FR2285718B1 - - Google Patents
Info
- Publication number
- FR2285718B1 FR2285718B1 FR7528361A FR7528361A FR2285718B1 FR 2285718 B1 FR2285718 B1 FR 2285718B1 FR 7528361 A FR7528361 A FR 7528361A FR 7528361 A FR7528361 A FR 7528361A FR 2285718 B1 FR2285718 B1 FR 2285718B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/778—
-
- H10W40/226—
-
- H10W70/461—
-
- H10W72/00—
-
- H10W74/114—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19742444418 DE2444418C3 (de) | 1974-09-17 | Gehäuse für ein Halbleiterbauelement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2285718A1 FR2285718A1 (fr) | 1976-04-16 |
| FR2285718B1 true FR2285718B1 (enExample) | 1979-06-22 |
Family
ID=5925996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7528361A Granted FR2285718A1 (fr) | 1974-09-17 | 1975-09-16 | Boitier pour ensemble a semi-conducteurs |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4024570A (enExample) |
| JP (1) | JPS5156177A (enExample) |
| CA (1) | CA1041222A (enExample) |
| FR (1) | FR2285718A1 (enExample) |
| GB (1) | GB1478797A (enExample) |
| IT (1) | IT1042428B (enExample) |
| SE (1) | SE402034B (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52124865A (en) * | 1976-04-13 | 1977-10-20 | Sharp Corp | Semiconductor device |
| US4393393A (en) * | 1979-08-13 | 1983-07-12 | Mcdonnell Douglas Corporation | Laser diode with double sided heat sink |
| JPS6018145B2 (ja) * | 1980-09-22 | 1985-05-09 | 株式会社日立製作所 | 樹脂封止型半導体装置 |
| US4439006A (en) * | 1981-05-18 | 1984-03-27 | Motorola, Inc. | Low cost electro-optical connector |
| JPS5966157A (ja) * | 1982-10-08 | 1984-04-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| US4819041A (en) * | 1983-12-30 | 1989-04-04 | Amp Incorporated | Surface mounted integrated circuit chip package and method for making same |
| JPH0740600B2 (ja) * | 1987-04-30 | 1995-05-01 | 三菱電機株式会社 | 半導体装置 |
| US5208467A (en) * | 1988-07-28 | 1993-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a film-covered packaged component |
| US5438222A (en) * | 1989-08-28 | 1995-08-01 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device with plural pad connection of semiconductor chip to leads |
| US5583372A (en) * | 1994-09-14 | 1996-12-10 | Micron Technology, Inc. | Adhesion enhanced semiconductor die for mold compound packaging |
| US6066514A (en) * | 1996-10-18 | 2000-05-23 | Micron Technology, Inc. | Adhesion enhanced semiconductor die for mold compound packaging |
| US5796159A (en) * | 1995-11-30 | 1998-08-18 | Analog Devices, Inc. | Thermally efficient integrated circuit package |
| US6159764A (en) * | 1997-07-02 | 2000-12-12 | Micron Technology, Inc. | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages |
| US5955777A (en) | 1997-07-02 | 1999-09-21 | Micron Technology, Inc. | Lead frame assemblies with voltage reference plane and IC packages including same |
| US7233056B1 (en) | 1998-02-23 | 2007-06-19 | Micron Technology, Inc. | Chip scale package with heat spreader |
| US6314639B1 (en) | 1998-02-23 | 2001-11-13 | Micron Technology, Inc. | Chip scale package with heat spreader and method of manufacture |
| US6326687B1 (en) | 1998-09-01 | 2001-12-04 | Micron Technology, Inc. | IC package with dual heat spreaders |
| US6117797A (en) | 1998-09-03 | 2000-09-12 | Micron Technology, Inc. | Attachment method for heat sinks and devices involving removal of misplaced encapsulant |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3544857A (en) * | 1966-08-16 | 1970-12-01 | Signetics Corp | Integrated circuit assembly with lead structure and method |
| US3610870A (en) * | 1968-03-13 | 1971-10-05 | Hitachi Ltd | Method for sealing a semiconductor element |
| US3662230A (en) * | 1968-06-25 | 1972-05-09 | Texas Instruments Inc | A semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films |
| US3864728A (en) * | 1970-11-20 | 1975-02-04 | Siemens Ag | Semiconductor components having bimetallic lead connected thereto |
| US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
| US3868725A (en) * | 1971-10-14 | 1975-02-25 | Philips Corp | Integrated circuit lead structure |
| NL159818B (nl) * | 1972-04-06 | 1979-03-15 | Philips Nv | Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen. |
| US3820153A (en) * | 1972-08-28 | 1974-06-25 | Zyrotron Ind Inc | Plurality of semiconductor elements mounted on common base |
| US3938177A (en) * | 1973-06-25 | 1976-02-10 | Amp Incorporated | Narrow lead contact for automatic face down bonding of electronic chips |
-
1975
- 1975-07-31 GB GB32016/75A patent/GB1478797A/en not_active Expired
- 1975-09-02 CA CA234,514A patent/CA1041222A/en not_active Expired
- 1975-09-05 US US05/610,757 patent/US4024570A/en not_active Expired - Lifetime
- 1975-09-10 IT IT27093/75A patent/IT1042428B/it active
- 1975-09-16 FR FR7528361A patent/FR2285718A1/fr active Granted
- 1975-09-16 SE SE7510359A patent/SE402034B/xx unknown
- 1975-09-17 JP JP50112480A patent/JPS5156177A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CA1041222A (en) | 1978-10-24 |
| SE402034B (sv) | 1978-06-12 |
| GB1478797A (en) | 1977-07-06 |
| FR2285718A1 (fr) | 1976-04-16 |
| JPS5156177A (enExample) | 1976-05-17 |
| DE2444418B2 (de) | 1977-03-24 |
| SE7510359L (sv) | 1976-03-18 |
| IT1042428B (it) | 1980-01-30 |
| US4024570A (en) | 1977-05-17 |
| DE2444418A1 (de) | 1976-04-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |