SE381777B - Forfarande for att framstella en elektrisk ledare - Google Patents
Forfarande for att framstella en elektrisk ledareInfo
- Publication number
- SE381777B SE381777B SE7308622A SE7308622A SE381777B SE 381777 B SE381777 B SE 381777B SE 7308622 A SE7308622 A SE 7308622A SE 7308622 A SE7308622 A SE 7308622A SE 381777 B SE381777 B SE 381777B
- Authority
- SE
- Sweden
- Prior art keywords
- procedure
- manufacturing
- electric conductor
- conductor
- electric
- Prior art date
Links
Classifications
-
- H10W70/093—
-
- H10W70/60—
-
- H10W90/00—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26555072A | 1972-06-23 | 1972-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE381777B true SE381777B (sv) | 1975-12-15 |
Family
ID=23010926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7308622A SE381777B (sv) | 1972-06-23 | 1973-06-19 | Forfarande for att framstella en elektrisk ledare |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3801477A (enExample) |
| JP (1) | JPS4957373A (enExample) |
| BE (1) | BE801196A (enExample) |
| CA (1) | CA982699A (enExample) |
| DE (1) | DE2331534A1 (enExample) |
| FR (1) | FR2189873B1 (enExample) |
| GB (1) | GB1416650A (enExample) |
| IT (1) | IT989353B (enExample) |
| NL (1) | NL7308737A (enExample) |
| SE (1) | SE381777B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3983284A (en) * | 1972-06-02 | 1976-09-28 | Thomson-Csf | Flat connection for a semiconductor multilayer structure |
| US4022930A (en) * | 1975-05-30 | 1977-05-10 | Bell Telephone Laboratories, Incorporated | Multilevel metallization for integrated circuits |
| US4188438A (en) * | 1975-06-02 | 1980-02-12 | National Semiconductor Corporation | Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices |
| JP2755594B2 (ja) * | 1988-03-30 | 1998-05-20 | 株式会社 東芝 | セラミックス回路基板 |
| JP4815771B2 (ja) * | 2004-09-01 | 2011-11-16 | 住友電気工業株式会社 | 電気部品の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3495324A (en) * | 1967-11-13 | 1970-02-17 | Sperry Rand Corp | Ohmic contact for planar devices |
| GB1250248A (enExample) * | 1969-06-12 | 1971-10-20 |
-
1972
- 1972-06-23 US US00265550A patent/US3801477A/en not_active Expired - Lifetime
-
1973
- 1973-05-31 CA CA172,813A patent/CA982699A/en not_active Expired
- 1973-06-11 GB GB2766573A patent/GB1416650A/en not_active Expired
- 1973-06-14 FR FR7321708A patent/FR2189873B1/fr not_active Expired
- 1973-06-19 SE SE7308622A patent/SE381777B/xx unknown
- 1973-06-20 BE BE132507A patent/BE801196A/xx unknown
- 1973-06-20 IT IT25675/73A patent/IT989353B/it active
- 1973-06-20 DE DE2331534A patent/DE2331534A1/de active Pending
- 1973-06-22 NL NL7308737A patent/NL7308737A/xx not_active Application Discontinuation
- 1973-06-22 JP JP48071231A patent/JPS4957373A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB1416650A (en) | 1975-12-03 |
| CA982699A (en) | 1976-01-27 |
| US3801477A (en) | 1974-04-02 |
| IT989353B (it) | 1975-05-20 |
| AU5724073A (en) | 1975-01-09 |
| NL7308737A (enExample) | 1973-12-27 |
| DE2331534A1 (de) | 1974-01-17 |
| FR2189873A1 (enExample) | 1974-01-25 |
| JPS4957373A (enExample) | 1974-06-04 |
| FR2189873B1 (enExample) | 1977-09-09 |
| BE801196A (fr) | 1973-10-15 |
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