SE394344B - Anordning for kylning av halvledarkomponenter - Google Patents
Anordning for kylning av halvledarkomponenterInfo
- Publication number
- SE394344B SE394344B SE7317603A SE7317603A SE394344B SE 394344 B SE394344 B SE 394344B SE 7317603 A SE7317603 A SE 7317603A SE 7317603 A SE7317603 A SE 7317603A SE 394344 B SE394344 B SE 394344B
- Authority
- SE
- Sweden
- Prior art keywords
- cooling
- semiconductor components
- semiconductor
- components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS9004A CS159563B1 (he) | 1972-12-28 | 1972-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE394344B true SE394344B (sv) | 1977-06-20 |
Family
ID=5441334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7317603A SE394344B (sv) | 1972-12-28 | 1973-12-28 | Anordning for kylning av halvledarkomponenter |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3952797A (he) |
| JP (1) | JPS5422875B2 (he) |
| CH (1) | CH565453A5 (he) |
| CS (1) | CS159563B1 (he) |
| DD (1) | DD108173A5 (he) |
| DE (1) | DE2364773C2 (he) |
| FR (1) | FR2327640A1 (he) |
| GB (1) | GB1413922A (he) |
| SE (1) | SE394344B (he) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5239849A (en) * | 1975-09-25 | 1977-03-28 | Meidensha Electric Mfg Co Ltd | Cooling apparatus |
| GB2066487B (en) * | 1979-12-18 | 1983-11-23 | Philips Electronic Associated | Alignment of exposure masks |
| US4694119A (en) * | 1983-09-07 | 1987-09-15 | Sundstrand Data Control, Inc. | Heat shielded memory unit for an aircraft flight data recorder |
| GB2151769B (en) * | 1983-12-21 | 1987-11-04 | Marconi Electronic Devices | Heat sink arrangement |
| DE3642726A1 (de) * | 1986-12-13 | 1988-06-23 | Grundfos Int | Drehzahlgeregeltes pumpenaggregat |
| DE3642729C3 (de) * | 1986-12-13 | 1997-05-07 | Grundfos Int | Pumpenaggregat zur Förderung von Flüssigkeiten oder Gasen |
| DE3642723A1 (de) * | 1986-12-13 | 1988-06-23 | Grundfos Int | Statischer frequenzumrichter, insbesondere frequenzumrichter zur steuerung und/oder regelung von leistungsgroessen eines elektromotors |
| DE3642727A1 (de) * | 1986-12-13 | 1988-06-23 | Grundfos Int | Unterwasser-motorpumpe |
| US5308920A (en) * | 1992-07-31 | 1994-05-03 | Itoh Research & Development Laboratory Co., Ltd. | Heat radiating device |
| US5289694A (en) * | 1993-02-26 | 1994-03-01 | At&T Bell Laboratories | Circuit card mounting assembly |
| US5472043A (en) * | 1994-03-22 | 1995-12-05 | Aavid Laboratories, Inc. | Two-phase component cooler with radioactive initiator |
| US20040011509A1 (en) * | 2002-05-15 | 2004-01-22 | Wing Ming Siu | Vapor augmented heatsink with multi-wick structure |
| GB2404009B (en) * | 2003-07-17 | 2005-06-15 | Enfis Ltd | Cooling method and apparatus |
| US7353860B2 (en) * | 2004-06-16 | 2008-04-08 | Intel Corporation | Heat dissipating device with enhanced boiling/condensation structure |
| US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
| US8176972B2 (en) * | 2006-08-31 | 2012-05-15 | International Business Machines Corporation | Compliant vapor chamber chip packaging |
| TW200848683A (en) * | 2007-03-08 | 2008-12-16 | Convergence Technologies Ltd | Heat transfer device |
| RU2566679C1 (ru) * | 2014-07-29 | 2015-10-27 | Частное образовательное учреждение дополнительного профессионального образования "Саранский Дом науки и техники Российского Союза научных и инженерных общественных организаций" (ЧОУ ДПО "Саранский Дом науки и техники РСНИИОО") | Система жидкостного охлаждения силового полупроводникового прибора |
| CN113513934B (zh) * | 2021-06-30 | 2022-05-06 | 西安交通大学 | 一种基于双动力驱动强化传热的重力热管 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1714910U (de) * | 1953-10-19 | 1956-01-12 | Licentia Gmbh | Elektrisch unsymmetrisch leitendes system. |
| US3298427A (en) * | 1964-12-24 | 1967-01-17 | Robert A Erb | Method and apparatus for dropwise condensation |
| CA926033A (en) * | 1969-04-01 | 1973-05-08 | Sebastian W. Kessler, Jr. | Device transcalent assembly |
| SE354943B (he) * | 1970-02-24 | 1973-03-26 | Asea Ab | |
| SE350874B (he) * | 1970-03-05 | 1972-11-06 | Asea Ab | |
| US3673306A (en) * | 1970-11-02 | 1972-06-27 | Trw Inc | Fluid heat transfer method and apparatus for semi-conducting devices |
| FR2125380B1 (he) * | 1971-02-13 | 1977-09-02 | Bbc Brown Boveri & Cie | |
| CH528817A (de) * | 1971-03-11 | 1972-09-30 | Bbc Brown Boveri & Cie | Halter für mindestens ein scheibenförmiges Halbleiterelement |
| US3739235A (en) * | 1972-01-31 | 1973-06-12 | Rca Corp | Transcalent semiconductor device |
-
1972
- 1972-12-28 CS CS9004A patent/CS159563B1/cs unknown
-
1973
- 1973-12-10 CH CH1728673A patent/CH565453A5/xx not_active IP Right Cessation
- 1973-12-12 DD DD175285A patent/DD108173A5/xx unknown
- 1973-12-13 FR FR7344631A patent/FR2327640A1/fr active Granted
- 1973-12-21 US US05/427,225 patent/US3952797A/en not_active Expired - Lifetime
- 1973-12-25 JP JP744804A patent/JPS5422875B2/ja not_active Expired
- 1973-12-27 DE DE2364773A patent/DE2364773C2/de not_active Expired
- 1973-12-28 SE SE7317603A patent/SE394344B/xx unknown
- 1973-12-28 GB GB6007973A patent/GB1413922A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2364773A1 (de) | 1974-07-11 |
| GB1413922A (en) | 1975-11-12 |
| JPS4998584A (he) | 1974-09-18 |
| FR2327640A1 (fr) | 1977-05-06 |
| CH565453A5 (he) | 1975-08-15 |
| JPS5422875B2 (he) | 1979-08-09 |
| CS159563B1 (he) | 1975-01-31 |
| FR2327640B1 (he) | 1978-03-24 |
| DE2364773C2 (de) | 1982-06-24 |
| US3952797A (en) | 1976-04-27 |
| DD108173A5 (he) | 1974-09-05 |
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