützten Anlagen |
DE2724850A1 (de) * | 1977-06-02 | 1978-12-07 | Bosch Gmbh Robert | Elektrooptische anordnung |
-
1979
- 1979-04-03 DE DE2913262A patent/DE2913262C2/de not_active Expired
-
1980
- 1980-03-31 GB GB8010815A patent/GB2046472B/en not_active Expired
- 1980-03-31 SE SE8002444A patent/SE455243B/sv not_active IP Right Cessation
- 1980-04-02 FR FR8007462A patent/FR2453555A1/fr active Granted
- 1980-04-03 JP JP4290680A patent/JPS5612780A/ja active Pending
-
1987
- 1987-11-16 JP JP1987173926U patent/JPS63100855U/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS63100855U (lt) | 1988-06-30 |
FR2453555A1 (fr) | 1980-10-31 |
GB2046472B (en) | 1983-01-26 |
FR2453555B1 (lt) | 1984-12-14 |
JPS5612780A (en) | 1981-02-07 |
DE2913262C2 (de) | 1982-04-29 |
SE8002444L (sv) | 1980-10-04 |
DE2913262A1 (de) | 1980-10-09 |
GB2046472A (en) | 1980-11-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |
Ref document number: 8002444-1 Effective date: 19911108 Format of ref document f/p: F |