SE402034B - Holje for en halvledarkomponent - Google Patents

Holje for en halvledarkomponent

Info

Publication number
SE402034B
SE402034B SE7510359A SE7510359A SE402034B SE 402034 B SE402034 B SE 402034B SE 7510359 A SE7510359 A SE 7510359A SE 7510359 A SE7510359 A SE 7510359A SE 402034 B SE402034 B SE 402034B
Authority
SE
Sweden
Prior art keywords
oil
semiconductor component
semiconductor
component
Prior art date
Application number
SE7510359A
Other languages
English (en)
Swedish (sv)
Other versions
SE7510359L (sv
Inventor
G Hartmann
J-U Schwarz
K Keil
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19742444418 external-priority patent/DE2444418C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7510359L publication Critical patent/SE7510359L/xx
Publication of SE402034B publication Critical patent/SE402034B/xx

Links

Classifications

    • H10W40/778—
    • H10W40/226—
    • H10W70/461—
    • H10W72/00—
    • H10W74/114—
SE7510359A 1974-09-17 1975-09-16 Holje for en halvledarkomponent SE402034B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742444418 DE2444418C3 (de) 1974-09-17 Gehäuse für ein Halbleiterbauelement

Publications (2)

Publication Number Publication Date
SE7510359L SE7510359L (sv) 1976-03-18
SE402034B true SE402034B (sv) 1978-06-12

Family

ID=5925996

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7510359A SE402034B (sv) 1974-09-17 1975-09-16 Holje for en halvledarkomponent

Country Status (7)

Country Link
US (1) US4024570A (enExample)
JP (1) JPS5156177A (enExample)
CA (1) CA1041222A (enExample)
FR (1) FR2285718A1 (enExample)
GB (1) GB1478797A (enExample)
IT (1) IT1042428B (enExample)
SE (1) SE402034B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124865A (en) * 1976-04-13 1977-10-20 Sharp Corp Semiconductor device
US4393393A (en) * 1979-08-13 1983-07-12 Mcdonnell Douglas Corporation Laser diode with double sided heat sink
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
US4439006A (en) * 1981-05-18 1984-03-27 Motorola, Inc. Low cost electro-optical connector
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
US4819041A (en) * 1983-12-30 1989-04-04 Amp Incorporated Surface mounted integrated circuit chip package and method for making same
JPH0740600B2 (ja) * 1987-04-30 1995-05-01 三菱電機株式会社 半導体装置
US5208467A (en) * 1988-07-28 1993-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a film-covered packaged component
US5438222A (en) * 1989-08-28 1995-08-01 Semiconductor Energy Laboratory Co., Ltd. Electronic device with plural pad connection of semiconductor chip to leads
US5583372A (en) * 1994-09-14 1996-12-10 Micron Technology, Inc. Adhesion enhanced semiconductor die for mold compound packaging
US6066514A (en) * 1996-10-18 2000-05-23 Micron Technology, Inc. Adhesion enhanced semiconductor die for mold compound packaging
US5796159A (en) * 1995-11-30 1998-08-18 Analog Devices, Inc. Thermally efficient integrated circuit package
US6159764A (en) * 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
US5955777A (en) 1997-07-02 1999-09-21 Micron Technology, Inc. Lead frame assemblies with voltage reference plane and IC packages including same
US7233056B1 (en) 1998-02-23 2007-06-19 Micron Technology, Inc. Chip scale package with heat spreader
US6314639B1 (en) 1998-02-23 2001-11-13 Micron Technology, Inc. Chip scale package with heat spreader and method of manufacture
US6326687B1 (en) 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders
US6117797A (en) 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3610870A (en) * 1968-03-13 1971-10-05 Hitachi Ltd Method for sealing a semiconductor element
US3662230A (en) * 1968-06-25 1972-05-09 Texas Instruments Inc A semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films
US3864728A (en) * 1970-11-20 1975-02-04 Siemens Ag Semiconductor components having bimetallic lead connected thereto
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
US3820153A (en) * 1972-08-28 1974-06-25 Zyrotron Ind Inc Plurality of semiconductor elements mounted on common base
US3938177A (en) * 1973-06-25 1976-02-10 Amp Incorporated Narrow lead contact for automatic face down bonding of electronic chips

Also Published As

Publication number Publication date
CA1041222A (en) 1978-10-24
GB1478797A (en) 1977-07-06
FR2285718A1 (fr) 1976-04-16
JPS5156177A (enExample) 1976-05-17
DE2444418B2 (de) 1977-03-24
SE7510359L (sv) 1976-03-18
FR2285718B1 (enExample) 1979-06-22
IT1042428B (it) 1980-01-30
US4024570A (en) 1977-05-17
DE2444418A1 (de) 1976-04-01

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