SE412144B - Vermeoverforande anordning avsedd for kylning av elektroniska komponenter - Google Patents

Vermeoverforande anordning avsedd for kylning av elektroniska komponenter

Info

Publication number
SE412144B
SE412144B SE7512989A SE7512989A SE412144B SE 412144 B SE412144 B SE 412144B SE 7512989 A SE7512989 A SE 7512989A SE 7512989 A SE7512989 A SE 7512989A SE 412144 B SE412144 B SE 412144B
Authority
SE
Sweden
Prior art keywords
cooling
head
electronic components
device intended
conversing device
Prior art date
Application number
SE7512989A
Other languages
English (en)
Swedish (sv)
Other versions
SE7512989L (sv
Inventor
R G Mccready
P E Eggers
Original Assignee
Sundstrand Heat Transfer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sundstrand Heat Transfer Inc filed Critical Sundstrand Heat Transfer Inc
Publication of SE7512989L publication Critical patent/SE7512989L/xx
Publication of SE412144B publication Critical patent/SE412144B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE7512989A 1974-11-25 1975-11-19 Vermeoverforande anordning avsedd for kylning av elektroniska komponenter SE412144B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52664374A 1974-11-25 1974-11-25

Publications (2)

Publication Number Publication Date
SE7512989L SE7512989L (sv) 1976-05-26
SE412144B true SE412144B (sv) 1980-02-18

Family

ID=24098158

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7512989A SE412144B (sv) 1974-11-25 1975-11-19 Vermeoverforande anordning avsedd for kylning av elektroniska komponenter

Country Status (6)

Country Link
JP (1) JPS5162901A (de)
DE (1) DE2550419A1 (de)
FR (1) FR2292335A1 (de)
GB (1) GB1499578A (de)
IT (1) IT1052396B (de)
SE (1) SE412144B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353415A (en) 1979-07-30 1982-10-12 United Kingdom Atomic Energy Authority Heat pipes and thermal siphons
US4339260A (en) * 1981-01-12 1982-07-13 Owens-Illinois, Inc. Environmentally protected electronic control for a glassware forming machine
DE3305687A1 (de) * 1983-02-18 1984-08-23 Raymond E. San Diego Calif. Wiech jun. Verfahren zur herstellung komplexer mikroschaltungsplatten, -substrate und mikroschaltungen und nach dem verfahren hergestellte substrate und mikroschaltungen
JPS59500742A (ja) * 1983-04-27 1984-04-26 ヒユ−ズ・エアクラフト・カンパニ− 高電力回路基盤用ヒ−トパイプ冷却モジユ−ル
FR2577349B1 (fr) * 1985-02-08 1987-10-09 Sintra Dispositif de refroidissement de circuits integres a semi-conducteur
US4805691A (en) * 1986-12-22 1989-02-21 Sundstrand Corporation Cooling technique for compact electronics inverter
DE3805851A1 (de) * 1988-02-25 1989-08-31 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung
JP3896961B2 (ja) * 2002-12-12 2007-03-22 ソニー株式会社 熱輸送装置および熱輸送装置の製造方法

Also Published As

Publication number Publication date
IT1052396B (it) 1981-06-20
FR2292335A1 (fr) 1976-06-18
SE7512989L (sv) 1976-05-26
DE2550419A1 (de) 1976-05-26
JPS5162901A (en) 1976-05-31
GB1499578A (en) 1978-02-01

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