SE402034B - Holje for en halvledarkomponent - Google Patents
Holje for en halvledarkomponentInfo
- Publication number
- SE402034B SE402034B SE7510359A SE7510359A SE402034B SE 402034 B SE402034 B SE 402034B SE 7510359 A SE7510359 A SE 7510359A SE 7510359 A SE7510359 A SE 7510359A SE 402034 B SE402034 B SE 402034B
- Authority
- SE
- Sweden
- Prior art keywords
- oil
- semiconductor component
- semiconductor
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19742444418 DE2444418C3 (de) | 1974-09-17 | Gehäuse für ein Halbleiterbauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7510359L SE7510359L (sv) | 1976-03-18 |
SE402034B true SE402034B (sv) | 1978-06-12 |
Family
ID=5925996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7510359A SE402034B (sv) | 1974-09-17 | 1975-09-16 | Holje for en halvledarkomponent |
Country Status (7)
Country | Link |
---|---|
US (1) | US4024570A (xx) |
JP (1) | JPS5156177A (xx) |
CA (1) | CA1041222A (xx) |
FR (1) | FR2285718A1 (xx) |
GB (1) | GB1478797A (xx) |
IT (1) | IT1042428B (xx) |
SE (1) | SE402034B (xx) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52124865A (en) * | 1976-04-13 | 1977-10-20 | Sharp Corp | Semiconductor device |
US4393393A (en) * | 1979-08-13 | 1983-07-12 | Mcdonnell Douglas Corporation | Laser diode with double sided heat sink |
JPS6018145B2 (ja) * | 1980-09-22 | 1985-05-09 | 株式会社日立製作所 | 樹脂封止型半導体装置 |
US4439006A (en) * | 1981-05-18 | 1984-03-27 | Motorola, Inc. | Low cost electro-optical connector |
JPS5966157A (ja) * | 1982-10-08 | 1984-04-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US4819041A (en) * | 1983-12-30 | 1989-04-04 | Amp Incorporated | Surface mounted integrated circuit chip package and method for making same |
JPH0740600B2 (ja) * | 1987-04-30 | 1995-05-01 | 三菱電機株式会社 | 半導体装置 |
US5208467A (en) * | 1988-07-28 | 1993-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a film-covered packaged component |
US5438222A (en) * | 1989-08-28 | 1995-08-01 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device with plural pad connection of semiconductor chip to leads |
US6066514A (en) | 1996-10-18 | 2000-05-23 | Micron Technology, Inc. | Adhesion enhanced semiconductor die for mold compound packaging |
US5583372A (en) * | 1994-09-14 | 1996-12-10 | Micron Technology, Inc. | Adhesion enhanced semiconductor die for mold compound packaging |
US5796159A (en) * | 1995-11-30 | 1998-08-18 | Analog Devices, Inc. | Thermally efficient integrated circuit package |
US5955777A (en) * | 1997-07-02 | 1999-09-21 | Micron Technology, Inc. | Lead frame assemblies with voltage reference plane and IC packages including same |
US6159764A (en) * | 1997-07-02 | 2000-12-12 | Micron Technology, Inc. | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages |
US7233056B1 (en) | 1998-02-23 | 2007-06-19 | Micron Technology, Inc. | Chip scale package with heat spreader |
US6314639B1 (en) | 1998-02-23 | 2001-11-13 | Micron Technology, Inc. | Chip scale package with heat spreader and method of manufacture |
US6326687B1 (en) | 1998-09-01 | 2001-12-04 | Micron Technology, Inc. | IC package with dual heat spreaders |
US6117797A (en) * | 1998-09-03 | 2000-09-12 | Micron Technology, Inc. | Attachment method for heat sinks and devices involving removal of misplaced encapsulant |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3544857A (en) * | 1966-08-16 | 1970-12-01 | Signetics Corp | Integrated circuit assembly with lead structure and method |
US3610870A (en) * | 1968-03-13 | 1971-10-05 | Hitachi Ltd | Method for sealing a semiconductor element |
US3662230A (en) * | 1968-06-25 | 1972-05-09 | Texas Instruments Inc | A semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films |
US3864728A (en) * | 1970-11-20 | 1975-02-04 | Siemens Ag | Semiconductor components having bimetallic lead connected thereto |
US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
US3868725A (en) * | 1971-10-14 | 1975-02-25 | Philips Corp | Integrated circuit lead structure |
NL159818B (nl) * | 1972-04-06 | 1979-03-15 | Philips Nv | Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen. |
US3820153A (en) * | 1972-08-28 | 1974-06-25 | Zyrotron Ind Inc | Plurality of semiconductor elements mounted on common base |
US3938177A (en) * | 1973-06-25 | 1976-02-10 | Amp Incorporated | Narrow lead contact for automatic face down bonding of electronic chips |
-
1975
- 1975-07-31 GB GB32016/75A patent/GB1478797A/en not_active Expired
- 1975-09-02 CA CA234,514A patent/CA1041222A/en not_active Expired
- 1975-09-05 US US05/610,757 patent/US4024570A/en not_active Expired - Lifetime
- 1975-09-10 IT IT27093/75A patent/IT1042428B/it active
- 1975-09-16 SE SE7510359A patent/SE402034B/xx unknown
- 1975-09-16 FR FR7528361A patent/FR2285718A1/fr active Granted
- 1975-09-17 JP JP50112480A patent/JPS5156177A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2285718A1 (fr) | 1976-04-16 |
FR2285718B1 (xx) | 1979-06-22 |
IT1042428B (it) | 1980-01-30 |
DE2444418A1 (de) | 1976-04-01 |
CA1041222A (en) | 1978-10-24 |
US4024570A (en) | 1977-05-17 |
DE2444418B2 (de) | 1977-03-24 |
SE7510359L (sv) | 1976-03-18 |
GB1478797A (en) | 1977-07-06 |
JPS5156177A (xx) | 1976-05-17 |
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