SE412488B - Halvledarkomponentbricka och sett att framstella densamma - Google Patents

Halvledarkomponentbricka och sett att framstella densamma

Info

Publication number
SE412488B
SE412488B SE7613202A SE7613202A SE412488B SE 412488 B SE412488 B SE 412488B SE 7613202 A SE7613202 A SE 7613202A SE 7613202 A SE7613202 A SE 7613202A SE 412488 B SE412488 B SE 412488B
Authority
SE
Sweden
Prior art keywords
manufacture
way
semiconductor component
component issue
issue
Prior art date
Application number
SE7613202A
Other languages
English (en)
Other versions
SE7613202L (sv
Inventor
J K Boah
R W Kennedy
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of SE7613202L publication Critical patent/SE7613202L/sv
Publication of SE412488B publication Critical patent/SE412488B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/761—PN junctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Thyristors (AREA)
  • Element Separation (AREA)
  • Formation Of Insulating Films (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
SE7613202A 1975-11-26 1976-11-25 Halvledarkomponentbricka och sett att framstella densamma SE412488B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/635,747 US4063272A (en) 1975-11-26 1975-11-26 Semiconductor device and method of manufacture thereof

Publications (2)

Publication Number Publication Date
SE7613202L SE7613202L (sv) 1977-05-27
SE412488B true SE412488B (sv) 1980-03-03

Family

ID=24548955

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7613202A SE412488B (sv) 1975-11-26 1976-11-25 Halvledarkomponentbricka och sett att framstella densamma

Country Status (6)

Country Link
US (2) US4063272A (sv)
JP (1) JPS5279655A (sv)
DE (1) DE2653297A1 (sv)
FR (1) FR2333350A1 (sv)
GB (1) GB1553730A (sv)
SE (1) SE412488B (sv)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584814B2 (ja) * 1976-04-27 1983-01-27 三菱電機株式会社 半導体装置
US4180416A (en) * 1978-09-27 1979-12-25 International Business Machines Corporation Thermal migration-porous silicon technique for forming deep dielectric isolation
US4235645A (en) * 1978-12-15 1980-11-25 Westinghouse Electric Corp. Process for forming glass-sealed multichip semiconductor devices
DE3331298A1 (de) * 1983-08-31 1985-03-14 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsthyristor auf einem substrat
DE3841149A1 (de) * 1988-12-07 1990-06-13 Asea Brown Boveri Verfahren zur herstellung einer leistungshalbleiterdiode
DE4109533C2 (de) * 1990-09-13 1994-06-23 Eupec Gmbh & Co Kg Passiviertes Halbleiterbauelement und Verfahren zu seiner Herstellung
DE4317721C1 (de) * 1993-05-27 1994-07-21 Siemens Ag Verfahren zur Vereinzelung von Chips aus einem Wafer
TW483093B (en) * 1999-04-22 2002-04-11 Int Rectifier Corp Chip scale package
US7683464B2 (en) * 2005-09-13 2010-03-23 Alpha And Omega Semiconductor Incorporated Semiconductor package having dimpled plate interconnections
US20070057368A1 (en) * 2005-09-13 2007-03-15 Yueh-Se Ho Semiconductor package having plate interconnections
US7622796B2 (en) * 2005-09-13 2009-11-24 Alpha And Omega Semiconductor Limited Semiconductor package having a bridged plate interconnection
US8680658B2 (en) * 2008-05-30 2014-03-25 Alpha And Omega Semiconductor Incorporated Conductive clip for semiconductor device package
CN105453250A (zh) * 2013-08-08 2016-03-30 夏普株式会社 半导体元件衬底及其制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1110993A (en) * 1967-01-09 1968-04-24 Standard Telephones Cables Ltd Semiconductors
US3535774A (en) * 1968-07-09 1970-10-27 Rca Corp Method of fabricating semiconductor devices
US3628106A (en) * 1969-05-05 1971-12-14 Gen Electric Passivated semiconductor device with protective peripheral junction portion
NL161301C (nl) * 1972-12-29 1980-01-15 Philips Nv Halfgeleiderinrichting en werkwijze voor de vervaar- diging daarvan.
US3908187A (en) * 1973-01-02 1975-09-23 Gen Electric High voltage power transistor and method for making
US3972113A (en) * 1973-05-14 1976-08-03 Mitsubishi Denki Kabushiki Kaisha Process of producing semiconductor devices
US3904442A (en) * 1973-10-30 1975-09-09 Gen Electric Method of making isolation grids in bodies of semiconductor material
US3979230A (en) * 1973-10-30 1976-09-07 General Electric Company Method of making isolation grids in bodies of semiconductor material
US3896477A (en) * 1973-11-07 1975-07-22 Jearld L Hutson Multilayer semiconductor switching devices
US3982269A (en) * 1974-11-22 1976-09-21 General Electric Company Semiconductor devices and method, including TGZM, of making same
GB1536545A (en) * 1975-03-26 1978-12-20 Mullard Ltd Semiconductor device manufacture
US4010534A (en) * 1975-06-27 1977-03-08 General Electric Company Process for making a deep diode atomic battery

Also Published As

Publication number Publication date
FR2333350A1 (fr) 1977-06-24
JPS5279655A (en) 1977-07-04
US4063272A (en) 1977-12-13
SE7613202L (sv) 1977-05-27
GB1553730A (en) 1979-09-26
DE2653297A1 (de) 1977-06-08
FR2333350B1 (sv) 1982-08-27
US4104786A (en) 1978-08-08

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