SE411813B - Sett att framstella en halvledaranordning och enligt settet framstelld halvledaranordning - Google Patents

Sett att framstella en halvledaranordning och enligt settet framstelld halvledaranordning

Info

Publication number
SE411813B
SE411813B SE7513565A SE7513565A SE411813B SE 411813 B SE411813 B SE 411813B SE 7513565 A SE7513565 A SE 7513565A SE 7513565 A SE7513565 A SE 7513565A SE 411813 B SE411813 B SE 411813B
Authority
SE
Sweden
Prior art keywords
semiconductor device
settlement
manufacture
semiconductor
settlement semiconductor
Prior art date
Application number
SE7513565A
Other languages
English (en)
Swedish (sv)
Other versions
SE7513565L (sv
Inventor
H G Kock
Nobel D De
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE7513565L publication Critical patent/SE7513565L/xx
Publication of SE411813B publication Critical patent/SE411813B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
SE7513565A 1974-12-05 1975-12-02 Sett att framstella en halvledaranordning och enligt settet framstelld halvledaranordning SE411813B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7415841A NL7415841A (nl) 1974-12-05 1974-12-05 Werkwijze voor het vervaardigen van een half- geleiderinrichting en halfgeleiderinrichting, vervaardigd volgens de werkwijze.

Publications (2)

Publication Number Publication Date
SE7513565L SE7513565L (sv) 1976-06-08
SE411813B true SE411813B (sv) 1980-02-04

Family

ID=19822593

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7513565A SE411813B (sv) 1974-12-05 1975-12-02 Sett att framstella en halvledaranordning och enligt settet framstelld halvledaranordning

Country Status (10)

Country Link
JP (1) JPS5182569A (en, 2012)
AU (1) AU499832B2 (en, 2012)
CA (1) CA1042114A (en, 2012)
CH (1) CH595698A5 (en, 2012)
DE (1) DE2552430A1 (en, 2012)
FR (1) FR2293794A1 (en, 2012)
GB (1) GB1525400A (en, 2012)
IT (1) IT1051815B (en, 2012)
NL (1) NL7415841A (en, 2012)
SE (1) SE411813B (en, 2012)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2340620A1 (fr) * 1976-02-06 1977-09-02 Ibm Procede de fabrication d'un dispositif integre a grande echelle ayant une surface plane
FR2535525A1 (fr) * 1982-10-29 1984-05-04 Western Electric Co Procede de fabrication de circuits integres comportant des couches isolantes minces

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3642528A (en) * 1968-06-05 1972-02-15 Matsushita Electronics Corp Semiconductor device and method of making same
JPS4918268A (en, 2012) * 1972-06-09 1974-02-18

Also Published As

Publication number Publication date
SE7513565L (sv) 1976-06-08
NL7415841A (nl) 1976-06-09
IT1051815B (it) 1981-05-20
GB1525400A (en) 1978-09-20
JPS5182569A (en) 1976-07-20
AU8715275A (en) 1977-06-09
DE2552430A1 (de) 1976-06-10
AU499832B2 (en) 1979-05-03
CH595698A5 (en, 2012) 1978-02-28
CA1042114A (en) 1978-11-07
FR2293794B1 (en, 2012) 1981-08-07
FR2293794A1 (fr) 1976-07-02

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